Abstract:
An immersion lithography objective (2) has a housing in which at least one first optical element (4) is arranged, a second optical element (10), which follows the first optical element in the direction of the optical axis (13) of the objective, an immersion medium (12) that adjoins the second optical element being located downstream of the latter in the direction of the optical axis, and a retaining structure (11) for the second optical element. The retaining structure has a greater stiffness in the direction of the optical axis than in a direction perpendicular to the optical axis.
Abstract:
A projection system (PS1) for a lithographic apparatus comprises: an optical path (100); a plurality of sensors (S1 - S4); one or more actuators (A1 - A4); and a controller (CN). The optical path is operable to receive an input radiation beam (Bin) and to project an output radiation beam (Bout) onto a substrate to form an image. The optical path comprises: a plurality of optical elements (M1 - M4), the plurality of optical elements comprising: a first set of at least two optical elements (M1, M4) and a second set of at least one optical element (M2, M3). Each sensor is associated with one of the plurality of optical elements and is operable to determine a position of that optical element. Each actuator is associated with one of the second set of optical elements and is operable to adjust that optical element. The controller is operable to use the one or more actuators to adjust the second set of optical elements in dependence on the determined position of the first set of optical elements so as to at least partially compensate for optical aberrations and/or line-of-sight errors caused by the positions of the first set of optical elements.
Abstract:
The joint between the lens (21) and its support (22) comprises an inorganic layer or a direct bond and is thus liquid tight which prevents deformation by the immersion liquid. The joint can be made either warm or cold. Solders, glue, and glue protection can all be used in the formation of this joint. The lens (21) and its support (22) are preferably made of quartz.
Abstract:
The invention relates to a mirror, in particular for a microlithographic projection exposure apparatus. A mirror according to the invention has an optical effective surface (101, 201, 301), a mirror substrate (110, 210, 310, 410), a reflection layer system (120, 220, 320) for reflecting electromagnetic radiation that is incident on the optical effective surface (101, 201, 301), at least one actuator layer which is configured to transmit an adjustable mechanical force on the reflection layer system (120, 220, 320), thereby producing a locally variable deformation of the optical effective surface (101, 201, 301), and at least one cooling device configured to at least partially dissipate heat generated by said actuator layer.
Abstract:
A method of projecting a patterned beam onto a substrate using an EUV lithographic apparatus having a projection system (PS) including a plurality of mirrors (12-16). The method includes the following steps. Using the projection system (PS) to project the patterned beam onto the substrate (W) while moving a final mirror (16) of the projection system (PS) in a direction substantially perpendicular to the surface of the substrate (W). Rotating the final mirror (16) to substantially compensate for unwanted translation of the projected patterned radiation beam on the substrate due to the movement of the mirror.
Abstract:
The invention relates to an optical system, in particular for microlithography, and to a method for operating an optical system. According to an aspect of the invention, an optical system comprises at least one mirror (100, 500, 600) having an optical effective surface (101, 501, 601) and a mirror substrate (110, 510, 610), wherein at least one cooling channel (115, 515, 615) in which a cooling fluid is capable to flow is arranged in the mirror substrate in order to dissipate heat that is generated in the mirror substrate due to absorption of electromagnetic radiation incident from a light source on the optical effective surface, and a unit (135, 535, 635) to adjust the temperature and/or the flow rate of the cooling fluid either dependent on a measured quantity that characterizes the thermal load in the mirror substrate or dependent on an estimated thermal load to be expected in the mirror substrate for a given power of the light source.
Abstract:
A method for compensating for an exposure error in an exposure process of a lithographic apparatus that comprises a substrate table, the method comprising: obtaining a dose measurement indicative of a dose of IR radiation that reaches substrate level, wherein the dose measurement can be used to calculate an amount of IR radiation absorbed by an object in the lithographic apparatus during an exposure process; and using the dose measurement to control the exposure process so as to compensate for an exposure error associated with the IR radiation absorbed by the object during the exposure process.
Abstract:
A method for compensating for an exposure error in an exposure process of a lithographic apparatus that comprises a substrate table, the method comprising: obtaining a dose measurement indicative of a dose of IR radiation that reaches substrate level, wherein the dose measurement can be used to calculate an amount of IR radiation absorbed by an object in the lithographic apparatus during an exposure process; and using the dose measurement to control the exposure process so as to compensate for an exposure error associated with the IR radiation absorbed by the object during the exposure process.