Abstract:
신규한 신너 조성물 및 이 신너 조성물을 사용하여 기판 상에 도포되어 있는 포토레지스트를 스트리핑하는 방법이 개시되어 있다. 상기 신너 조성물은 노말 부틸 아세테이트 8 내지 95중량%, 감마-부티로 락톤 0.1 내지 13중량% 및 비아세트산 에스테르 화합물 3 내지 80중량%로 이루어진다. 또한, 상기 신너 조성물은 노말 부틸 아세테이트 42 내지 90중량%, 감마-부티로 락톤 1 내지 13중량% 및 다가 알코올 유도체 5 내지 45중량%로 이루어질 수도 있다. 그리고, 상기 신너 조성물을 사용하여 기판 에지와 이면 부위에 도포되어 있는 포토레지스트를 선택적으로 스트립핑할 수 있다. 또한, 상기 신너 조성물을 사용하여 기판 전면에 도포되어 있는 포토레지스트를 스트립핑할 수도 있다. 저렴한 비용의 신너 조성물을 사용하여 다양한 종류의 포토레지스트를 스트립핑할 수 있다.
Abstract:
PURPOSE: A cleansing solution and a removing method of an organic component using the solution are provided, to remove photoresist and/or a cured antireflection coating component from a wafer effectively. CONSTITUTION: The cleansing solution comprises 5-30 wt% of an ammonium hydroxide salt; 23-70 wt% of an organic solvent; and 10-50 wt% of water. Preferably the ammonium hydroxide salt is selected from the group consisting of (NH3OH)2SO4, NH3OHCl, NH3OHNO3 and (NH3OH)PO4; and the organic solvent is at least one selected from the group consisting of acetone, acetonitrile and methyl isobutyl ketone. The method for removing an organic component comprises the steps of coating an organic component on a semiconductor wafer loaded in a certain equipment; separating the equipment and dipping it into the cleansing solution; and rising and drying the equipment.
Abstract:
PURPOSE: A method for manufacturing a semiconductor device is provided to be capable of enhancing the alignment between a photoresist layer pattern of a sub chuck and a main chuck without being affected by a flow process of a photoresist layer. CONSTITUTION: First, a lower interlayer insulating layer(11) is formed on a semiconductor layer(10), and then a photoresist layer pattern of which an aperture is arranged on a defined area is formed thereon. Then, an etching hole of the lower interlayer insulating layer corresponding to the aperture is formed as a main chuck using the photoresist layer pattern. Next, an upper interlayer insulating layer(15) is formed on the semiconductor layer(10) and the lower interlayer insulating layer(11) within the etching hole. Finally, a photoresist layer pattern(19) of trench type having an aperture(18) overlapped with the etching hole is formed on the upper interlayer insulating layer(15) as a sub chuck.
Abstract:
신규한 신너 조성물 및 이 신너 조성물을 사용하여 기판 상에 도포되어 있는 포토레지스트를 스트리핑하는 방법이 개시되어 있다. 상기 신너 조성물은 노말 부틸 아세테이트 8 내지 95중량%, 감마-부티로 락톤 0.1 내지 13중량% 및 비아세트산 에스테르 화합물 3 내지 80중량%로 이루어진다. 또한, 상기 신너 조성물은 노말 부틸 아세테이트 42 내지 90중량%, 감마-부티로 락톤 1 내지 13중량% 및 다가 알코올 유도체 5 내지 45중량%로 이루어질 수도 있다. 그리고, 상기 신너 조성물을 사용하여 기판 에지와 이면 부위에 도포되어 있는 포토레지스트를 선택적으로 스트립핑할 수 있다. 또한, 상기 신너 조성물을 사용하여 기판 전면에 도포되어 있는 포토레지스트를 스트립핑할 수도 있다. 저렴한 비용의 신너 조성물을 사용하여 다양한 종류의 포토레지스트를 스트립핑할 수 있다.
Abstract:
PURPOSE: A composition for forming anti-reflective light absorbing layer and a method for forming the pattern of a semiconductor device by using the composition are provided, to enable both photoresist layer and anti-reflective layer to be developed after the exposure of the photoresist layer, thereby omitting the removing process of the anti-reflective layer by etching. CONSTITUTION: The composition comprises a polymer having a (meth)acrylate repeating unit; 10-60 wt% of a diazoquinone-based light absorbing group chemically combined with the (meth)acrylate repeating unit; 0.1-1.0 wt% of a photoacid generator; 4-20 wt% of a crosslinking agent which crosslinks the polymer by heat and is de-crosslinked from the crosslinked polymer by an acid; and 0.1-1.0 wt% of a catalyst for promoting the crosslinking of the polymer. Preferably the polymer has the light absorbing repeating unit represented by the formula 4, wherein R1 is H or a methyl group; and D is a light absorbing group; and the light absorbing group is any one represented by the formula 1.
Abstract:
PURPOSE: A method is provided to strip various photoresists by using an inexpensive thinner composition having an excellent stripping property in a rework process and an EBR process. CONSTITUTION: The method contains the steps of: preparing the thinner composition, wherein the thinner composition comprises an acetic acid ester compound, a gamma-butyrolactone, and a non-acetate type ester compound or the thinner composition comprises an acetic acid ester compound, a gamma-butyrolactone, and a polyalcohol derivative; rotating a substrate coated with a photoresist at a first velocity and spraying the thinner composition on the substrate; and drying the thinner composition.
Abstract:
A cleaning solution for a cured anti-reflective layer (AFC layer) component and a method of cleaning an anti-reflective layer component by using the same, wherein the cleaning solution comprises about 5-30% by weight of ammonium hydroxide, about 23-70% by weight of an organic solvent and about 10-50% by weight of water. When an organic material is spattered to adjacent equipment during implementing a coating process onto a wafer, the equipment is detached and then is dipped into the cleaning solution. Thereafter, the equipment is rinsed and dried. Cured and non-cured organic materials are advantageously removed. Cured organic materials left for a period of time, particularly anti-reflective layer components are advantageously removed.
Abstract:
PURPOSE: Provided are a thinner composition and a method for stripping photoresist applied using the same, thereby it is possible to strip various kinds of photoresists applied on a substrate. CONSTITUTION: The thinner composition comprises 8 to 95 wt% of acetic acid ester compound, 0.1 to 13 wt% of gamma-butyro lactone and 3 to 80 wt% of a non-acetic acid ester compound. The acetic acid ester compound is at least one selected from the group consisting of normal butyl acetate, amyl acetate, ethyl acetoacetate and isopropyl acetate. The non-acetic acid ester compound is at least one selected from the group consisting of ethyl lactate, ethyl-3-ethoxy propionate and methyl-3-methoxy propionate. Also, the composition may comprise 42 to 90 wt% of normal butyl acetate, 1 to 13 wt% of gamma-butyro lactone and 5 to 45wt% of a polyol derivative.
Abstract:
PURPOSE: A photosensitive polyimide enhanced contrast is provided, which is possible multistep process to enhance the contrast of exposure part and non-exposure part. CONSTITUTION: The photosensitive polyimide enhanced contrast is characterized that; the pattern part as non-exposure part forms by reacting base polymer with photoactive compound; exposure part among the pattern part is dissolved by alkaline developer after carrying out deblocking reaction and exposure; the film is formed, which is comprised of polybenzoxazole the pattern part after photo active compound is divided.