公开(公告)号：WO2022135819A1

公开(公告)日：2022-06-30

申请号：PCT/EP2021/082886

申请日：2021-11-24

Applicant: ASML NETHERLANDS B.V.

Inventor： LI, Danying ,  LIU, Meng ,  WUU, Jen-Yi ,  SUN, Rencheng ,  WU, Cong ,  XU, Dean

IPC: G03F7/20 ,  G06F30/398

Abstract: An improved apparatus and method of feature extraction for identifying a pattern are disclosed. An improved method of feature extraction for identifying a pattern comprises obtaining data representative of a pattern instance, dividing the pattern instance into a plurality of zones, determining a representative characteristic of a zone of the plurality of zones, generating a representation of the pattern instance using a feature vector, wherein the feature vector comprises an element corresponding to the representative characteristic, wherein the representative characteristic is indicative of a spatial distribution of one or more features of the zone. The method also comprises at least one of classifying or selecting pattern instances based on the feature vector.

公开(公告)号：WO2022037921A1

公开(公告)日：2022-02-24

申请号：PCT/EP2021/071359

申请日：2021-07-29

Applicant: ASML NETHERLANDS B.V.

Inventor： CHEN, Hao ,  HU, Weixuan ,  JIA, Qi ,  LIU, Meng ,  SUN, Rencheng ,  WUU, Jen-Yi

IPC: G03F7/20 ,  G03F1/36 ,  G06F30/30 ,  G06N3/04

Abstract: Described herein is a method for selecting patterns for training a model to predict patterns to be printed on a substrate. The method includes (a) obtaining images of multiple patterns, wherein the multiple patterns correspond to target patterns to be printed on a substrate; (b) grouping the images into a group of special patterns and multiple groups of main patterns; and (c) outputting a set of patterns based on the images as training data for training the model, wherein the set of patterns includes the group of special patterns and a representative main pattern from each group of main patterns.

公开(公告)号：WO2023046385A1

公开(公告)日：2023-03-30

申请号：PCT/EP2022/073313

申请日：2022-08-22

Applicant: ASML NETHERLANDS B.V.

Inventor： LIU, Meng ,  CHEN, Been-Der ,  SHAO, Debao ,  WUU, Jen-Yi ,  CHEN, Hao ,  HAMOUDA, Ayman ,  CHENG, Jianhua

IPC: G03F1/36 ,  G03F7/20 ,  G06N3/08 ,  G06N20/00

Abstract: Selecting an optimized, geometrically diverse subset of clips for a design layout for a semiconductor wafer is described. A complete representation of the design layout is received. A set of representative clips of the design layout is determined such that individual representative clips comprise different combinations of one or more unique patterns of the design layout. A subset of the representative clips is selected based on the one or more unique patterns. The subset of the representative clips is configured to include: (1) each geometrically unique pattern in a minimum number of representative clips; or (2) as many geometrically unique patterns of the design layout as possible in a maximum number of representative clips. The subset of representative clips is provided as training data for training an optical proximity correction or source mask optimization semiconductor process machine learning model, for example.

公开(公告)号：WO2023030807A1

公开(公告)日：2023-03-09

申请号：PCT/EP2022/071659

申请日：2022-08-02

Applicant: ASML NETHERLANDS B.V.

Inventor： SUN, Rencheng ,  YANG, Feng ,  LIU, Meng ,  YAN, Fei

IPC: G03F7/20

Abstract: Described herein is systems and methods for evaluating selected set of patterns of a design layout. A method herein includes obtaining (i) a first pattern set resulting from a pattern selection process, (ii) first pattern data associated with the first pattern set, (iii) characteristic data associated with the first pattern data, and (iv) second pattern data associated with a second pattern set. A machine learning model is trained based on the characteristic data, where the machine learning model being configured to predict pattern data for an input pattern. The second pattern set is input to the trained machine learning model to predict second pattern data of the second pattern set. The first pattern set is evaluated by comparing the second pattern data and the predicted second pattern data. If the evaluation indicates insufficient pattern coverage, additional patterns can be included to improve the pattern coverage.

公开(公告)号：EP4200671A1

公开(公告)日：2023-06-28

申请号：EP21752530.2

申请日：2021-07-29

Applicant: ASML Netherlands B.V.

Inventor： CHEN, Hao ,  HU, Weixuan ,  JIA, Qi ,  LIU, Meng ,  SUN, Rencheng ,  WUU, Jen-Yi

IPC: G03F7/20 ,  G03F1/36 ,  G06F30/30 ,  G06N3/04