公开(公告)号：WO2016116177A1

公开(公告)日：2016-07-28

申请号：PCT/EP2015/074289

申请日：2015-10-21

Applicant: ABB TECHNOLOGY AG

Inventor： SIVASUBRAMANIAM, Venkatesh ,  GUILLON, David ,  MORIN, Pauline ,  GUILLEMIN, Remi-Alain ,  HARTMANN, Samuel

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a method of generating a power semiconductor module, the method comprising the steps of: a) Providing a carrier layer (12); b) Providing a substrate (14) having a terminal connection area (22); c) Soldering the substrate (14) to the carrier layer (12) by forming a solder layer (20); wherein d) the solder layer (20) is formed such, that a pre-defined cavity (28) is provided in the solder layer (20) adjacent to the substrate (14) and located opposite to the terminal connection area (22); and e) Welding a terminal (24) to the terminal connection area (22) of the substrate (14). The present invention provides a method of generating a power semiconductor module which is especially cost-saving to perform and allows a reliable generation of high quality modules.

Abstract translation: 本发明涉及一种产生功率半导体模块的方法，所述方法包括以下步骤：a）提供载体层（12）; b）提供具有端子连接区域（22）的基板（14）; c）通过形成焊料层（20）将衬底（14）焊接到载体层（12）上; 其中d）形成所述焊料层（20），使得在所述焊料层（20）中邻近所述基板（14）设置预定义的空腔（28）并且位于所述端子连接区域（22）的相对的位置。 以及e）将端子（24）焊接到所述基板（14）的端子连接区域（22）。 本发明提供一种生成功率半导体模块的方法，该功率半导体模块特别节省成本并且允许可靠地生成高质量的模块。

公开(公告)号：WO2014000975A1

公开(公告)日：2014-01-03

申请号：PCT/EP2013/060355

申请日：2013-05-21

Applicant: ABB TECHNOLOGY AG

Inventor： SCHULZ, Nicola ,  RIEDEL, Gernot ,  GUILLON, David

IPC: B23K20/10 ,  B23K37/06

CPC classification number: B23K20/10 ,  B23K37/06 ,  B23K2201/38 ,  B23K2201/40

Abstract: The present invention provides an ultrasonic welding device (1) for welding a first workpiece (2) onto a second workpiece (3) comprising an ultrasonic welding tool (4) with a sonotrode (5) for contacting the first workpiece (2), a confinement structure (6, 20) attached or attachable to the ultrasonic welding tool (4), whereby the confinement structure (6, 20) is arranged and attached or attachable to the ultrasonic welding tool (4) to surround a welding region (8) where the first workpiece (2) is welded onto the second workpiece (3). The present invention also provides a method for ultrasonic welding a first workpiece (2) to a second workpiece (3), comprising welding the first workpiece (2) to the second workpiece (3) using the above ultrasonic welding device (1).

Abstract translation: 本发明提供了一种用于将第一工件（2）焊接到第二工件（3）上的超声波焊接装置（1），所述第二工件（3）包括具有用于接触所述第一工件（2）的超声焊丝（5）的超声波焊接工具（4） 所述限制结构（6,20）被连接或附接到所述超声波焊接工具（4），由此所述约束结构（6,20）被布置和附接或附接到所述超声波焊接工具（4）以包围焊接区域（8） 其中第一工件（2）焊接到第二工件（3）上。 本发明还提供了一种用于将第一工件（2）超声波焊接到第二工件（3）的方法，包括使用上述超声波焊接装置（1）将第一工件（2）焊接到第二工件（3）。

公开(公告)号：WO2015039771A1

公开(公告)日：2015-03-26

申请号：PCT/EP2014/058604

申请日：2014-04-28

Applicant: ABB TECHNOLOGY AG

Inventor： SIVASUBRAMANIAM, Venkatesh ,  GUILLON, David ,  TRÜSSEL, Dominik ,  THUT, Markus ,  HARTMANN, Samuel

IPC: B23K20/10 ,  B23K20/26

CPC classification number: B23K1/06 ,  B23K20/10 ,  B23K20/26 ,  B29C35/0261

Abstract: The present invention relates to a method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of: a) Aligning the components to be welded to form a welding interface (16); b) Aligning a welding tool (18) to the aligned components; c) Removably arranging a trapping material (20) at least partly encompassing the welding interface (16), whereby the trapping material (20) is a foam; and d) Connecting the components by activating the welding tool (18). The method like described above provides an easy and cost- saving measure in order to prevent particle contamination when performing a welding process such as particularly an ultrasonic welding process sue to scattered particles (20).

Abstract translation: 本发明涉及一种通过超声波焊接连接两个部件的方法，用于制造功率半导体模块，所述方法包括以下步骤：a）对准被焊接部件以形成焊接界面（16）; b）将焊接工具（18）对齐到对准的部件; c）可移除地布置至少部分地包围焊接界面（16）的捕集材料（20），由此捕集材料（20）是泡沫体; 和d）通过激活焊接工具（18）连接组件。 如上所述的方法提供了一种简单且成本节约的措施，以便在执行诸如特别是对散射颗粒（20）的超声波焊接工艺的焊接过程时防止颗粒污染。

公开(公告)号：EP3046717A1

公开(公告)日：2016-07-27

申请号：EP14720125.5

申请日：2014-04-28

Applicant: ABB Technology AG

Inventor： SIVASUBRAMANIAM, Venkatesh ,  GUILLON, David ,  TRÜSSEL, Dominik ,  THUT, Markus ,  HARTMANN, Samuel

IPC: B23K20/10 ,  B23K20/26

Abstract: The present invention relates to a method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of: a) Aligning the components to be welded to form a welding interface; b) Aligning a welding tool to the aligned components; c) Removably arranging a trapping material at least partly encompassing the welding interface, whereby the trapping material is a foam; and d) Connecting the components by activating the welding tool. The method like described above provides an easy and cost-saving measure in order to prevent particle contamination when performing a welding process such as particularly an ultrasonic welding process sue to scattered particles.