Abstract:
PROBLEM TO BE SOLVED: To provide a module housing and a power semiconductor module having an improved dielectric strength and an enhanced blocking voltage performance. SOLUTION: A power module housing comprises two electric insulation housing elements (1, 2) being fixed mutually. The first housing element (2) has power terminals (31, 32) and at least two openings (24) for groove-like recesses (23). Three insulation walls (11, 21, 22) are arranged on the surface of the housing and perpendicularly thereto between the openings (24). One insulation wall (11) is a part of the second housing element (1) and inserted into the recess (23) of the first housing element (2), and at least one of the second insulation walls (21, 22) is a part of the first housing element (2). Arrangement of the terminals can be simplified by the insulation walls between the openings for power terminals. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a power semiconductor submodule and power semiconductor module which have higher blocking voltages and are substantially equal in physical height to each other. SOLUTION: The power semiconductor module (1) has at least two semiconductor chips (21, 22), which have two main electrodes 3 and 4 between two main connection parts (6, 7) and also have one main electrode (3) applied with a contact force by a contact die (8) to press the other electrode (4) against a base plate (5). Those two semiconductor chips (21, 22) are electrically connected in series between two main connection parts (6, 7) of the power semiconductor submodule. COPYRIGHT: (C)2003,JPO
Abstract:
A signal transmission system serves to activate at least one power semiconductor switch (S 1 , S 2 , , S n ) starting from a controller (11). At least one control signal can be transmitted from the controller (11) to at least one modulator (M 1 , M 2 , ..., M n ) via at least one first transmission path (3). Each power semiconductor switch (S 1 , S 2 , , S n ) is connected to an activating electrode driver stage (G 1 , G 2 , ..., G n ), and at least one activating signal can be transmitted from the at least one modulator (M 1 , M 2 , ..., M n ) to each of the activating electrode driver stages (G 1 , G 2 , , G n ) via a second transmission path (4). At least one control signal and/or one activating signal can be transmitted by means of electromagnetic radiation, and the associated transmission path (3, 4) is lineless.
Abstract:
A converter circuit is specified for switching of a multiplicity of switching voltage levels, which have n first switching groups (1.1, ..., 1.n) for each phase (R, S, T), with the n-th first switching group (1.n) being formed by a first drivable bidirectional power semiconductor switch (2) and a second drivable bidirectional power semiconductor switch (3), and with the first first switching group (1.1) to the (n-1)-th switching group (1.(n-1)) each being formed by a first drivable bidirectional power. semiconductor switch (2) and a second drivable bidirectional power semiconductor switch (3), and by a capacitor (4) which is connected to the first and second drivable bidirectional power semiconductor switches (2, 3) with each of the n first switching groups (1.1, ..., 1.n) being connected in a linked form to the respectively adjacent first switching group (1.1, ..., 1.n), and with the first and the second drivable bidirectional power semiconductor switches (2, 3) in the first first switching group (1.1) being connected to one another. In order to reduce the stored electrical energy in the converter circuit, n >= 1, and p second switching groups (5.1, ..., 5.p) and p third switching groups (6.1, ..., 6.p) are provided, which each have a first drivable bidirectional power semiconductor switch (7, 8), a second drivable bidirectional power semiconductor switch (9, 10) and a capacitor (13, 14), where p >= 1. Each of the p second switching groups (5.1, ..., 5.p) is connected in a linked form to the respectively adjacent second switching group (5.1, ..., 5.p), and each of the p third switching groups (6.1, ..., 6.p) is connected in a linked form to the respectively adjacent third switching group (6.1, ..., 6.p). Furthermore, the first second and the first third switching group (5.1, 6.1) each have a third drivable bidirectional power semiconductor switch (11, 12) which is connected back--to-back in series with the respective second drivable bidirectional power semiconductor switch (9, 10), with the first second switching group (5.1) being connected to the first drivable bidirectional power semiconductor switch (2) in the n-th first switching group (1.n), and with the first third switching group (6.1) being connected to the second drivable bidirectional power semiconductor switch (3) in the n-th first switching group (1.n), and the capacitor (13) in the p-th second switching group (5.p) is connected in series with the capacitor (14) in the p-th third switching group (6.p).
Abstract:
A converter circuit is disclosed for switching of a multiplicity of switching voltage levels, which have n first switching groups for each phase (R, S, T), with the n-th first switching group being formed by a first drivable bidirectional power semiconductor switch and a second drivable bidirectional power semiconductor switch, and with the first switching group to the (n-1)-th switching group each being formed by a first drivable bidirectional power semiconductor switch and a second drivable bidirectional power semiconductor switch, and by a capacitor which is connected to the first and second drivable bidirectional power semiconductor switches with each of the n first switching groups being connected in a linked form to the respectively adjacent first switching group, and with the first and the second drivable bidirectional power semiconductor switches in the first switching group being connected to one another.
Abstract:
The power module housing comprises two electrically insulating housing elements (1, 2) that are attached to each other. A first of said housing elements (2) comprises at least two openings (24) for electric power terminals (31, 32) and a slot-like recess (23). Between the openings (24) three insulating walls (11, 21, 22) are arranged on and perpendicular to a surface of the housing. One insulating wall (11) is part of a second of said housing elements (1) and is inserted into the recess (23) in said first housing element (2), while an at least one second of said insulating walls (21, 22) is part of the first housing element (2). The insulating walls between the openings for the power terminals allow a compact arrangement of the terminals.
Abstract:
The power module housing comprises two electrically insulating housing elements (1, 2) that are attached to each other. A first of said housing elements (2) comprises at least two openings (24) for electric power terminals (31, 32) and a slot-like recess (23). Between the openings (24) three insulating walls (11, 21, 22) are arranged on and perpendicular to a surface of the housing. One insulating wall (11) is part of a second of said housing elements (1) and is inserted into the recess (23) in said first housing element (2), while an at least one second of said insulating walls (21, 22) is part of the first housing element (2). The insulating walls between the openings for the power terminals allow a compact arrangement of the terminals.
Abstract:
A converter circuit is disclosed for switching of a multiplicity of switching voltage levels, which have n first switching groups for each phase (R, S, T), with the n-th first switching group being formed by a first drivable bidirectional power semiconductor switch and a second drivable bidirectional power semiconductor switch, and with the first switching group to the (n-1)-th switching group each being formed by a first drivable bidirectional power semiconductor switch and a second drivable bidirectional power semiconductor switch, and by a capacitor which is connected to the first and second drivable bidirectional power semiconductor switches with each of the n first switching groups being connected in a linked form to the respectively adjacent first switching group, and with the first and the second drivable bidirectional power semiconductor switches in the first switching group being connected to one another.