公开(公告)号：WO2019149586A1

公开(公告)日：2019-08-08

申请号：PCT/EP2019/051576

申请日：2019-01-23

Applicant: ASML NETHERLANDS B.V.

Inventor： PLUG, Reinder, Teun ,  VAN DER SCHAAR, Maurits

IPC: G03F9/00 ,  H01L23/544

Abstract: A method of patterning of at least a layer in a semiconductor device, comprising a patterning step by patterning means wherein the patterned layer comprises sensing-light transmissive portions (702x) and sensing-light blocking portions (702).

公开(公告)号：WO2017080727A1

公开(公告)日：2017-05-18

申请号：PCT/EP2016/073995

申请日：2016-10-07

Applicant: ASML NETHERLANDS B.V.

Inventor： MAASSEN, Martinus ,  PLUG, Reinder, Teun ,  BHATTACHARYYA, Kaustuve

IPC: G03F7/20

CPC classification number: G03F7/705 ,  G03F7/70625 ,  G03F7/70991

Abstract: Increasingly, metrology systems are integrated within the lithographic apparatuses, to provide integrated metrology within the lithographic process. However, this integration can result in a throughput or productivity impact of the whole lithographic apparatus which can be difficult to predict. It is therefore proposed to provide a simulation model which is operable to acquire throughput information associated with a throughput of a plurality of substrates within a lithographic apparatus, said throughput information comprising a throughput parameter, predict, using a throughput simulator the throughput using the throughput parameter as an input parameter. The throughput simulator may be calibrated using the acquired throughput information. The impact of at least one change of a throughput parameter on the throughput of the lithographic apparatus may be predicted using the throughput simulator.

Abstract translation: 计量系统越来越多地集成在光刻设备内，以提供光刻过程中的集成度量。 然而，这种集成可导致整个光刻设备的吞吐量或生产率影响，这可能难以预测。 因此提出提供一种模拟模型，其可操作以获取与光刻设备内的多个衬底的吞吐量相关联的吞吐量信息，所述吞吐量信息包括吞吐量参数，使用吞吐量模拟器预测使用吞吐量参数 作为输入参数。 吞吐量模拟器可以使用获取的吞吐量信息进行校准。 吞吐量参数的至少一个变化对光刻设备的吞吐量的影响可以使用吞吐量模拟器来预测。

公开(公告)号：WO2020182379A1

公开(公告)日：2020-09-17

申请号：PCT/EP2020/052923

申请日：2020-02-06

Applicant: ASML NETHERLANDS B.V.

Inventor： DILLEN, Hermanus, Adrianus ,  PLUG, Reinder, Teun

IPC: G03F9/00 ,  G03F7/20

Abstract: Methods and apparatus for estimating at least part of a shape of a surface of a substrate usable in fabrication of semiconductor devices. Methods comprise: obtaining at least one focal position of the surface of the substrate measured by an inspection apparatus, the at least one focal position for bringing targets on or in the substrate within a focal range of optics of the inspection apparatus; and determining the at least part of the shape of the surface of the substrate based on the at least one focal position.

公开(公告)号：WO2019162280A1

公开(公告)日：2019-08-29

申请号：PCT/EP2019/054110

申请日：2019-02-19

Applicant: ASML NETHERLANDS B.V.

Inventor： VAN OOSTEN, Anton, Bernhard ,  VAENKATESAN, Vidya ,  WILEY, James, Norman ,  PLUG, Reinder, Teun

IPC: G03F7/20 ,  G03F1/84 ,  G03F1/00

Abstract: Described herein is a method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limiting pattern locations corresponding to the patterning device based on the patterning device substrate map, and based on the process window limiting pattern locations, guiding, by a hardware computer system, a patterning device inspection apparatus to the process window limiting pattern locations for defect inspection.