公开(公告)号：WO2015049087A1

公开(公告)日：2015-04-09

申请号：PCT/EP2014/068932

申请日：2014-09-05

Applicant: ASML NETHERLANDS B.V.

Inventor： YPMA, Alexander ,  MENGER, Jasper ,  DECKERS, David ,  HAN, David ,  KOOPMAN, Adrianus ,  LYULINA, Irina ,  MIDDLEBROOKS, Scott ,  VAN HAREN, Richard ,  WILDENBERG, Jochem

IPC: G03F7/20 ,  G03F9/00

CPC classification number: G03F7/70616 ,  G03F7/70508 ,  G03F7/70525 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70641 ,  G03F9/7092 ,  G06F17/30572

Abstract: In a lithographic process product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each wafer. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose the set of said vectors representing the wafers in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using said component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

Abstract translation: 在光刻工艺中，诸如半导体晶片的产品单元经受光刻图案化操作和化学和物理处理操作。 在执行过程期间分阶段进行对准数据或其他测量，以获得表示在每个晶片上空间分布的点处测量的位置偏差或其他参数的对象数据。 该对象数据用于通过执行多变量分析来获取诊断信息，以将表示所述多维空间中的晶片的所述矢量的集合分解为一个或多个分量向量。 使用所述分量向量提取关于工业过程的诊断信息。 可以基于提取的诊断信息来控制后续产品单元的工业过程的性能。

公开(公告)号：WO2015110191A1

公开(公告)日：2015-07-30

申请号：PCT/EP2014/073645

申请日：2014-11-04

Applicant: ASML NETHERLANDS B.V.

Inventor： WILDENBERG, Jochem ,  MOS, Everhardus, Cornelis

IPC: G03F9/00 ,  G03F7/20

CPC classification number: G03F7/70775 ,  G01B11/272 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70683 ,  G03F9/7003 ,  G03F9/7046

Abstract: Disclosed is a method of determining a measurement subset of metrology point locations which comprises a subset of potential metrology point locations on a substrate. The method comprises identifying a plurality of candidate metrology point locations from the potential metrology point locations. A change in the level of informativity imparted by said measurement subset of metrology point locations which is attributable to the inclusion of that candidate metrology point location into the measurement subset of metrology point locations is evaluated for each of the candidate metrology point locations. The candidate metrology point locations which have the greatest increase in the level of informativity attributed thereto are selected for inclusion into the measurement subset of metrology point locations.

Abstract translation: 公开了一种确定度量点位置的测量子集的方法，其包括衬底上的潜在测量点位置的子集。 该方法包括从潜在的计量点位置识别多个候选计量点位置。 对于候选计量点位置中的每一个，评估归因于将该候选计量点位置包含在计量点位置的测量子集中的测量点位置的所述测量子集所赋予的信息水平的变化。 选择归因于其的信息水平增加最大的候选计量点位置以包含在度量点位置的测量子集中。