公开(公告)号：WO2015187972A1

公开(公告)日：2015-12-10

申请号：PCT/US2015/034233

申请日：2015-06-04

Applicant: APPLE INC.

Inventor： LEE, Meng Chi ,  PENNATHUR, Shankar ,  GOOCH, Scott, L. ,  PYPER, Dennis, R. ,  SALEHI, Amir

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer (120 ) for providing an interconnection between a system-in-a-package module comprising a first board (110), electronic components (130, 132) and a molded portion (140), and other components (150) in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在包括第一板（110），电子部件（130,132）和模制部分（140）以及其它部件（140）的系统级封装模块之间提供互连的插入器（120） 150）在电子设备中。 另一个可以提供多个导电引脚或触点以在模块和其它部件之间形成互连路径。

公开(公告)号：WO2012170632A2

公开(公告)日：2012-12-13

申请号：PCT/US2012/041256

申请日：2012-06-07

Applicant: APPLE INC. ,  FOSTER, James, H. ,  BILANSKI, James, W. ,  SALEHI, Amir ,  CHANDHRASEKHAR, Ramamuntry ,  WEBM, Nicholas, Unger

Inventor： FOSTER, James, H. ,  BILANSKI, James, W. ,  SALEHI, Amir ,  CHANDHRASEKHAR, Ramamuntry ,  WEBM, Nicholas, Unger

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0218 ,  H01L23/552 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K9/0026 ,  H05K9/003 ,  H05K9/0033 ,  H05K9/0037 ,  H05K9/0043 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.

Abstract translation: 可以使用电磁屏​​蔽结构屏蔽衬底上的电子部件。 绝缘材料可用于提供结构支撑并帮助防止导电材料与部件之间的电短路。 屏蔽结构可以包括使用围绕选定部件的金属栅栏或通过注射成型塑料形成的隔室。 可以使用包裹在部件和基板上的金属箔来形成屏蔽结构。 可以使用测试柱或痕迹来测试电子元件，以识别故障的组件。 测试柱或迹线可以沉积在衬底上，并且可以用于在测试设备和组件之间传送测试信号。 测试成功后，测试柱可能被永久屏蔽。 或者，临时屏蔽结构可以用于在电子设备完全组装之前测试各个部件。

公开(公告)号：EP3152986A1

公开(公告)日：2017-04-12

申请号：EP15730353.8

申请日：2015-06-04

Applicant: Apple Inc.

Inventor： LEE, Meng Chi ,  PENNATHUR, Shankar ,  GOOCH, Scott, L. ,  PYPER, Dennis, R. ,  SALEHI, Amir

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer (120 ) for providing an interconnection between a system-in-a-package module comprising a first board (110), electronic components (130, 132) and a molded portion (140), and other components (150) in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在系统级封装模块和电子设备中的其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚以在模块和其他部件之间形成互连路径。