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公开(公告)号:WO2022197055A1
公开(公告)日:2022-09-22
申请号:PCT/KR2022/003565
申请日:2022-03-15
Applicant: 삼성전자주식회사
Abstract: 다층으로 형성되는 다층 열전 모듈 및 이의 제조방법이 개시된다. 다양한 실시 예에 따르면, 다층 열전 모듈은 중간기판, 제1 열전부재, 제2 열전부재 및 말단기판을 포함한다. 그 외에도 다양한 실시 예들이 가능하다.
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公开(公告)号:KR1020170119237A
公开(公告)日:2017-10-26
申请号:KR1020160047161
申请日:2016-04-18
Applicant: 삼성전자주식회사
Abstract: 본발명은전도성필름층과프레임을초음파접합방법을이용하여전자파차폐효과를극대화하기위한쉴딩케이스및 그제조방법이개시된다. 인쇄회로기판에실장된금속프레임; 및금속프레임의상부를덮는전도성필름;을포함하며, 전도성필름은금속프레임의상단부를따라초음파접합되는것을특징으로한다.
Abstract translation: 本文公开了一种用于通过使用导电膜层和框架之间的超声波接合方法来最大化电磁波屏蔽效果的屏蔽壳及其制造方法。 安装在印刷电路板上的金属框架; 以及覆盖金属框架的上部的导电膜,其中导电膜沿着金属框架的上端超声结合。
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公开(公告)号:KR1020150131495A
公开(公告)日:2015-11-25
申请号:KR1020140058171
申请日:2014-05-15
Applicant: 삼성전자주식회사
Abstract: 본발명의다양한실시예에따르면, 탐침장치는, 배치된기판을지지하는기판지지부와, 상기배치된기판을탐침하는프로브와, 상기배치된기판의탐침지점에상기프로브를배치하는탐침로봇과, 상기탐침로봇에고정되어상기탐침지점을촬영하는카메라부와, 상기탐침로봇에고정되어상기기판의높이를측정하는측정부, 및상기카메라부의촬영영상과상기측정부의측정높이에따라상기프로브를제어하는제어부를포함할수 있다. 또한다른실시예가가능하다.
Abstract translation: 提供了能够精确地确定探针对象的探针位置的探针装置及其操作方法。 根据本发明的各种实施例,探针装置包括:用于支撑布置的基板的基板支撑单元; 用于探测布置的衬底的探针; 用于将探针布置在所布置的基底的探针点上的探针机器人; 摄像机单元,用于拍摄探针点,其中相机单元固定到探针机器人; 用于测量所述基板的高度的测量单元,其中所述测量单元固定到所述探针机器人; 以及控制单元,用于根据由照相机单元拍摄的图像和由测量单元测量的高度来控制探针。 此外,其它实施例也是可能的。
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公开(公告)号:KR1020140039680A
公开(公告)日:2014-04-02
申请号:KR1020120106179
申请日:2012-09-25
Applicant: 삼성전자주식회사
Abstract: According to a method of measuring an overlay, a first image of a first overlay key is obtained. A first intensity profile of the first image is measured. A second image of a second overlay key is obtained. A second intensity profile of the second image is measured. The second intensity profile is corrected in order to make the first intensity profile match the second intensity profile. An overlay is obtained by the corrected second intensity profile and the first intensity profile. Therefore, a misalignment value of the overlay keys can be accurately calculated by inversely correcting the profile of the overlay key. [Reference numerals] (AA) Start; (BB) End; (ST100) Obtain a first image of a first overlay key; (ST110) Measure a first intensity profile of the first image; (ST120) Obtain a second image of a second overlay key; (ST130) Measure a second intensity profile of the second image; (ST140) Calculate NIC values by analyzing the contrast of each pixel of the first image and the second image; (ST150) Calculate entire NIC values of all overlay patterns of the first overlay key and the second overlay key; (ST160) Process the second image by using the corrected second profile; (ST170) Obtain a first misalignment value between the first overlay key and the second overlay key from the NIC values; (ST180) Obtain a second misalignment value by performing the ST100 to ST170 to a third overlay key and a fourth overlay key; (ST190) Measure the overlay from the first misalignment value and the second misalignment value
Abstract translation: 根据测量覆盖的方法,获得第一覆盖键的第一图像。 测量第一图像的第一强度分布。 获得第二覆盖键的第二图像。 测量第二图像的第二强度分布。 校正第二强度分布以使第一强度分布匹配第二强度分布。 通过校正的第二强度分布和第一强度分布获得覆盖。 因此,可以通过逆向校正覆盖键的轮廓来精确地计算覆盖键的未对准值。 (附图标记)(AA)开始; (BB)结束; (ST100)获取第一重叠键的第一图像; (ST110)测量第一图像的第一强度分布; (ST120)获取第二覆盖键的第二图像; (ST130)测量第二图像的第二强度分布; (ST140)通过分析第一图像和第二图像的每个像素的对比度来计算NIC值; (ST150)计算第一覆盖键和第二覆盖键的所有覆盖图案的整个NIC值; (ST160)通过使用校正的第二轮廓来处理第二图像; (ST170)从NIC值获取第一重叠键和第二覆盖键之间的第一未对准值; (ST180)通过将ST100〜ST170执行到第三覆盖键和第四覆盖键,获得第二未对准值; (ST190)从第一个未对准值和第二个未对准值测量叠加
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