Abstract:
자기 메모리 장치는 셀 선택 트랜지스터와 자기터널접합(MTJ)을 포함할 수 있다. 자기터널접합의 하부 전극은 수평부 및 수평부의 측면에서 연결되는 수직부를 포함할 수 있다. 하부 전극의 수직부는 수평부의 상면보다 높고, 적어도 평행한 두 변과, 이들에 대해 경사진 한 변을 포함하는 상면을 포함할 수 있다. 하부 전극의 수직부 상에 자기터널접합이 배치될 수 있다.
Abstract:
PURPOSE: A magnetic memory device is provided to prevent a breakdown path due to oxygen in a tunnel barrier layer by including a stress generation layer to transmit stress to the tunnel barrier layer. CONSTITUTION: A gate structure(20) is formed on a substrate(10). A magnetic memory layer(60) functions as a memory by magnetoresistance. The magnetic memory layer includes a plurality of magnetic layers(62,64) and a tunnel barrier layer(66) interposed between the magnetic layers. A bottom electrode(50) and a top electrode(80) are located on both sides of the magnetic memory layer. A stress generating layer(70) is located between the top electrode and the magnetic memory layer and applies stress to the tunnel barrier layer.
Abstract:
A magnetic memory device and a method for manufacturing the same are provided. The magnetic memory device comprises: lower magnetic patterns arranged in a first direction and a second direction perpendicular to each other on a substrate; an upper magnetic film which commonly covers at least two lower magnetic patterns arranged in the first direction and at least two lower magnetic patterns arranged in the second direction; and a tunnel barrier film interposed between the lower magnetic patterns and the upper magnetic film.
Abstract:
A magnetic memory device is provided. Memory cells on a substrate and bit lines on the memory cells are provided. Each of the memory cells comprises: a free layer which is separated from free layers of adjacent memory cells by an interlayer insulating film on the substrate; a tunnel insulating film on the free layer; and a reference layer which is provided on the tunnel insulating layer and extends onto the free layers of the adjacent memory cells along the bit lines.