Abstract:
A lithographic apparatus comprising a projection system configured to project a patterned radiation beam to form an exposure area on a substrate held on a substrate table, the lithographic apparatus further comprising a cooling apparatus (40) for cooling the substrate, wherein the cooling apparatus comprises a cooling element (42, 44) located above the substrate table and adjacent to the exposure area, the cooling element being configured to remove heat from the substrate.
Abstract:
Systems, apparatuses, and methods are provided for manufacturing a substrate table. An example method can include forming a vacuum sheet including a plurality of vacuum connections and a plurality of recesses configured to receive a plurality of burls disposed on a core body for supporting an object such as a wafer. Optionally, at least one burl can be surrounded, partially or wholly, by a trench. The example method can further include using the vacuum sheet to mount the core body to an electrostatic sheet including a plurality of apertures configured to receive the plurality of burls. Optionally, the example method can include using the vacuum sheet to mount the core body to the electrostatic sheet such that the plurality of recesses of the vacuum sheet line up with the plurality of burls of the core body and the plurality of apertures of the electrostatic sheet.
Abstract:
The invention relates to a device manufacturing method comprising exposing a substrate with a patterned beam of radiation formed by a reticle mounted on a displaceable reticle stage, wherein the method comprises the steps of determining a non-linear function for approximating a height and a tilt profile of a reticle surface with respect to the reticle stage and controlling a displacement of the reticle stage during exposure of the substrate in accordance with the non-linear function. The invention further relates to a lithographic apparatus and a computer program.
Abstract:
A deformable mirror system (300, 400, 500), comprising a monolithic support structure (310, 410, 510), comprising a first side (311) configured to receive a mirror (350, 450, 550); and a second side (312) configured to receive a plurality of actuators (460, 560) such that the actuators are positioned to enable selective deformation of a reflective surface (351, 451, 551) of the mirror.
Abstract:
Disclosed is a method for monitoring a lithographic process, and associated lithographic apparatus. The method comprises obtaining height variation data relating to a substrate supported by a substrate support and fitting a regression through the height variation data, the regression approximating the shape of the substrate; residual data between the height variation data and the regression is determined; and variation of the residual data is monitored over time. The residual data may be deconvolved based on known features of the substrate support.
Abstract:
A method for compensating for an exposure error in an exposure process of a lithographic apparatus that comprises a substrate table, the method comprising: obtaining a dose measurement indicative of a dose of IR radiation that reaches substrate level, wherein the dose measurement can be used to calculate an amount of IR radiation absorbed by an object in the lithographic apparatus during an exposure process; and using the dose measurement to control the exposure process so as to compensate for an exposure error associated with the IR radiation absorbed by the object during the exposure process.
Abstract:
A method of determining contamination of an optical sensor in a lithographic apparatus, the method comprising illuminating a pattern on a patterning device using EUV radiation, projecting patterned reflected EUV radiation towards the optical sensor and thereby forming an aerial image of the pattern, and moving the optical sensor relative to the patterned reflected EUV radiation such that an intensity of EUV radiation measured by the optical sensor varies as a function of the position of the optical sensor, wherein the intensity measured by the optical sensor passes through a minimum, and wherein the method further comprises using the measured intensity to measure contamination of the optical sensor.
Abstract:
A deformable mirror system (300, 400, 500), comprising a monolithic support structure (310, 410, 510), comprising a first side (311) configured to receive a mirror (350, 450, 550); and a second side (312) configured to receive a plurality of actuators (460, 560) such that the actuators are positioned to enable selective deformation of a reflective surface (351, 451, 551) of the mirror.