Abstract:
An apparatus and method are provided for treating pollutants in a process effluent stream. The apparatus comprises an up-flow canister having a lower section plenum space (22), a section for a sorbent bed material (18), an upper section plenum space (24), and inlet (20) for introducing a process effluent stream to the lower section plenum space, and an outlet (26) for egress of the process effluent stream from the canister, the inlet, lower section plenum space, and sorbent bed material being arranged in a manner which provides for process effluent stream to flow into the sorbent bed against gravity, by a pressure differential.
Abstract:
A gas-using facility including a portable dry scrubber system and/or over-pressure control arrangement. The portable dry scrubber system is of a unitary modular form, accommodating transport and ready set-up, take-down, and redeployment in the process facility. The over-pressure control arrangement provides capability for release of over-pressure gas from a compressed gas storage vessel during an over-pressure event, e.g., overheating of a compressed gas cylinder during a semiconductor foundry fire, while avoiding the bulk release of the entire vessel contents that occurs when conventional pressure relief devices are employed.
Abstract:
A fluid storage and dispensing system (100) comprising a vessel (126) in a liquid nitrogen bath (128) for holding a pentaborane(9)-containing fluid at subatmospheric pressure. The pentaborane may be supplied from liquid or synthesis source (124), nitrogen from valve (120), which are controlled by gas regulators (R-I & R-2). The fluid storage and dispensing system may be communicatively connected via various valves (AV-I to AV- 16 & MV-I to MV-4) to a semiconductor or liquid crystal manufacturing facility, whereby the pentaborane(9) is used as a substitute for commercially available boron hydride compounds, such as diborane. The system may include the exhaust pump (130), scrubbing means (140), and three-way valve (162) to sample the concentration of pentaborane(9) output therefrom.
Abstract:
Apparatus and method for dispensing a gas using a gas source (102) coupled in selective flow relationship with a gas manifold (126). The gas manifold (126) including flow circuitry (110) for discharging gas to a gas-using zone, and the gas source (126) includes a pressure-regulated gas source vessel (126) containing the gas at superatomospheric pressure.
Abstract:
Fluid storage and dispensing systems, and processes for supplying fluids for use thereof. Various arrangements of fluid storage and dispensing systems are described, involving permutations of the physical sorbent-containing fluid storage and dispensing vessels and internal regulator-equipped fluid storage and dispensing vessels. The systems and processes are applicable to a wide variety of end-use applications, including storage and dispensing of hazardous fluids with enhanced safety. In a specific end-use application, reagent gas is dispensed to a semiconductor manufacturing facility from a large-scale, fixedly positioned fluid storage and dispensing vessel containing physical sorbent holding gas at subatmospheric pressure, with such vessel being refillable from a safe gas source of refill gas, as disclosed herein.
Abstract:
A fill system and methodology for the manufacture of fluid storage and dispensing vessels containing sorbent material for holding a sorbable fluid, for on-demand dispensing of the fluid in the use of the vessel. The fill system and methodology are directed to minimizing the processing time required to dissipate the heat of sorption incident to the loading of the sorbable fluid onto the sorbent material, so that thermal equilibration time in the manufacture of the vessels is substantially reduced in relation to the use of only ambient convective air cooling for dissipation of the heat of sorption from the fluid-filled vessel.
Abstract:
A method of reducing ventilation gas flow rate through a gas cabinet comprising a gas source vessel and a gas delivery system comprising a gas cabinet.
Abstract:
ION SOURCE CLEANING IN SEMICONDUCTOR PROCESSING SYSTEMSCleaning of an ion implantation system or components thereof, utilizing a reactive cleaning reagent enabling growth/etching of the filament in an ion source of the arc chamber, by appropriate control of temperature in the arc chamber to effect the desired filament growth or alternative filament etching. Also described is the use of reactive gases such as XeFx, WFx, AsFx, PFx and TaFx, wherein x has a stoichioimetrically appropriate value or range of values, for cleaning regions of ion implanters, or components of implanters, in in situ or ex situ cleaning arrangements, under ambient temperature, elevated temperature or plasma conditions. Among specific reactive cleaning agents, BrF3 is described as useful for cleaning ion implant systems or component(s) thereof, in in situ or ex situ cleaning arrangements. Also described is a method of cleaning the forelines of an ion implant system for at least partial removal of ionization-related deposit from said forelines, comprising contacting said forelines with a cleaning gas wherein said cleaning gas is chemically reactive with said deposit. Also described is a method of improving the performance and extending the lifetime of an ion implant system, comprising contacting the cathode with a gas mixture.[ No Suitable Figure ]
Abstract:
A gas storage and dispensing system, comprising: a vessel defining an interior volume therewithin for containing a bed of sorbent material having affinity for a gas to be stored and selectively dispensed from the vessel. A valve head, mass flow controller, regulator assembly, or the like may be provided selectively establishing gas flow communication for discharge of gas from the vessel. A gas-flow resistance reducing structure, such as a gas-permeable porous tube, inert packing, or dispersed inert material, is disposed in the interior volume of the vessel for reducing the resistance to flow of gas from the sorbent material bed during establishment of said gas flow communication for discharge of gas from the vessel.