반도체 장치
    1.
    发明公开
    반도체 장치 审中-实审
    半导体器件

    公开(公告)号:KR1020160096907A

    公开(公告)日:2016-08-17

    申请号:KR1020150018562

    申请日:2015-02-06

    Abstract: 트랜지스터에서발생하는열 발산을용이하게하여, 동작성능및 신뢰성을개선을할 수있는반도체장치를제공하는것이다. 상기반도체장치는기판상에순차적으로적층된제1 하부패턴과제1 상부패턴을포함하는제1 핀형패턴으로, 상기제1 상부패턴은제1 부분과, 상기제1 부분의양측에배치되는제2 부분을포함하는제1 핀형패턴, 상기제1 부분상에, 상기제1 핀형패턴과교차하는게이트전극, 및상기제2 부분상의소오스/드레인을포함하고, 상기제1 상부패턴에포함된불순물의농도는상기제1 하부패턴에포함된불순물의농도및 상기기판에포함된불순물의농도보다크고, 상기제1 하부패턴에포함된불순물의농도는상기기판에포함된불순물의농도와다르다.

    Abstract translation: 本发明的目的是提供能够提高操作性能和可靠性以有效地排出在晶体管中产生的热量的半导体器件。 半导体器件包括:第一引脚型图案,包括依次层压在基板上的第一下图案和第一上图案,其中第一上图案包括布置在第一部分两侧的第一部分和第二部分; 与所述第一部分上的所述第一引脚型图案相互作用的栅电极; 以及第二部分的源/漏。 包含在第一上部图案中的杂质的浓度大于包含在第一下部图案中的杂质的浓度和包含在基底中的杂质的浓度。 包含在第一下部图案中的杂质的浓度不同于衬底中包含的杂质的浓度。

    이미지 센서, 그 제조 방법, 및 상기 이미지 센서를 포함하는 장치
    2.
    发明公开
    이미지 센서, 그 제조 방법, 및 상기 이미지 센서를 포함하는 장치 无效
    图像传感器,其制造方法和包含图像传感器的装置

    公开(公告)号:KR1020110077451A

    公开(公告)日:2011-07-07

    申请号:KR1020090134039

    申请日:2009-12-30

    Abstract: PURPOSE: An image sensor, a manufacturing method thereof, and a device including the same are provided to improve reliability by preventing the deterioration of a saturation level of a sensor array due to moisture absorption. CONSTITUTION: A photoelectric conversion device(120) is formed on a substrate(110). A wiring structure(140) is formed on the substrate and includes an inter metal dielectric(130) and multilayered metal wirings. A cavity(150) passes through the wiring structure by corresponding to the photoelectric conversion device. An anti moisture absorption layer(160) is conformally formed on a cavity of the wiring structure and the upper side of the wiring structure. A light guide unit is formed on the anit moisture absorption layer and includes light transmission materials for filling the cavity. The anti moisture preventing layer are formed on both sidewalls and bottom of the cavity and the upper side of the inter metal dielectric.

    Abstract translation: 目的:提供一种图像传感器及其制造方法以及包括该图像传感器的装置,通过防止由吸湿引起的传感器阵列的饱和度的劣化来提高可靠性。 构成:在基板(110)上形成光电转换装置(120)。 布线结构(140)形成在基板上,并且包括金属间电介质(130)和多层金属布线。 空穴(150)对应于光电转换装置通过布线结构。 防水吸湿层(160)共形地形成在布线结构的空腔和布线结构的上侧。 导光单元形成在烟雾吸收层上,并且包括用于填充空腔的透光材料。 防潮层形成在空腔的两个侧壁和底部以及金属间电介质的上侧。

    반도체 소자의 제조 방법
    3.
    发明公开
    반도체 소자의 제조 방법 无效
    制造半导体器件的方法

    公开(公告)号:KR1020080049333A

    公开(公告)日:2008-06-04

    申请号:KR1020060119773

    申请日:2006-11-30

    CPC classification number: G03F7/42 G03F7/0045 H01L21/265

    Abstract: A method for manufacturing a semiconductor device is provided to reduce a hardness degree of a photoresist pattern by using the photoresist pattern including a calixarene derivative as an ion implantation mask. An isolation layer(102) is formed on a semiconductor substrate in order to define an active region and a field region. A gate oxide layer is formed on the active region. A conductive layer is formed on the substrate. A silicon nitride layer is formed on the conductive layer. A photoresist layer including a calixarene derivative is formed on the silicon nitride layer. A photoresist pattern is formed on the silicon nitride layer. A gate structure(110) is formed by etching the silicon nitride layer, the conductive layer, and the gate oxide layer. A source/drain(112) is formed under a surface of the photoresist pattern.

    Abstract translation: 提供一种制造半导体器件的方法,通过使用包括杯芳烃衍生物的光致抗蚀剂图案作为离子注入掩模来降低光致抗蚀剂图案的硬度。 隔离层(102)形成在半导体衬底上以便限定有源区和场区。 在有源区上形成栅氧化层。 在基板上形成导电层。 在导电层上形成氮化硅层。 在氮化硅层上形成包含杯芳烃衍生物的光致抗蚀剂层。 在氮化硅层上形成光刻胶图形。 通过蚀刻氮化硅层,导电层和栅极氧化物层形成栅极结构(110)。 源极/漏极(112)形成在光致抗蚀剂图案的表面下方。

    반도체 장치 및 이의 제조 방법
    6.
    发明公开
    반도체 장치 및 이의 제조 방법 审中-实审
    半导体装置及其制造方法

    公开(公告)号:KR1020170062079A

    公开(公告)日:2017-06-07

    申请号:KR1020150167475

    申请日:2015-11-27

    Abstract: 게이트전극과다른노드사이의기생정전용량을줄여줌으로써, 동작특성을향상시킬수 있는반도체장치를제공하는것이다. 상기반도체장치는액티브영역과, 상기액티브영역에바로인접하는필드영역을포함하는기판, 상기액티브영역의상기기판으로부터돌출된제1 핀형패턴, 상기기판상에, 상기제1 핀형패턴과교차하고, 제1 부분과제2 부분을포함하는제1 게이트전극으로, 상기제1 부분은상기제1 핀형패턴과교차하는제1 게이트전극, 상기기판상에, 상기제1 핀형패턴과교차하고, 제3 부분과제4 부분을포함하는제2 게이트전극으로, 상기제4 부분은상기제2 부분과마주하고, 상기제3 부분은상기제1 핀형패턴과교차하고상기제1 부분과마주하는제2 게이트전극, 상기기판상에, 상기제1 부분과상기제3 부분사이에배치되고, 제1 유전상수를갖는제1 층간절연구조체, 및상기기판상에, 상기제2 부분과상기제4 부분사이에배치되고, 상기제1 유전상수와다른제2 유전상수를갖는제2 층간절연구조체를포함한다.

    Abstract translation: 并且能够通过降低栅电极和另一节点之间的寄生电容来改善工作特性的半导体器件。 所述半导体器件包括:衬底,所述衬底包括有源区和与所述有源区紧邻的场区;第一鳍状图案,从所述有源区的衬底突出; 所述第一部分突出的第一栅电极,所述第一部分是第一栅电极,在所述基板上,并与第一销形图案,所述第三部分交叉的第销形图案,包括两个部分 第二栅电极,包括第四部分,所述第四部分面向所述第二部分,所述第三部分与所述第一鳍状图案相交并面向所述第一部分, 基板,其被设置在所述第一部分和第三部分,所述第一在第一层间绝缘结构,并具有介电常数,其被布置在所述第二部分与所述第四部分之间的衬底之间的 ,具有与第一介电常数不同的第二介电常数的第二层间绝缘结构 它包括。

    에이징에 따른 공정 산포를 고려한 회로 설계 방법 및 시뮬레이션 방법
    7.
    发明公开
    에이징에 따른 공정 산포를 고려한 회로 설계 방법 및 시뮬레이션 방법 审中-实审
    考虑老化引起的过程色散的电路设计方法和仿真方法

    公开(公告)号:KR1020170043371A

    公开(公告)日:2017-04-21

    申请号:KR1020150143048

    申请日:2015-10-13

    CPC classification number: G06F17/5036 G06F17/505 G06F17/5068 G06F2217/76

    Abstract: 에이징에따른공정산포를고려한회로설계방법및 시뮬레이션방법이개시된다. 본발명의기술적사상의일측면에따른회로설계방법은, 본발명의기술적사상의일측면에따른회로설계방법은, 하나이상의디바이스들을포함하는넷리스트및 공정산포에관련된정보를포함하는모델라이브러리로부터각각의디바이스에대한에이징정보를제1 추출하는단계와, 상기공정산포에관련된정보와상기에이징정보를이용한연산을수행하여, 각각의디바이스에대한에이징에따른공정산포의편차를산출하는단계및 상기산출된편차가반영된넷리스트및/또는모델라이브러리를제2 추출하는단계를구비하는것을특징으로한다.

    Abstract translation: 公开了考虑由于老化引起的工艺偏差的电路设计方法和模拟方法。 根据本发明的技术构思的一个方面的电路设计方法的特征在于,根据本发明的技术构思的一个方面的电路设计方法包括网表,该网表包括一个或多个设备和模型库 首先提取每个设备的老化信息;通过使用与过程分散有关的信息和老化信息执行算术运算,计算每个设备由于老化而导致的过程偏差的偏差; 并且网表和/或模型库的第二次提取反映了计算出的偏差。

    반사방지 코팅용 고분자, 반사방지 코팅용 조성물 및 이를 이용한 반도체 장치의 패턴 형성 방법
    8.
    发明公开
    반사방지 코팅용 고분자, 반사방지 코팅용 조성물 및 이를 이용한 반도체 장치의 패턴 형성 방법 有权
    用于抗反射涂料的聚合物,用于抗反射涂料的组合物和使用组合物在半导体器件中形成图案的方法

    公开(公告)号:KR1020090067092A

    公开(公告)日:2009-06-24

    申请号:KR1020080129565

    申请日:2008-12-18

    Abstract: A composition for anti-reflective coating containing a polymer for anti-reflective coating is provided to form the pattern of excellent profile by regulating the diffusion of acid in an anti-reflective coating film. A polymer for anti-reflective coating comprises a first repeating unit containing basic functional group of the chemical formula 1, a second repeating unit having a light absorbing functional group and a third repeating unit having crosslinking functional group. In the chemical formula 1, R1 is hydrogen or low alkyl group of C1-C4; X is alkylene, arylene, oxyakylene, alkyleneoxy, oxyarylene, aryleneoxy, carbonyl, oxy, oxycarbonyl, carbonyloxy, carbonyl alkylene, carbonyl arylene, alkylene carbonyl, arylene carbonyl and bivalent selected from them.

    Abstract translation: 提供含有抗反射涂层用聚合物的抗反射涂层用组合物,以通过调节抗反射涂膜中酸的扩散来形成优异轮廓的图案。 用于抗反射涂层的聚合物包括含有化学式1的碱性官能团的第一重复单元,具有光吸收官能团的第二重复单元和具有交联官能团的第三重复单元。 在化学式1中,R1是C1-C4的氢或低级烷基; X是亚烷基,亚芳基,氧亚烷基,亚烷氧基,氧亚芳基,亚芳氧基,羰基,氧基,氧羰基,羰氧基,羰基亚烷基,羰基亚芳基,亚烷基羰基,亚芳基羰基和选自它们的二价。

    반도체 소자의 미세 패턴 형성방법
    9.
    发明公开
    반도체 소자의 미세 패턴 형성방법 无效
    形成半导体器件精细图案的方法

    公开(公告)号:KR1020080092154A

    公开(公告)日:2008-10-15

    申请号:KR1020070035669

    申请日:2007-04-11

    CPC classification number: H01L21/0275 G03F7/2004 G03F7/7045 G03F7/70466

    Abstract: A method for forming fine patterns of a semiconductor device is provided to store energy in a photoresist layer even if smaller energy is projected than threshold energy, thereby obtaining the desired fine patterns. A method for forming fine patterns of a semiconductor device comprises the steps of: forming a photoresist layer having threshold energy on a semiconductor substrate(101), the threshold energy corresponding to minimum exposure energy to react to the photoresist layer chemically; projecting a first light having a first energy which is lower than the threshold energy to a first region of the photoresist layer to form a preliminary exposure region maintaining the first energy, the preliminary exposure region limiting a non-exposure region; projecting a second light having a second energy which is lower than the threshold energy to a second region in the preliminary exposure region and to the non-exposure region to convert the second region into an exposure region, the sum of the first and second energies the same and higher as/than the threshold energy; and removing the exposure region selectively to form photoresist patterns(110).

    Abstract translation: 提供了一种用于形成半导体器件的精细图案的方法,用于在光刻胶层中存储能量,即使投射的能量小于阈值能量,从而获得所需的精细图案。 一种用于形成半导体器件的精细图案的方法包括以下步骤:在半导体衬底(101)上形成具有阈值能量的光致抗蚀剂层,对应于最小曝光能量的阈值能量与光刻胶层化学反应; 将具有低于阈值能量的第一能量的第一光投射到光致抗蚀剂层的第一区域,以形成保持第一能量的初步曝光区域,该预曝光区域限制非曝光区域; 将具有低于阈值能量的第二能量的第二光投射到预曝光区域中的第二区域和将非曝光区域投影到第二区域以将第二区域转换为曝光区域,第一和第二能量之和 相同和高于阈值能量; 并选择性地去除曝光区域以形成光致抗蚀剂图案(110)。

    광산 발생제, 이를 포함하는 포토레지스트 조성물 및 패턴형성 방법
    10.
    发明公开
    광산 발생제, 이를 포함하는 포토레지스트 조성물 및 패턴형성 방법 无效
    光电发生器,包括它们的光电组合物和形成图案的方法

    公开(公告)号:KR1020080070559A

    公开(公告)日:2008-07-30

    申请号:KR1020080007622

    申请日:2008-01-24

    Abstract: A photoacid generator, a photoresist composition containing the photoacid generator, and a method for forming a pattern by using the composition are provided to obtain a photoresist pattern having a uniform profile. A photoacid generator comprises at least one sulfonium salt cation part selected from sulfonium salt cation parts represented by the formulas 1, 2, 3 and 4; and a sulfonium salt anion part containing a carboxyl group as a hydrophilic site represented by the formula 5, wherein R1, R2, R3 and R4 are independently H or a C1-C5 alkyl group; n is 1-3; and X is a C4-C10 cyclo group, an adamantal group or a cycloheptane group containing an oxygen atom.

    Abstract translation: 提供光酸产生剂,含有光致酸发生剂的光致抗蚀剂组合物和通过使用该组合物形成图案的方法,以获得具有均匀轮廓的光致抗蚀剂图案。 光酸产生剂包含至少一种选自由式1,2,3和4表示的锍盐阳离子部分的锍盐阳离子部分; 和含有羧基作为由式5表示的亲水性位点的锍盐阴离子部分,其中R 1,R 2,R 3和R 4独立地为H或C 1 -C 5烷基; n为1-3; X是C 4 -C 10环基,金刚烷基或含有氧原子的环庚烷基。

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