公开(公告)号：KR100846098B1

公开(公告)日：2008-07-14

申请号：KR1020060098212

申请日：2006-10-10

Applicant: 삼성전자주식회사

Inventor： 강호성 ,  김봉수 ,  김영남 ,  김정수 ,  이기준

IPC: H01L21/02

CPC classification number: H01L22/20 ,  G01N21/9501 ,  H01L22/12

Abstract: 결함 검사 조건 설정 방법에 있어서, 샘플의 레이저 강도 맵을 획득한다. 상기 레이저 강도 맵을 면적 스캐닝(area scanning)하여, 평균 레이저 강도를 획득한다. 그런 다음, 상기 평균 레이저 강도를 기초로 검사 조건을 설정한다. 따라서, 검사 장비에 설정된 레이저 파워는 검사자들에 상관없이 항상 일정한 값이 되므로, 검사 장비의 결함 검출 신뢰도가 대폭 향상된다.

公开(公告)号：KR1020050022470A

公开(公告)日：2005-03-08

申请号：KR1020030060914

申请日：2003-09-01

Applicant: 삼성전자주식회사

Inventor： 이성호 ,  강호성

IPC: H01L21/66

Abstract: PURPOSE: An apparatus for inspecting a wafer is provided to precisely detect all defects on a photoresist layer even when a photoresist layer of various colors is formed on a wafer by changing a light source to a laser source having a wavelength of a different size according to the color of a layer formed on the wafer. CONSTITUTION: A wafer on which a photoresist layer of a predetermined color is formed is placed on a wafer stage. At least one detector is installed in the periphery of the wafer to detect a defect more than a predetermined size generated on the photoresist layer. A laser light source part(110) irradiates a laser beam to the photoresist layer, including a plurality of light sources so that a laser beam of different wavelengths is irradiated according to the color of the photoresist layer. A reflection part(140) reflects the laser beam to a predetermined angle so that the laser beam oscillated from the laser light source part is irradiated to the photoresist layer. A projection optical part(150) magnifies and reduces the laser beam oscillated from the laser light source part by a predetermined magnification. A shutter(120) selectively blocks the laser beam oscillated from the laser light source part.

Abstract translation: 目的：提供一种用于检查晶片的装置，以便即使当通过将光源改变为具有不同尺寸的波长的激光源而在晶片上形成各种颜色的光致抗蚀剂层时，也可精确地检测光致抗蚀剂层上的所有缺陷，根据 在晶片上形成的层的颜色。 构成：将其上形成有预定颜色的光致抗蚀剂层的晶片放置在晶片台上。 至少一个检测器安装在晶片的周边，以检测出在光致抗蚀剂层上产生的超过预定尺寸的缺陷。 激光光源部分（110）将激光束照射到包括多个光源的光致抗蚀剂层，使得根据光致抗蚀剂层的颜色照射不同波长的激光束。 反射部分（140）将激光束反射到预定角度，使得从激光光源部分振荡的激光束照射到光致抗蚀剂层。 投影光学部件（150）将从激光光源部件振荡的激光束放大并缩小预定的倍率。 快门（120）选择性地阻挡从激光光源部分振荡的激光束。

公开(公告)号：KR1020050012619A

公开(公告)日：2005-02-02

申请号：KR1020030051753

申请日：2003-07-26

Applicant: 삼성전자주식회사

Inventor： 전태승 ,  고영민 ,  강호성 ,  노현정

IPC: H01L21/68

Abstract: PURPOSE: An apparatus for supporting a substrate is provided to prevent a loss of channel and improve stability of the stage. CONSTITUTION: A base(210) having a channel(212) is extended in the direction of X-axis, the channel is provided with a step portion(214) formed in the horizontal direction. A stage(220) is provided with a lower structure(222) and a upper structure(224), and a substrate(10) is supported by the upper structure. An air bearing(226) injecting air to the step portion for floating the stage from the step portion is jointed to the stage. The stage is driven by a driving unit(230). A pair of covers(240) preventing impurities from incoming into the step portion of the channel are extended horizontally adjacent to the upper structure of the stage in each side of the channel.

Abstract translation: 目的：提供一种用于支撑衬底的装置，以防止通道损失并提高平台的稳定性。 构成：具有通道（212）的基座（210）在X轴的方向上延伸，通道设置有沿水平方向形成的台阶部（214）。 舞台（220）设置有下部结构（222）和上部结构（224），并且衬底（10）由上部结构支撑。 将台阶部分的空气从踏板部分上浮起来的空气轴承（226）接合在台架上。 舞台由驱动单元（230）驱动。 防止杂质进入通道的台阶部分的一对盖（240）在通道的每一侧水平地延伸到台阶的上部结构。

公开(公告)号：KR1020000067352A

公开(公告)日：2000-11-15

申请号：KR1019990015085

申请日：1999-04-27

Applicant: 삼성전자주식회사

Inventor： 강선진 ,  강호성

IPC: H01L21/68

Abstract: PURPOSE: An apparatus for transferring a semiconductor wafer is provided to shorten a manufacturing time by reducing the time needed to load the semiconductor wafer in a measuring apparatus. CONSTITUTION: An apparatus for transferring a semiconductor wafer(214) comprises a base(210), a rail(212), an arm(216) and a finder(218). The rail has a predetermined length in one direction, established on an upper surface of the base. The arm transfers the semiconductor wafer, moving on the rail. The finder detects a center and a flat zone of the semiconductor wafer loaded by the arm, established on the upper surface of the base to be positioned in the same line as the longitudinal direction of the rail.

Abstract translation: 目的：提供一种用于传送半导体晶片的装置，通过减少在测量装置中加载半导体晶片所需的时间来缩短制造时间。 构造：用于传送半导体晶片（214）的装置包括基座（210），轨道（212），臂（216）和取景器（218）。 轨道在一个方向上具有预定长度，建立在基座的上表面上。 臂转移半导体晶片，在轨道上移动。 取景器检测建立在基座的上表面上的由臂装载的半导体晶片的中心和平坦区域，以定位在与轨道的纵向方向相同的线中。

公开(公告)号：KR1020000013962A

公开(公告)日：2000-03-06

申请号：KR1019980033129

申请日：1998-08-14

Applicant: 삼성전자주식회사

Inventor： 강호성 ,  나병훈

IPC: G08C19/00

CPC classification number: G08C19/00

Abstract: PURPOSE: A data transmission method of a semiconductor manufacturing facility is to transmit the data having each name or label corresponding to kind or quantity of data. CONSTITUTION: A data transmission method of a semiconductor manufacturing facility comprises a terminal(1), a computer server(2), a label allocating part(3) and a facility(4). The label allocating part(3) endows a label to be sorted to the data by a stored program and transmits the labeled data to the computer server(3), if the data from the process or facility(4) is transmitted to the label allocating part(2). Accordingly, an operator receives the data arranged correspondingly to the process or facility(4) through the terminal(1).

Abstract translation: 目的：半导体制造设备的数据传输方法是发送具有与数据种类或数量对应的每个名称或标签的数据。 构成：半导体制造设备的数据传输方法包括终端（1），计算机服务器（2），标签分配部分（3）和设施（4）。 标签分配部分（3）通过存储的程序赋予要被分类到数据的标签，并且如果来自处理或设施（4）的数据被传送到标签分配，则将标记的数据发送到计算机服务器（3） 第2部分）。 因此，操作员通过终端（1）接收对应于处理或设施（4）排列的数据。

公开(公告)号：KR1020070067253A

公开(公告)日：2007-06-28

申请号：KR1020050128331

申请日：2005-12-23

Applicant: 삼성전자주식회사

Inventor： 곽정호 ,  김봉수 ,  김영남 ,  이영선 ,  김지용 ,  강호성

IPC: H01L21/02

CPC classification number: H01L22/26 ,  G06K9/6201 ,  H01L22/10

Abstract: A method for recognizing an image having a fine circuit pattern in a semiconductor manufacture is provided to rapidly manage defects by using plural stored images and reference images. A first stored image being registered is validated(S11). A first reference image, which is formed on an upper of a semiconductor substrate so as to be matched to the first stored image, is validated(S13). The first stored image and the first reference image is compared to each other and then it is checked whether or not a matching ratio of the first stored image and the first reference image is within an error range(S17). When the matching ratio is out of the error range, a (n-1)-th stored image is validated(S19). A (n-1)-th reference image, which is formed on an upper of the semiconductor substrate at a region different from the first reference image so as to be matched to the (n-1)-th stored image, is validated(S21). The (n-1)-th stored image and the (n-1)-th reference image are compared to each other, and then it is checked whether or not a matching ratio of the (n-1)-th stored image and the (n-1) reference image is within an error range(S23). When the matching ratio is out of the error range, an n-th stored image is validated(S27). An n-th reference image, which is formed on an upper of the semiconductor substrate at a region different from the (n-1)-th reference image so as to be matched to the n-th stored image, is validated(S29). The n-th stored image and the n-th reference image are compared to each other, and then it is checked whether or not a matching ratio of the n-th stored and the n-th reference image is within an error range(S31).

Abstract translation: 提供一种在半导体制造中识别具有精细电路图案的图像的方法，以通过使用多个存储的图像和参考图像来快速地管理缺陷。 登录的第一存储图像被验证（S11）。 验证第一参考图像（S13），其形成在半导体衬底的上部以与第一存储图像匹配。 将第一存储图像和第一参考图像彼此进行比较，然后检查第一存储图像和第一参考图像的匹配比率是否在误差范围内（S17）。 当匹配比超出误差范围时，第（n-1）个存储的图像被验证（S19）。 在与第一参考图像不同的区域形成在半导体衬底上的与第（n-1）个存储图像相匹配的第（n-1）个参考图像被验证（ S21）。 将第（n-1）个存储图像和第（n-1）个参考图像彼此进行比较，然后检查第（n-1）个存储图像的匹配比和 （n-1）参考图像在误差范围内（S23）。 当匹配比超出误差范围时，第n个存储的图像被验证（S27）。 第n个参考图像被形成在半导体衬底的与第（n-1）个参考图像不同的区域上，以便与第n个存储的图像匹配的区域上被验证（S29） 。 将第n个存储图像和第n个参考图像相互比较，然后检查第n个存储的和第n个参考图像的匹配比率是否在误差范围内（S31 ）。

公开(公告)号：KR1020030050099A

公开(公告)日：2003-06-25

申请号：KR1020010080491

申请日：2001-12-18

Applicant: 삼성전자주식회사

Inventor： 김용주 ,  강호성

IPC: H01L21/00

Abstract: PURPOSE: A slit valve of semiconductor fabricating equipment is provided to minimize an influence of friction by forming a plurality of bearings on a surface where a support contacts a shaft, and to prevent a pressure unit from being bent or disconnected during a process by making the pressure unit composed of a block of a material having a high degree of strength and a spring for applying pressure to the block. CONSTITUTION: A door plate(450) is prepared. The shaft(420) vertically moves the door plate. A mounting plate(452) couples the door plate to the shaft. The support(410) supports the shaft, fixed to the bottom of the inside of a loadlock chamber(200). The pressure unit(440) applies pressure to the door plate, located between the mounting plate and the shaft. The support supporting the shaft has a bearing(412) on the surface where the support contacts the shaft so that the shaft moves vertically.

Abstract translation: 目的：提供半导体制造设备的狭缝阀，以通过在支撑件接触轴的表面上形成多个轴承来最小化摩擦的影响，并且通过使制造过程中的压力单元在过程中被弯曲或断开， 压力单元由具有高强度的材料块和用于向块施加压力的弹簧构成。 构成：准备了门板（450）。 轴（420）垂直地移动门板。 安装板（452）将门板连接到轴。 支撑件（410）支撑轴，固定到负载锁定室（200）内部的底部。 压力单元（440）对位于安装板和轴之间的门板施加压力。 支撑轴的支撑件在支撑件接触轴的表面上具有轴承（412），使得轴垂直移动。

公开(公告)号：KR1020000019104A

公开(公告)日：2000-04-06

申请号：KR1019980037032

申请日：1998-09-08

Applicant: 삼성전자주식회사

Inventor： 이명섭 ,  박선진 ,  강호성

IPC: H01L21/68

Abstract: PURPOSE: A semiconductor wafer carrier box is provided to stably handle a run sheet by improving an inserting portion into which the run sheet is inserted. CONSTITUTION: A carrier box(1) stably handles a carrier on which a plurality of wafers areloaded. An inserting portion(12) composed a panel with a transparent material is installed on the carrier box(1) because a run sheet(10) is handled with the carrier box(1) when performing a process using the carrier box(10). A damage of the inserting portion(12) is prevented when inserting the run sheet(10) because the inserting portion(12) for inserting the run sheet(10) is formed as the panel of the transparent material. The loss of the run sheet(10) is minimized according to the damage of the inserting portion(12).

Abstract translation: 目的：提供一种半导体晶片载体盒，用于通过改进插入部分来稳定地处理行驶片。 构成：载体箱（1）稳定地处理载有多个晶片的载体。 由于在进行使用载体箱（10）的处理时，在载体箱（1）上处理运行薄片（10），所以在载体箱（1）上安装有由透明材料构成的面板的插入部（12）。 由于插入行程板（10）的插入部分（12）形成为透明材料的面板，因此当插入行程板（10）时，防止了插入部分（12）的损坏。 根据插入部分（12）的损坏，运行片材（10）的损失最小化。

公开(公告)号：KR1020080032697A

公开(公告)日：2008-04-16

申请号：KR1020060098212

申请日：2006-10-10

Applicant: 삼성전자주식회사

Inventor： 강호성 ,  김봉수 ,  김영남 ,  김정수 ,  이기준

IPC: H01L21/02

CPC classification number: H01L22/20 ,  G01N21/9501 ,  H01L22/12

Abstract: A method for setting recipes of a defect test is provided to improve reliability of test equipment by adjusting laser power according to obtained gray level and cumulative pixel distribution. A method for setting recipes of a defect test comprises the steps of: obtaining a laser intensity map of a sample(S110); setting a first area and a second area on the laser intensity map on the laser intensity map(S120); performing an area scanning on each area for obtaining gray levels for each area(S130); obtaining cumulative pixel distribution of the gray levels(S140); and adjusting laser power according to the gray level and cumulative pixel distribution(S150).

Abstract translation: 提供了一种设置缺陷测试配方的方法，以通过根据获得的灰度级和累积像素分布调整激光功率来提高测试设备的可靠性。 用于设定缺陷测试配方的方法包括以下步骤：获得样本的激光强度图（S110）; 在激光强度图上设置激光强度图上的第一区域和第二区域（S120）; 对每个区域执行区域扫描以获得每个区域的灰度级（S130）; 获得灰度级的累积像素分布（S140）; 并根据灰度级和累积像素分布调整激光功率（S150）。

公开(公告)号：KR1020070067254A

公开(公告)日：2007-06-28

申请号：KR1020050128332

申请日：2005-12-23

Applicant: 삼성전자주식회사

Inventor： 강호성 ,  김봉수 ,  김영남

IPC: H01L21/66

Abstract: A monitoring method in a semiconductor manufacturing process is provided to perform a prompt action when a measurement condition is varied, by automatically selecting a map having a map recognition number corresponding to the measurement condition among first to n-th map recognition numbers. To-be-measured chips out of chips arranged on a semiconductor wafer are classified into first to n-th groups(S11). First to n-th map recognition numbers are assigned to the first to n-th groups(S13). A map having a map recognition number corresponding to a measurement condition is automatically selected out of the first to n-th map recognition number(S15). To-be-measured chips placed on the selected map are measured(S17).

Abstract translation: 提供半导体制造过程中的监视方法，通过在第一〜第n映射识别号之间自动选择具有对应于测量条件的映射识别号码的映射，在测量条件变化时执行提示动作。 将排列在半导体晶片上的芯片中的待测芯片分为第一〜第n组（S11）。 第一至第n映射识别号被分配给第一至第n组（S13）。 具有与测量条件相对应的地图识别号码的地图从第一至第n地图识别号码中自动选择（S15）。 测量放置在所选地图上的待测芯片（S17）。