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公开(公告)号：WO2018175483A1
公开(公告)日：2018-09-27
申请号：PCT/US2018/023417
申请日：2018-03-20
Applicant: APPLE INC.
Inventor： LI, Hoishun , CURRENS, Ethan E. , HUANG, Weiming , WRIGHT, James A.
IPC: C22C38/00 , C23C8/06 , C23C8/24 , C23C8/26 , C22C38/02 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/48 , C22C38/50 , C21D8/02 , C21D8/04 , C21D6/00
Abstract: The disclosure provides methods of making iron-based alloys, as well as resulting alloys. An iron-based alloy containing a small amount of nickel (e.g., 0.5 to 2.0 wt%) is annealed and machined. The alloy is sufficiently ductile to reduce the likelihood of cracking, while not sufficiently high to result in a hardened alloy. After the alloy is shaped, the alloy is hardened by nitriding.
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公开(公告)号：WO2018013573A1
公开(公告)日：2018-01-18
申请号：PCT/US2017/041545
申请日：2017-07-11
Applicant: APPLE INC.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括限定第一界面表面的第一导电部件，界定面向第一界面表面的第二界面表面的第二导电部件以及界定第一和第二界面表面之间的接合结构。 接合结构包括形成壳体的外表面的一部分的模制元件以及在第一和第二导电部件之间形成防水密封的密封部件。 还公开了形成电子设备外壳的方法。
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公开(公告)号：EP4089514A1
公开(公告)日：2022-11-16
申请号：EP22171965.1
申请日：2022-05-06
Applicant: Apple Inc.
Inventor： KHAJEH, Ehsan , HIEMSTRA, Daniel J. , MAK, George Ho Yin , KWOK, Wai Man Raymund , POSTAK, Sonja R. , EVERHART, Camille L. , LI, Hoishun
Abstract: Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.
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4.发明公开
公开(公告)号：EP4089512A1
公开(公告)日：2022-11-16
申请号：EP22171177.3
申请日：2022-05-02
Applicant: Apple Inc.
Inventor： HIEMSTRA, Daniel J. , MAK, George Ho Yin , KHAJEH, Ehsan , EVERHART, Camille L. , LI, Hoishun , KWOK, Wai Man Raymund , POSTAK, Sonja R.
Abstract: Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.
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Patent Agency Ranking
公开(公告)号：EP3488024A1
公开(公告)日：2019-05-29
申请号：EP18717167.3
申请日：2018-03-20
Applicant: Apple Inc.
Inventor： LI, Hoishun , CURRENS, Ethan E. , HUANG, Weiming , WRIGHT, James A.
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公开(公告)号：EP3420710A1
公开(公告)日：2019-01-02
申请号：EP17749239.4
申请日：2017-07-11
Applicant: Apple Inc.
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公开(公告)号：EP4468834A3
公开(公告)日：2025-03-12
申请号：EP24206651.2
申请日：2017-07-11
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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公开(公告)号：EP4468834A2
公开(公告)日：2024-11-27
申请号：EP24206651.2
申请日：2017-07-11
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
IPC: H05K7/18
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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9.发明公开
公开(公告)号：EP4089513A1
公开(公告)日：2022-11-16
申请号：EP22171238.3
申请日：2022-05-03
Applicant: Apple Inc.
Inventor： HIEMSTRA, Daniel J. , MAK, George Ho Yin , KHAJEH, Ehsan , LI, Hoishun , EVERHART, Camille L. , KWOK, Wai Man Raymund
Abstract: Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.
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