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公开(公告)号：KR1020120008802A
公开(公告)日：2012-02-01
申请号：KR1020100069948
申请日：2010-07-20
Applicant: 성균관대학교산학협력단
IPC: B23K20/12
Abstract: PURPOSE: An apparatus for friction stir welding is provided to prevent the adhesion between a binded material and a backing plate due to frictional heat by using aluminum nitride. CONSTITUTION: An apparatus for friction stir welding comprises a first member(20), a second member(22), a tool(10), a backing plate(30) and a contact plate. The first member and the second member each other adhere closely for friction stirring joint. A tool is inserted into the junction of the second member and the first member. The tool welds the first member and the second member through the friction stir. The backing plate supports the first member and the second member. The contact plate is inserted into the backing plate. The contact plate is inserted into the part corresponding to the junction of the second member and the first member. The contact plate is made of aluminum nitride.
Abstract translation: 目的：提供一种用于摩擦搅拌焊接的装置，以防止由于通过使用氮化铝而产生的摩擦热而在捆扎材料和背板之间的粘合。 构成：用于摩擦搅拌焊接的装置包括第一构件（20），第二构件（22），工具（10），背板（30）和接触板。 第一构件和第二构件彼此紧密接合用于摩擦搅拌接头。 工具插入第二构件和第一构件的接合处。 该工具通过摩擦搅拌焊接第一构件和第二构件。 背板支撑第一构件和第二构件。 接触板插入背板中。 接触板被插入到与第二构件和第一构件的接合部相对应的部分中。 接触板由氮化铝制成。
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Patent Agency Ranking
公开(公告)号：KR1020110014886A
公开(公告)日：2011-02-14
申请号：KR1020090072476
申请日：2009-08-06
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A device and a method for processing the surface of a metal material are provided to mold the surface of a metal member without an additional device by inclining a tool. CONSTITUTION: A device for processing the surface of a metal material comprises a turntable(10) and a tool(20). A metal sample(1) is loaded on the turntable. The turn table can be horizontally reciprocated. The tool is vertically arranged on the top of the metal sample and is vertically and horizontally reciprocated. The rotary shaft(C) of the tool is inclined to the rotary shaft of the turntable.
Abstract translation: 目的：提供一种用于处理金属材料表面的装置和方法，以通过倾斜工具而无需附加装置来模制金属构件的表面。 构成：用于处理金属材料表面的装置包括转台（10）和工具（20）。 金属样品（1）装载在转台上。 转台可以水平往复运动。 该工具垂直布置在金属样品的顶部，并且垂直和水平往复运动。 工具的旋转轴（C）与转盘的旋转轴倾斜。
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公开(公告)号：KR1020090009414A
公开(公告)日：2009-01-23
申请号：KR1020070072652
申请日：2007-07-20
Applicant: 성균관대학교산학협력단
IPC: H01L21/60
CPC classification number: H01L24/81 , H01L2224/11 , H01L2224/13 , H01L2224/13155 , H01L2224/16 , H01L2924/15747 , H01L2924/00 , H01L2924/00012
Abstract: An electroplating bump in which solder is coated and a flip chip bonding method using the same are provided to directly bond bumps by using a liquid diffusion bonding method, thereby reducing a manufacturing cost and improving bonding strength and signal transmission capability. A conductive thin film(18) is formed on a substrate(10). A photoresist or a dry film is formed at an upper part of the conductive thin film as excluding a location in which a bump(14) will be formed. By using electroplating or electroless plating or sputtering or evaporation, the bump is formed on the conductive thin film. A solder less than 0.5 micro meter is formed on the bump by using the electroplating or electroless plating or sputtering or the evaporation. The height of the photoresist or dry film is greater than the height of the bump. The solder is made of tin or tin alloy in which a melting point is 450°C or less.
Abstract translation: 提供其中涂覆焊料的电镀凸块和使用其的倒装芯片接合方法，通过使用液体扩散接合方法直接接合凸块，从而降低制造成本并提高接合强度和信号传输能力。 导电薄膜（18）形成在基板（10）上。 除了形成凸点（14）的位置之外，在导电薄膜的上部形成光致抗蚀剂或干膜。 通过使用电镀或化学镀或溅射或蒸发，在导电薄膜上形成凸块。 通过使用电镀或无电镀或溅射或蒸发在凸块上形成小于0.5微米的焊料。 光致抗蚀剂或干膜的高度大于凸点的高度。 焊料由锡或锡合金制成，其熔点为450℃以下。
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公开(公告)号：KR101098334B1
公开(公告)日：2011-12-26
申请号：KR1020090123380
申请日：2009-12-11
Applicant: 성균관대학교산학협력단
IPC: B23K20/12
Abstract: 본발명은마찰교반접합장치및 방법에관한것이다. 본발명에서는제 1부재및 제 2부재가테이블에고정된상태에서테이블의회전축에대해기울어진상태로툴을배치하여초기성형위치를조정한다. 그리고, 툴을회전시켜제 1부재및 제 2부재의접합부에삽입한후에, 테이블을회전시킨다. 다음으로, 제 1부재및 제 2부재의접합시작점에덧댐부재를고정시킨다. 그리고, 툴이접합시작점까지접합부를접합한후에, 덧댐부재에핀홀을형성하게된다. 이와같은본 발명에의하면, 접합재료, 조건등에따라툴의각도를조절하는것이용이한효과가있다. 또한, 부재에핀홀에의한손상이가지않고, 핀홀을제거하기위한용접, 절삭등의공정이삭제되므로전체공정이간소화되는효과가있다.
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公开(公告)号：KR1020110066638A
公开(公告)日：2011-06-17
申请号：KR1020090123380
申请日：2009-12-11
Applicant: 성균관대학교산학협력단
IPC: B23K20/12
Abstract: PURPOSE: A friction stir welding machine and a friction stir welding method are provided to easily adjust the angle of a tool inclinedly installed in a table. CONSTITUTION: A friction stir welding machine comprises a table(10), a first member(20), a second member(24), and a tool(30). The first and second members are fixed to the table. The tool is rotatably installed to be inclined to the rotary shaft of the table. The tool is inserted into a contact part between the first and second members and welds the contact part.
Abstract translation: 目的：提供摩擦搅拌焊接机和摩擦搅拌焊接方法，以容易地调节倾斜安装在工作台中的工具的角度。 构成：摩擦搅拌焊接机包括台（10），第一构件（20），第二构件（24）和工具（30）。 第一和第二个成员固定在桌子上。 工具可旋转地安装成与工作台的旋转轴倾斜。 该工具插入到第一和第二构件之间的接触部分中并焊接接触部分。
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公开(公告)号：KR100896127B1
公开(公告)日：2009-05-07
申请号：KR1020070072652
申请日：2007-07-20
Applicant: 성균관대학교산학협력단
IPC: H01L21/60
CPC classification number: H01L24/81 , H01L2224/11 , H01L2224/13 , H01L2224/13155 , H01L2224/16 , H01L2924/15747 , H01L2924/00 , H01L2924/00012
Abstract: 본 발명은 도금된 범프가 사용된 칩과 기판의 접합 성능을 개선시키기 위하여 칩, 기판 또는 칩과 기판 양측에 소정 두께 이하의 칩 또는 기판 접속용 솔더가 코팅된 범프를 형성하는 방법과, 상기와 같은 범프가 형성된 칩 또는 기판을 열 압착 방식으로 접합하는 방법에 관한 것이다. 본 발명은 상부 기판 또는 하부 기판 또는 상부 기판과 하부 기판 모두의 범프 상에 0.5 ㎛ 두께 이하의 주석 또는 주석합금 솔더를 코팅하여 솔더와 범프를 복합구조로 형성시킨 후, 천이 액상 확산 접합법을 사용하여 새로운 설비 투자 없이 기존의 접합 장치로도 고신뢰성 범프 간 직접 접합이 가능한 접합 방법을 제공한다.
플립칩, 범프, 솔더, 주석, 금속간 화합물, 천이 액상 확산 접합Abstract translation: 提供其中涂覆焊料的电镀凸块和使用其的倒装芯片接合方法，通过使用液体扩散接合方法直接接合凸块，从而降低制造成本并提高接合强度和信号传输能力。 导电薄膜（18）形成在基板（10）上。 除了形成凸点（14）的位置之外，在导电薄膜的上部形成光致抗蚀剂或干膜。 通过使用电镀或化学镀或溅射或蒸发，在导电薄膜上形成凸块。 通过使用电镀或无电镀或溅射或蒸发在凸块上形成小于0.5微米的焊料。 光致抗蚀剂或干膜的高度大于凸点的高度。 焊料由锡或锡合金制成，其熔点为450℃以下。
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