公开(公告)号：WO2015187972A1

公开(公告)日：2015-12-10

申请号：PCT/US2015/034233

申请日：2015-06-04

Applicant: APPLE INC.

Inventor： LEE, Meng Chi ,  PENNATHUR, Shankar ,  GOOCH, Scott, L. ,  PYPER, Dennis, R. ,  SALEHI, Amir

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer (120 ) for providing an interconnection between a system-in-a-package module comprising a first board (110), electronic components (130, 132) and a molded portion (140), and other components (150) in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在包括第一板（110），电子部件（130,132）和模制部分（140）以及其它部件（140）的系统级封装模块之间提供互连的插入器（120） 150）在电子设备中。 另一个可以提供多个导电引脚或触点以在模块和其它部件之间形成互连路径。

公开(公告)号：WO2017014949A1

公开(公告)日：2017-01-26

申请号：PCT/US2016/041139

申请日：2016-07-06

Applicant: APPLE INC.

Inventor： LEE, Meng Chi ,  CHAUHAN, Shakti S. ,  CARSON, Flynn P. ,  HSU, Jun Chung ,  LIN, Tha-An

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/58

CPC classification number: H01L23/552 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed over the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The substrate of the SiP may include at least some metallization along vertical walls in the end portions of the substrate. The metallization may provide a large contact area for coupling the metal shield to a ground ring coupled to the ground layer in the PCB. The metallization along the vertical walls in the end portions of the substrate may be formed as through-metal vias in a common substrate before singulation to form the SiP.

Abstract translation: 公开了一种封装系统（SiP），其使用EMI屏蔽来抑制SiP内的元件上的EMI或其他电干扰。 可以在SiP上形成金属屏蔽。 金属屏蔽可以电耦合到印刷电路板（PCB）中的接地层，以在SiP周围形成EMI屏蔽。 SiP的衬底可以包括在衬底的端部中沿垂直壁的至少一些金属化。 金属化可以提供用于将金属屏蔽件耦合到耦合到PCB中的接地层的接地环的大的接触面积。 沿着衬底的端部的垂直壁的金属化可以在共形衬底之前形成为通孔，以形成SiP。

公开(公告)号：EP3152986A1

公开(公告)日：2017-04-12

申请号：EP15730353.8

申请日：2015-06-04

Applicant: Apple Inc.

Inventor： LEE, Meng Chi ,  PENNATHUR, Shankar ,  GOOCH, Scott, L. ,  PYPER, Dennis, R. ,  SALEHI, Amir

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer (120 ) for providing an interconnection between a system-in-a-package module comprising a first board (110), electronic components (130, 132) and a molded portion (140), and other components (150) in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在系统级封装模块和电子设备中的其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚以在模块和其他部件之间形成互连路径。