公开(公告)号：WO2015187972A1

公开(公告)日：2015-12-10

申请号：PCT/US2015/034233

申请日：2015-06-04

Applicant: APPLE INC.

Inventor： LEE, Meng Chi ,  PENNATHUR, Shankar ,  GOOCH, Scott, L. ,  PYPER, Dennis, R. ,  SALEHI, Amir

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer (120 ) for providing an interconnection between a system-in-a-package module comprising a first board (110), electronic components (130, 132) and a molded portion (140), and other components (150) in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在包括第一板（110），电子部件（130,132）和模制部分（140）以及其它部件（140）的系统级封装模块之间提供互连的插入器（120） 150）在电子设备中。 另一个可以提供多个导电引脚或触点以在模块和其它部件之间形成互连路径。

公开(公告)号：EP3152986A1

公开(公告)日：2017-04-12

申请号：EP15730353.8

申请日：2015-06-04

Applicant: Apple Inc.

Inventor： LEE, Meng Chi ,  PENNATHUR, Shankar ,  GOOCH, Scott, L. ,  PYPER, Dennis, R. ,  SALEHI, Amir

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer (120 ) for providing an interconnection between a system-in-a-package module comprising a first board (110), electronic components (130, 132) and a molded portion (140), and other components (150) in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在系统级封装模块和电子设备中的其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚以在模块和其他部件之间形成互连路径。