公开(公告)号：KR20210025403A

公开(公告)日：2021-03-09

申请号：KR1020190105414A

申请日：2019-08-27

Applicant: 삼성전자주식회사

Inventor： 배진우 ,  최현주

IPC: G06F13/16 ,  G06F7/76 ,  G06F12/02

CPC classification number: G06F13/1652 ,  G06F12/02 ,  G06F12/023 ,  G06F13/16 ,  G06F7/76 ,  G06F7/764 ,  G06F2212/154

Abstract: 본 개시는 LTE(Long Term Evolution)와 같은 4G(4
th generation) 통신 시스템 이후 보다 높은 데이터 전송률을 지원하기 위한 5G(5
th generation) 또는 pre-5G 통신 시스템에 관련된 것이다. 본 개시의 다양한 실시 예들에 따르면, 무선 통신 시스템에서 기지국의 장치에 있어서, 마스터 FPGA(field programmable gate array); 마스터 FPGA의 제어를 받는 복수의 슬레이브 FPGA들; 및 마스터 FPGA 및 복수의 슬레이브 FPGA들과 연결된 어드레스 마스커를 포함하며, 어드레스 마스커는, 마스터 FPGA에 의하여 각각의 복수의 슬레이브 FPGA들에게 할당된 서로 다른 어드레스 비트들을 수신하고, 서로 다른 어드레스 비트들에 대하여 특정 위치의 비트 값들을 동일한 값으로 마스킹하며, 각각의 복수의 슬레이브 FPGA들에게 대응하는 마스킹된 어드레스 비트들을 송신하도록 구성된 장치가 제공된다.

公开(公告)号：KR1020130049538A

公开(公告)日：2013-05-14

申请号：KR1020110114629

申请日：2011-11-04

Applicant: 삼성전자주식회사

Inventor： 한충호 ,  김상균 ,  이원준 ,  박준상 ,  김예환 ,  배진우 ,  이재동 ,  강경문

IPC: C09K3/14 ,  H01L21/304

CPC classification number: C09K3/1463 ,  C09G1/02 ,  C09K3/1472 ,  H01L27/2436 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/143 ,  H01L45/144 ,  H01L45/148 ,  H01L45/1683

Abstract: PURPOSE: A slurry composition is provide to improve polishing rate of a phase change material and to prevent re-absorption of the phase change material to a pattern layer of the phase change material, thereby improving performance of a phase change memory device. CONSTITUTION: A slurry composition for polishing comprises a first absorption inhibitor which contains a polishing agent, oxidant, and polyethyleneoxide-based copolymer. The slurry composition comprises the first absorption inhibitor which has an abrasive agent, oxidant, ethylene oxide, and propylene oxide as repeating units; and a second absorption inhibitor containing an anionic surfactant which can be coupled with the first absorption inhibitor. The first absorption inhibitor is represented by chemical formula 1. In chemical formula 1, n is an integer from 1-500 and m is an integer from 1-300.

Abstract translation: 目的：提供一种浆料组合物以改善相变材料的抛光速率并防止相变材料再次吸收到相变材料的图案层，从而提高相变存储器件的性能。 构成：用于抛光的浆料组合物包含含有抛光剂，氧化剂和聚环氧乙烷的共聚物的第一吸收抑制剂。 浆料组合物包含具有研磨剂，氧化剂，环氧乙烷和环氧丙烷作为重复单元的第一吸收抑制剂; 和含有可与第一吸收抑制剂偶联的阴离子表面活性剂的第二吸收抑制剂。 第一吸收抑制剂由化学式1表示。在化学式1中，n为1-500的整数，m为1-300的整数。

公开(公告)号：KR1020120095693A

公开(公告)日：2012-08-29

申请号：KR1020110015165

申请日：2011-02-21

Applicant: 삼성전자주식회사

Inventor： 배진우 ,  황인석 ,  한명식 ,  박세정 ,  조성민 ,  고영호 ,  홍의관

IPC: H01L21/304

CPC classification number: H01L21/31053 ,  H01L21/76819

Abstract: PURPOSE: A semiconductor device having a planarized insulation layer and a forming method thereof are provided to prevent first and second planarized insulation layers from being damaged by preventing a physical stress from being applied to a stress concentration area of a first insulation layer. CONSTITUTION: A substrate(100) having a first section(A) and a second section(B) adjacent each other. A structure(110) is formed on the top of the substrate within the first section. A first insulation layer is formed on the substrate having the structure. The first insulation layer comprises a first top surface, an inclined side wall(130S), and a second top surface(130TB). A second insulation layer is formed on the first insulation layer.

Abstract translation: 目的：提供一种具有平坦化绝缘层及其形成方法的半导体器件，以通过防止物理应力施加到第一绝缘层的应力集中区域来防止第一和第二平坦化绝缘层受损。 构成：具有彼此相邻的第一部分（A）和第二部分（B）的基底（100）。 在第一部分内的基板的顶部上形成结构（110）。 在具有该结构的基板上形成第一绝缘层。 第一绝缘层包括第一顶表面，倾斜侧壁（130S）和第二顶表面（130TB）。 在第一绝缘层上形成第二绝缘层。

公开(公告)号：KR1020120014322A

公开(公告)日：2012-02-17

申请号：KR1020100076298

申请日：2010-08-09

Applicant: 삼성전자주식회사

Inventor： 김현숙 ,  오도석 ,  배진우 ,  이철호

IPC: F21V14/04 ,  F21V7/22 ,  F21Y101/02

CPC classification number: F21V14/04 ,  F21K9/68 ,  F21K9/69 ,  F21V7/22 ,  F21Y2101/00

Abstract: PURPOSE: A lighting apparatus is provided to control the intensity and direction of light, thereby providing the lighting apparatus which is able to be used for various purposes. CONSTITUTION: One or more light sources(10) are mounted on a substrate(20). A plurality of reflectors(30) is arranged along the boundary of the substrate. The reflectors control the direction of light. The reflectors are arranged by being partially overlapped with each other in the same direction as the adjacent other reflectors. A transparent lens for controlling light direction is placed on the upper surface of the light sources.

Abstract translation: 目的：提供照明装置来控制光的强度和方向，从而提供能够用于各种目的的照明装置。 构成：将一个或多个光源（10）安装在基板（20）上。 多个反射器（30）沿着基板的边界布置。 反射器控制光的方向。 反射器通过在与相邻的其它反射器相同的方向上彼此部分重叠而布置。 用于控制光线的透明透镜放置在光源的上表面上。

公开(公告)号：KR1020120000739A

公开(公告)日：2012-01-04

申请号：KR1020100061165

申请日：2010-06-28

Applicant: 삼성전자주식회사

Inventor： 배진우 ,  정욱철

IPC: H01L33/64 ,  H01L23/36

CPC classification number: H01L33/642 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0075

Abstract: PURPOSE: An LED module and a manufacturing method thereof are provided to embody an excellent protection against heat by spreading thermal conduction paste consisting of heat transfer matter having high thermal conductance on a contact surface of a heat sink and a heat slug. CONSTITUTION: A step type LED package(100) comprises a heat slug(140) and a terminal(150) in which a heat which is created in an LED chip(130) is transferred. A resin material PCB(200) has a thickness corresponding to level difference of the heat slug and the terminal of the LED package. The resin material PCB is electrically connected to the terminal of the LED package. A heat sink(300) directly contacts the heat slug of the LED package through a penetration hole(210) of the resin material PCB. Thermal conduction paste(400) is spread on a contact surface of the heat sink and the heat slug.

Abstract translation: 目的：提供一种LED模块及其制造方法，通过将由导热性高的传热物质构成的导热膏扩散到散热片和散热片的接触面上，具有良好的耐热保护性。 构成：步进式LED封装（100）包括散热块（140）和终端（150），其中在LED芯片（130）中产生的热量被传送。 树脂材料PCB（200）具有对应于散热片和LED封装端子的电平差的厚度。 树脂材料PCB电连接到LED封装的端子。 散热器（300）通过树脂材料PCB的穿透孔（210）直接接触LED封装的散热块。 导热膏（400）散布在散热片和散热片的接触表面上。

公开(公告)号：KR101713059B1

公开(公告)日：2017-03-08

申请号：KR1020110007318

申请日：2011-01-25

Applicant: 삼성전자주식회사

Inventor： 정욱철 ,  배진우

IPC: F21V15/01 ,  F21V23/00 ,  F21V29/507 ,  F21V29/71 ,  F21V29/76 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: F21V23/009 ,  F21V15/01 ,  F21V29/507 ,  F21V29/713 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: 발광소자조명장치가개시된다. 개시된발광소자조명장치는배치된격벽에의해제1공간과제2공간으로구분되는하우징과, 상기하우징에서상기격벽의제1면상으로배치되며, 상기제1면상의인쇄회로기판과상기인쇄회로기판상의복수의발광소자칩들을구비한발광소자모듈과, 상기하우징내에서상기제1면과마주보는상기격벽의제2면상으로배치되어서상기발광소자모듈에전압을공급하는전압공급부를포함한다.

Abstract translation: 发光装置照明装置包括具有限定第一空间和壳体中的第二空间的阻挡壁（112）的壳体（110） 设置在所述阻挡壁的第一表面（112a）上并且包括设置在所述第一表面上的印刷电路板（PCB）（122）和多个发光器件芯片（124）的发光器件模块（120） 布置在PCB上; 以及设置在所述阻挡壁的第二表面（112b）上的电源（130），所述第二表面面向所述第一表面，并且用于向所述发光器件模块施加电压。

公开(公告)号：KR1020160134927A

公开(公告)日：2016-11-24

申请号：KR1020150066801

申请日：2015-05-13

Applicant: 삼성전자주식회사

Inventor： 박종혁 ,  권병호 ,  김인호 ,  박혜성 ,  배진우 ,  이양희 ,  황인석

IPC: H01L21/027 ,  H01L21/304 ,  H01L27/108

CPC classification number: H01L27/10855 ,  H01L22/30 ,  H01L22/34 ,  H01L27/10814 ,  H01L27/10817 ,  H01L27/10823 ,  H01L27/10876

Abstract: 반도체소자의제조방법을제공한다. 방법은, 두개의제1 영역들및 그사이의제2 영역을포함하는기판에서, 제1 영역들각각에제1 패턴을형성하되, 제1 패턴들에의해제2 영역에서기판및 제1 패턴들로정의되는단차부가발생하고, 제1 영역들에제2 패턴들을형성하는동안단차부에더미패턴을형성하는것을포함한다. 더미패턴에의해후속물질막연마공정에서공정단가를감소시키고연마두께산포를개선할수 있다.

Abstract translation: 制造半导体器件的方法包括提供包括一对第一区域和其间的第二区域的衬底，在相应的第一区域上形成第一图案以至少部分地限定第二区域的阶梯部分，并且形成虚设图案， 至少部分地填充逐步部分。 虚拟图案可以是电浮置结构。 伪图案可以形成为在相应的第一区域上形成第二图案的一部分，并且虚设图案和第二图案可以包括基本上共同的材料。 由于虚拟图案至少部分地填充第二区域的逐步部分，所以覆盖第二图案和虚设图案的材料层可以省略相应的逐步部分。

公开(公告)号：KR1020120100303A

公开(公告)日：2012-09-12

申请号：KR1020110019106

申请日：2011-03-03

Applicant: 삼성전자주식회사

Inventor： 박정현 ,  배진우 ,  이철호

IPC: H05K1/18 ,  H01L33/00 ,  F21Y101/02

Abstract: PURPOSE: A printed circuit board, a light emitting module with the printed circuit board, a light unit with the light emitting module, and a method of manufacturing the light emitting module are provided to make a light source to directly contact a heat emitting board, thereby increasing heat emitting performance. CONSTITUTION: A metal copper foil laminate plate(110) is formed by laminating an insulating layer(113) and a resin coating copper foil(112) on a heat emitting board. The metal copper foil laminate plate includes at least one groove. A portion of the resin coating copper foil is cut and the cut portion is mounted on the groove. The light source is bonded with the heat emitting board. The heat emitting board is made of copper.

Abstract translation: 目的：提供印刷电路板，具有印刷电路板的发光模块，具有发光模块的光单元和制造发光模块的方法，以使光源直接接触散热板， 从而增加散热性能。 构成：通过在绝缘层（113）和树脂被覆铜箔（112）上层叠发热板而形成金属铜箔层压板（110）。 金属铜箔层压板包括至少一个槽。 切割树脂被覆铜箔的一部分，将切断部安装在槽上。 光源与发光板接合。 发热板由铜制成。

公开(公告)号：KR1020120065223A

公开(公告)日：2012-06-20

申请号：KR1020110100146

申请日：2011-09-30

Applicant: 삼성전자주식회사

Inventor： 김진성 ,  강규철 ,  배진우 ,  이철호 ,  추종양

IPC: G01R31/40 ,  H05B37/02

CPC classification number: G01R31/40 ,  F21V23/004 ,  H05B33/0818 ,  H05B37/02 ,  Y02B20/42

Abstract: PURPOSE: A system and method for manufacturing a power supply device, and a flicker measuring device are provided to easily manufacture a power supply unit by packing the power supply unit which is determined as a normal state. CONSTITUTION: A system for manufacturing a power supply unit includes a power supply unit manufacturing apparatus(110), a first test apparatus(120), a second test apparatus(140), and a packing apparatus(160). The power supply unit manufacturing apparatus provides a power supply unit. The power supply unit supplies a dimming signal to one or more light sources. The first test apparatus tests an electric property of the power supply unit. The second test apparatus measures a flicker of the light source by detecting light emitted from the light source. The second test apparatus tests the status of the power supply unit according to the flicker measurement result. The packing apparatus packs the power supply unit which is determines as a normal state by the first test apparatus and the second test apparatus.

Abstract translation: 目的：提供一种用于制造电源装置的系统和方法以及闪烁测量装置，用于通过打包确定为正常状态的电源单元容易地制造电源单元。 构成：用于制造电源单元的系统包括电源单元制造装置（110），第一测试装置（120），第二测试装置（140）和包装装置（160）。 供电单元制造装置提供电源单元。 电源单元向一个或多个光源提供调光信号。 第一测试装置测试电源单元的电气特性。 第二测试装置通过检测从光源发出的光来测量光源的闪烁。 第二测试设备根据闪烁测量结果测试电源单元的状态。 包装设备将由第一测试设备和第二测试设备确定为正常状态的电源单元进行打包。

公开(公告)号：KR1020120064972A

公开(公告)日：2012-06-20

申请号：KR1020100126253

申请日：2010-12-10

Applicant: 삼성전자주식회사

Inventor： 김진성 ,  강규철 ,  배진우 ,  이철호 ,  추종양

IPC: G01R31/40 ,  G01R31/26 ,  H05B33/08

CPC classification number: G01R31/40 ,  G01R31/2635 ,  H05B33/089

Abstract: PURPOSE: A test apparatus for a power supply unit is provided to sense and quantitatively analyze the abnormality of power supply to a light emitting diode by sensing the flickering of light generated from the light emitting diode. CONSTITUTION: A test apparatus(1) for a power supply unit includes a body unit(10) and a test unit(20). The body unit includes a light emitting diode insertion space and provides a testing environment which inspects the status of power supply applied to the light emitting diode. The test unit is installed inside the body unit in order to face the light emitting diode. The test unit senses the flickering of the light emitting diode which is generated in case of abnormal power supply.

Abstract translation: 目的：提供一种用于电源单元的测试装置，用于通过感测从发光二极管产生的光的闪烁来感测和定量分析对发光二极管的电源异常。 构成：用于电源单元的测试装置（1）包括主体单元（10）和测试单元（20）。 身体单元包括发光二极管插入空间，并提供检测施加到发光二极管的电源状态的测试环境。 测试单元安装在机身单元内，以面对发光二极管。 测试单元感测在异常电源的情况下产生的发光二极管的闪烁。