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    ACTIVE LEARNING-BASED DEFECT LOCATION IDENTIFICATION
    3.
    发明申请
    ACTIVE LEARNING-BASED DEFECT LOCATION IDENTIFICATION 审中-公开

    公开(公告)号：WO2022101051A1

    公开(公告)日：2022-05-19

    申请号：PCT/EP2021/080304

    申请日：2021-11-02

    Applicant: ASML NETHERLANDS B.V.

    Inventor： LIN, Chenxi ,  ZOU, Yi ,  HASAN, Tanbir ,  XU, Huina ,  KOU, Ren-Jay ,  MOIN, Nabeel, Noor ,  NAFISI, Kourosh

    IPC: G03F7/20

    Abstract: A method and apparatus for identifying locations to be inspected on a substrate is disclosed. A defect location prediction model is trained using a training dataset associated with other substrates to generate a prediction of defect or non-defect and a confidence score associated with the prediction for each of the locations based on process-related data associated with the substrates. Those of the locations determined by the defect location prediction model as having confidences scores satisfying a confidence threshold are added to a set of locations to be inspected by an inspection system. After the set of locations are inspected, the inspection results data is obtained, and the defect location prediction model is incrementally trained by using the inspection results data and process-related data for the set of locations as training data.

    LEVEL SENSOR APPARATUS, METHOD OF MEASURING TOPOGRAPHICAL VARIATION ACROSS A SUBSTRATE, METHOD OF MEASURING VARIATION OF A PHYSICAL PARAMETER RELATED TO A LITHOGRAPHIC PROCESS, AND LITHOGRAPHIC APPARATUS
    5.
    发明申请
    LEVEL SENSOR APPARATUS, METHOD OF MEASURING TOPOGRAPHICAL VARIATION ACROSS A SUBSTRATE, METHOD OF MEASURING VARIATION OF A PHYSICAL PARAMETER RELATED TO A LITHOGRAPHIC PROCESS, AND LITHOGRAPHIC APPARATUS 审中-公开
    水平传感器装置，在基板上测量地形变化的方法，测量与光刻工艺相关的物理参数的变化的方法以及光刻设备

    公开(公告)号：WO2018019496A1

    公开(公告)日：2018-02-01

    申请号：PCT/EP2017/065448

    申请日：2017-06-22

    Applicant: ASML NETHERLANDS B.V.

    Inventor： TEL, Wim, Tjibbo ,  STAALS, Frank ,  DE NIVELLE, Martin Jules Marie-Emile ,  HASAN, Tanbir

    IPC: G03F9/00

    CPC classification number: G03F9/7034 ,  G05B19/4097 ,  G05B2219/45028 ,  G05B2219/45031

    Abstract: A method of determining topographical variation across a substrate on which one or more patterns have been applied. The method includes obtaining measured topography data representing a topographical variation across a substrate on which one or more patterns have been applied by a lithographic process; and combining the measured topography data with knowledge relating to intra-die topology to obtain derived topography data having a resolution greater than the resolution of the measured topography data. Also disclosed is a corresponding level sensor apparatus and lithographic apparatus comprising such a level sensor apparatus, and a more general method of determining variation of a physical parameter from first measurement data of variation of the physical parameter across the substrate and intra-die measurement data of higher resolution than the first measurement data and combining these.

    Abstract translation: 确定已经应用了一种或多种图案的衬底上的形貌变化的方法。 该方法包括获得测量的形貌数据，所述测量的形貌数据表示通过光刻工艺已经施加了一个或多个图案的衬底上的形貌变化; 以及将所测量的地形数据与关于管芯内拓扑的知识相结合以获得具有比所测量的地形数据的分辨率更高的分辨率的派生地形数据。 还公开了包括这样的水平传感器装置的相应的水平传感器装置和光刻设备以及更一般的方法，该方法根据衬底上的物理参数的变化的第一测量数据和芯片上的管芯内测量数据来确定物理参数的变化 比第一次测量数据更高的分辨率，并结合这些数据。

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