VAPOR DEPOSITION OF THIN FILMS COMPRISING GOLD

    公开(公告)号:WO2018140235A1

    公开(公告)日:2018-08-02

    申请号:PCT/US2018/013079

    申请日:2018-01-10

    Abstract: Vapor deposition processes for forming thin films comprising gold on a substrate in a reaction space are provided. The processes can be cyclical vapor deposition processes, such as atomic layer deposition (ALD) processes. The processes can include contacting the substrate with a gold precursor comprising at least one sulfur donor ligand and at least one alkyl ligand, and contacting the substrate with a second reactant comprising ozone. The deposited thin films comprising gold can be uniform, continuous, and conductive at very low thicknesses.

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