公开(公告)号：WO1997041713A1

公开(公告)日：1997-11-06

申请号：PCT/US1997007191

申请日：1997-05-01

Applicant: ALLIEDSIGNAL INC.

Inventor： ALLIEDSIGNAL INC. ,  FATCHERIC, John, F. ,  CARBIN, Derek, C.

IPC: H05K03/02

CPC classification number: H05K3/025 ,  H05K3/108 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0317 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2201/10477 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/0726

Abstract: A new method of forming circuit lines on a substrate by applying conductive metal(s) using copper foil as a carrier. The copper foil is etched away, leaving the conductive metals embedded in the surface of the substrate. A photoresist is used to expose trenches which define the desired circuit and copper is applied onto the exposed conductive metals. The method is particularly suited to manufacturing the outer layers of multi-layer circuit boards.

Abstract translation: 一种通过使用铜箔作为载体施加导电金属在基板上形成电路线的新方法。 蚀刻铜箔，留下导电金属嵌入基片的表面。 使用光致抗蚀剂来暴露限定所需电路的沟槽，并且将铜施加到暴露的导电金属上。 该方法特别适用于制造多层电路板的外层。

公开(公告)号：EP0868837A1

公开(公告)日：1998-10-07

申请号：EP97924540.0

申请日：1997-05-01

Applicant: AlliedSignal Inc.

Inventor： FATCHERIC, John, F. ,  CARBIN, Derek, C.

IPC: H05K3

CPC classification number: H05K3/025 ,  H05K3/108 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0317 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2201/10477 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/0726

Abstract: A new method of forming circuit lines on a substrate by applying conductive metal(s) using copper foil as a carrier. The copper foil is etched away, leaving the conductive metals embedded in the surface of the substrate. A photoresist is used to expose trenches which define the desired circuit and copper is applied onto the exposed conductive metals. The method is particularly suited to manufacturing the outer layers of multi-layer circuit boards.