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1.发明申请ANODIZATION AND POLISH SURFACE TREATMENT FOR HIGH GLOSS DEEP BLACK FINISH 审中-公开高光泽深色表面处理的阳极氧化和抛光表面处理
公开(公告)号：WO2018045485A1
公开(公告)日：2018-03-15
申请号：PCT/CN2016/098174
申请日：2016-09-06
Applicant: APPLE INC. , WAN, Dandan
Inventor： WAN, Dandan , LE, Duy P. , TATEBE, Masashige , AKANA, Jody R. , BATAILLOU, Jeremy D. , AOYAGI, Shota , DINH, Richard H. , LEE, Ricky C. , JOHANNESSEN, Thomas , BUSTLE, Benjamin S. , PHOUTHAVONG, Rasamay , FEINBERG, Zechariah D. , HU, Tiffany , LEE, Jong Kong , SU, Chuanyou , HUM, Phillip W. , COLEMAN, Michael P.
Abstract: A high gloss deep black housing for a handheld electronic device is disclosed having either a textured or a mirror finish. Methods for preparing a housing having the high gloss deep black finish are also disclosed, including housings for mobile phones.
Abstract translation: 公开了一种用于手持电子设备的高光泽深黑色外壳，其具有纹理或镜面饰面。 还公开了用于制备具有高光泽深黑色涂层的外壳的方法，包括用于移动电话的外壳。
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Patent Agency Ranking
公开(公告)号：WO2018013573A1
公开(公告)日：2018-01-18
申请号：PCT/US2017/041545
申请日：2017-07-11
Applicant: APPLE INC.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括限定第一界面表面的第一导电部件，界定面向第一界面表面的第二界面表面的第二导电部件以及界定第一和第二界面表面之间的接合结构。 接合结构包括形成壳体的外表面的一部分的模制元件以及在第一和第二导电部件之间形成防水密封的密封部件。 还公开了形成电子设备外壳的方法。
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公开(公告)号：EP3420710A1
公开(公告)日：2019-01-02
申请号：EP17749239.4
申请日：2017-07-11
Applicant: Apple Inc.
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公开(公告)号：EP3420124A1
公开(公告)日：2019-01-02
申请号：EP16915421.8
申请日：2016-09-06
Applicant: Apple Inc.
Inventor： WAN, Dandan , LE, Duy P. , TATEBE, Masashige , AKANA, Jody R. , BATAILLOU, Jeremy D. , AOYAGI, Shota , DINH, Richard H. , LEE, Ricky C. , JOHANNESSEN, Thomas , BUSTLE, Benjamin S. , PHOUTHAVONG, Rasamy , FEINBERG, Zechariah D. , HU, Tiffany , LEE, Jong Kong , SU, Chuanyou , HUM,Phillip W. , COLEMAN, Michael P.
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公开(公告)号：EP4468834A3
公开(公告)日：2025-03-12
申请号：EP24206651.2
申请日：2017-07-11
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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公开(公告)号：EP4468834A2
公开(公告)日：2024-11-27
申请号：EP24206651.2
申请日：2017-07-11
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
IPC: H05K7/18
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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