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公开(公告)号：KR1020110110900A
公开(公告)日：2011-10-10
申请号：KR1020100030186
申请日：2010-04-02
Applicant: 한국과학기술원
IPC: B23K26/382 , H01L21/78
Abstract: 본 발명은 기판 절단 방법에 관한 것으로, 절단하고자 하는 기판의 패턴에 따라 절단패턴이 형성된 제 1박판을 준비하는 단계, 준비된 상기 제 1박판을 기판의 절단면과 접하도록 위치시키는 단계, 상기 제 1박판이 위치된 기판의 반대면으로 제 1박판과 자력으로 압착될 수 있도록 제 2박판을 위치시키는 단계, 상기 제 1박판의 절단패턴을 따라 레이저를 이용하여 기판을 절단하는 단계 및 절단 후 제 1박판과 제 2박판을 제거하는 단계를 포함하여 구성되는 것을 특징으로 한다. 이와 같이 구성되는 본 발명은 기판의 절단과정에서 발생하는 입자와 파편이 기판의 표면에 부착되는 것을 방지한다.
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公开(公告)号：KR100428050B1
公开(公告)日：2004-04-28
申请号：KR1020010036290
申请日：2001-06-25
Applicant: 한국과학기술원
IPC: B23K31/00
Abstract: PURPOSE: A method for evaluating quality of arc welding by using welding signal elements, that is, welding voltage, current and arc light intensity, and differential values for time of signals thereof is provided. CONSTITUTION: The method for evaluating quality of arc welding comprises the steps of calculating differential values for time of the welding signal elements by selecting one of welding signal elements such as welding voltage, welding current and arc light intensity, and distributing the calculated differential values on a two-dimensional graph as a point form; dividing the two dimensional graph into detailed sections according to welding characteristics, and tracking moving path in which points pass through the divided detailed sections, distribution of points existing in each of the detailed sections, and measured waveform of frequencies; and obtaining welding quality indices by applying weight of normal or abnormal waveform to the measured waveform in the path tracking step, and comparing the obtained welding quality indices with a set value to judge that welding quality is abnormal if the quality indices are the same or less than the set value.
Abstract translation: 目的：提供一种利用焊接信号元件评估电弧焊接质量的方法，即焊接电压，电流和电弧光强度，以及其信号的时间差值。 用于评估电弧焊质量的方法包括以下步骤：通过选择诸如焊接电压，焊接电流和弧光强度之类的焊接信号元素中的一个来计算焊接信号元的时间差值，并将计算出的差值分配到 作为点形式的二维图形; 根据焊接特性将二维图划分为详细的截面，并且跟踪点通过划分的详细截面的移动路径，每个详细截面中存在的点的分布以及频率的测量波形; 以及通过在路径跟踪步骤中将正常或异常波形的权重应用于测量波形来获得焊接质量指标，并且将所获得的焊接质量指标与设定值进行比较，以在质量指标相同或更小时判断焊接质量异常 超过设定值。
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公开(公告)号：KR1020030097479A
公开(公告)日：2003-12-31
申请号：KR1020020034871
申请日：2002-06-21
Applicant: 한국과학기술원
IPC: B23K26/20
Abstract: PURPOSE: A welding method by using a multiple reflection of a light source is provided to achieve a local heating work for a welding section by effectively transferring a laser output to the welding section. CONSTITUTION: A groove(25) having a predetermine depth is formed on an upper substrate(23). Then, a metal layer(24) is formed on a surface of the groove(25) for a multiple reflection of a light source. Then, a metal plate(22), which is patterned in match with a shape of the groove(25), is formed on the metal layer(24). A lower substrate(29) is positioned at a lower end of the upper substrate(23). After that, light is radiated towards the groove(25) from the light source by passing trough the metal plate(22) of the upper substrate(23). Light radiated into the groove(25) is focused at a lower end of the groove(25) due to the multiple reflection, so that a local heating work is carried out.
Abstract translation: 目的：提供通过使用光源的多重反射的焊接方法，以通过有效地将激光输出传递到焊接部来实现焊接部的局部加热工作。 构成：在上基板（23）上形成具有预定深度的槽（25）。 然后，在凹槽（25）的表面上形成用于多次反射光源的金属层（24）。 然后，在金属层（24）上形成与凹槽（25）的形状相匹配的金属板（22）。 下基板（29）位于上基板（23）的下端。 之后，通过使上基板（23）的金属板（22）通过，从光源向光纤（25）辐射光。 由于多次反射，辐射到凹槽25中的光在凹槽25的下端被聚焦，从而进行局部加热。
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公开(公告)号：KR1020050006427A
公开(公告)日：2005-01-17
申请号：KR1020030046141
申请日：2003-07-08
Applicant: 한국과학기술원
IPC: H01L23/48
CPC classification number: H01L24/81 , H01L2224/10 , H01L2224/73204
Abstract: PURPOSE: A method for soldering electronic components by a longitudinal ultrasonic wave is provided to efficiently bond a circuit of an electronic component at a low temperature by locally generating heat in a solder bonding part by a longitudinal ultrasonic wave applied in direction parallel with pressure. CONSTITUTION: An electrical circuit is formed between electronic components by using a viscoelastic bump made of a viscoelastic material. The viscoelastic bump is formed in at least a part of the electronic components whose pads(201,221) are aligned with each other. Pressure and longitudinal ultrasonic waves are applied to the upper part of the electronic components to melt the viscoelastic bump so that a bonding part is formed between the electronic components.
Abstract translation: 目的：提供一种通过纵向超声波焊接电子元件的方法，通过在与压力平行的方向上施加的纵向超声波在焊接接合部中局部产生热而有效地将电子部件的电路接合在低温下。 构成：通过使用由粘弹性材料制成的粘弹性凸块在电子部件之间形成电路。 粘弹性凸起形成在其垫片（201,221）彼此对准的电子部件的至少一部分中。 压力和纵向超声波被施加到电子部件的上部以熔化粘弹性凸块，使得在电子部件之间形成接合部。
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公开(公告)号：KR100448665B1
公开(公告)日：2004-09-13
申请号：KR1020020034871
申请日：2002-06-21
Applicant: 한국과학기술원
IPC: B23K26/20
Abstract: PURPOSE: A welding method by using a multiple reflection of a light source is provided to achieve a local heating work for a welding section by effectively transferring a laser output to the welding section. CONSTITUTION: A groove(25) having a predetermine depth is formed on an upper substrate(23). Then, a metal layer(24) is formed on a surface of the groove(25) for a multiple reflection of a light source. Then, a metal plate(22), which is patterned in match with a shape of the groove(25), is formed on the metal layer(24). A lower substrate(29) is positioned at a lower end of the upper substrate(23). After that, light is radiated towards the groove(25) from the light source by passing trough the metal plate(22) of the upper substrate(23). Light radiated into the groove(25) is focused at a lower end of the groove(25) due to the multiple reflection, so that a local heating work is carried out.
Abstract translation: 目的：提供一种通过使用光源的多次反射的焊接方法，以通过将激光输出有效地传递到焊接部分来实现焊接部分的局部加热工作。 组成：具有预定深度的凹槽（25）形成在上基板（23）上。 然后，在凹槽（25）的表面上形成金属层（24），用于光源的多次反射。 然后，在金属层（24）上形成图案化成与凹槽（25）的形状相匹配的金属板（22）。 下基板（29）位于上基板（23）的下端。 之后，通过穿过上基板（23）的金属板（22），从光源向槽（25）照射光。 照射到凹槽（25）中的光由于多次反射而聚焦在凹槽（25）的下端，从而进行局部加热工作。
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Patent Agency Ranking
公开(公告)号：KR1020030000495A
公开(公告)日：2003-01-06
申请号：KR1020010036290
申请日：2001-06-25
Applicant: 한국과학기술원
IPC: B23K31/00
Abstract: PURPOSE: A method for evaluating quality of arc welding by using welding signal elements, that is, welding voltage, current and arc light intensity, and differential values for time of signals thereof is provided. CONSTITUTION: The method for evaluating quality of arc welding comprises the steps of calculating differential values for time of the welding signal elements by selecting one of welding signal elements such as welding voltage, welding current and arc light intensity, and distributing the calculated differential values on a two-dimensional graph as a point form; dividing the two dimensional graph into detailed sections according to welding characteristics, and tracking moving path in which points pass through the divided detailed sections, distribution of points existing in each of the detailed sections, and measured waveform of frequencies; and obtaining welding quality indices by applying weight of normal or abnormal waveform to the measured waveform in the path tracking step, and comparing the obtained welding quality indices with a set value to judge that welding quality is abnormal if the quality indices are the same or less than the set value.
Abstract translation: 目的：提供一种通过焊接信号元件评估电弧焊接质量的方法，即焊接电压，电流和电弧光强度及其信号时间差值。 构成：评估电弧焊质量的方法包括以下步骤：通过选择焊接电压，焊接电流和电弧光强度等焊接信号元素之一来计算焊接信号元件的时间差异值，并将计算出的差分值分配到 二维图形作为点形式; 根据焊接特性将二维图划分为详细的部分，跟踪移动路径，其中点通过划分的详细部分，存在于每个详细部分中的点的分布和频率的测量波形; 以及通过在路径跟踪步骤中对所测量的波形施加正常波形或异常波形的重量来获得焊接质量指标，并且将获得的焊接质量指标与设定值进行比较，以便在质量指标相同或更小时判断焊接质量异常 比设定值。
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公开(公告)号：KR101158730B1
公开(公告)日：2012-06-22
申请号：KR1020100068281
申请日：2010-07-15
Applicant: 한국과학기술원
CPC classification number: H01L2224/13
Abstract: PURPOSE: A method for bonding a stack chip using electroless plating is provided to improve bonding strength and electric conductivity by forming a metal junction unit with electroless plating. CONSTITUTION: A plurality of chips with a plurality of TSV(Through-Silicon Via)s are arranged to contact a metal pad with a metal bump(115). Arranged chips are immersed in a plating bath with electroless plating solutions. The plurality of chips are bonded by forming a metal junction unit(210) by plating a metal layer around the metal pad and the metal bump.
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公开(公告)号：KR1020110123456A
公开(公告)日：2011-11-15
申请号：KR1020100042954
申请日：2010-05-07
Applicant: 한국과학기술원
IPC: H01L23/48
CPC classification number: H01L24/92 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/11 , H01L2224/11464 , H01L2224/11472 , H01L2224/11602 , H01L2224/1191 , H01L2224/13 , H01L2224/13011 , H01L2224/13016 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1411 , H01L2224/16 , H01L2224/16238 , H01L2224/17 , H01L2224/17055 , H01L2224/32225 , H01L2224/73104 , H01L2224/81191 , H01L2224/81203 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/94 , H01L2924/14 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: PURPOSE: A chip with a slanted conductive bump, an electronic part including the chip, and a manufacturing method thereof are provided to restrict excessive deformation of the conductive bump, thereby preventing conductive bump destruction. CONSTITUTION: One or more pads(210) are arranged on the surface of a chip(200) including a conductive bump. A plurality of first slanted conductive bumps(220) is arranged on the upper surface of the pad. A plurality of second slanted conductive bumps(230) is arranged on the surface of the chip adjacent to the pad. The first and second slanted conductive bumps have a cylindrical structure slanted with a fixed angle(Θ). A polymer layer(240) fills the circumference of the first and second slanted conductive bumps.
Abstract translation: 目的：提供具有倾斜导电凸块的芯片，包括芯片的电子部件及其制造方法，以限制导电凸块的过度变形，从而防止导电凸起破坏。 构成：在包括导电凸块的芯片（200）的表面上布置一个或多个焊盘（210）。 多个第一倾斜导电凸块（220）布置在垫的上表面上。 多个第二倾斜导电凸块（230）布置在与焊盘相邻的芯片的表面上。 第一和第二倾斜导电凸块具有以固定角度（Θ）倾斜的圆柱形结构。 聚合物层（240）填充第一和第二倾斜导电凸块的圆周。
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公开(公告)号：KR101054491B1
公开(公告)日：2011-08-05
申请号：KR1020080064718
申请日：2008-07-04
Applicant: 한국과학기술원
IPC: H01L21/60
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00
Abstract: 이 발명은 전자부품(칩)과 기판에 형성된 금속 재질의 스트립범프를 이용한 고상접합방법에 관한 것이다.
이 발명에 따른 스트립범프를 이용한 고상접합방법은, 칩과 기판에 각각 스트립범프를 형성하는 단계와, 상기 스트립범프가 형성된 기판 위에 언더필을 형성하는 단계와, 상기 칩과 기판을 정렬하고 초음파를 가하여 스트립범프 사이의 언더필을 제거하는 단계와, 상기 칩과 기판에 형성된 스트립범프를 접합하면서 상기 언더필을 경화시키는 단계를 포함한다.
초음파, 고상접합, 열압착, 언더필, 스트립범프, 범프-
公开(公告)号：KR100546001B1
公开(公告)日：2006-01-25
申请号：KR1020030046141
申请日：2003-07-08
Applicant: 한국과학기술원
IPC: H01L23/48
CPC classification number: H01L24/81 , H01L2224/10 , H01L2224/73204
Abstract: 본 발명은 칩(chip) 또는 기판(substrate)의 패드에 형성된 솔더 범프(solder bump)에 종방향 초음파를 인가하여 저온에서 솔더 접합부를 형성하는 종방향 초음파를 이용한 전자부품의 솔더링 방법에 관한 것으로서, 본 발명의 솔더링 방법은 칩(200)의 패드(201)에 형성된 구형의 솔더 범프(210)를 기판(220)의 패드(221)와 정렬하고, 초음파 발진기(230)의 혼(horn ; 231)을 통해 칩(200)의 상부에 압력(P)과 종방향 초음파를 인가하여 솔더 범프(210)를 용융시킴으로써 칩(200)과 기판(220) 사이에 솔더 접합부를 형성하는 것이다. 따라서, 본 발명은 기존의 솔더링 방법과 비교하여 솔더 용융점 이하의 온도에서 종방향 초음파를 인가하여 솔더 접합부에만 국부적인 열을 발생시켜 칩과 기판의 회로를 저온에서 효율적으로 솔더링하는 효과가 있다.
솔더링, 초음파, 종방향, 히터, 전자부품, 언더필, 패드Abstract translation: 本发明涉及一种钎焊方法用于使用芯片（芯片）或焊料凸块纵向超声波以形成在形成于所述基板（基板）的焊盘低温下通过在（焊料凸块）施加纵向超声波焊接接头的电子部件， 本发明的焊接方法将形成在芯片200的焊盘201上的球形焊料凸块210与衬底220的焊盘221对准并形成超声波振荡器230的焊头231， 通过经由焊料凸块210向芯片200的上部施加压力P和纵向超声波以形成芯片200与基板220之间的焊接点，从而熔化焊料凸块210。 因此，与传统的焊接方法相比，本发明具有通过在低于焊料熔点的温度下施加纵向超声波而仅在焊点处产生局部热量，从而有效地施加低温焊接热量的效果。
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