公开(公告)号：JP2008068396A

公开(公告)日：2008-03-27

申请号：JP2007236247

申请日：2007-09-12

Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

Inventor： BEX JAN ,  KNAAPEN RAYMOND JACOBUS ,  NIJSSE GERARD JOHANNES PIETER ,  KUMS GERARD

IPC: B81C3/00 ,  B81B1/00

CPC classification number: B81C3/001 ,  B81C2203/032 ,  Y10T428/20 ,  Y10T428/218 ,  Y10T428/219 ,  Y10T428/249953

Abstract: PROBLEM TO BE SOLVED: To improve flatness of a MEMS device so that mating faces of the MEMS device and substrate are joined by using an adhesive. SOLUTION: A method for gluing the MEMS device to the substrate in order to form a MEMS device assembly comprises the steps of: measuring at least one of a thickness profile S100a of the MEMS device and flatness S100b of the mating face of the substrate; S110 applying the adhesive on at least one of the mating face of the MEMS device and mating face of the substrate; and S120 joining the mating faces of the MEMS device and substrate so that the adhesive makes the MEMS device and substrate glue. An amount of the adhesive applied on one of two mating faces or both mating faces is selected so as to compensate the thickness profile of the MEMS device and the locally fluctuated flatness of the mating face of the substrate. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提高MEMS器件的平坦度，使得通过使用粘合剂将MEMS器件和衬底的配合面接合。 解决方案：用于将MEMS器件胶合到衬底以形成MEMS器件组件的方法包括以下步骤：测量MEMS器件的厚度分布S100a和配对面的平坦度S100b中的至少一个 基质; S110将粘合剂施加到MEMS装置的配合面和基板的配合面中的至少一个上; 和S120连接MEMS器件和衬底的配合面，使得粘合剂使得MEMS器件和衬底胶合。 选择施加在两个配合面中的一个或两个配合面上的粘合剂的量，以补偿MEMS装置的厚度分布和基板的配合面的局部波动的平坦度。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：NL2007631A

公开(公告)日：2011-11-23

申请号：NL2007631

申请日：2011-10-20

Applicant: ASML NETHERLANDS BV

Inventor： BRINKHOF EUGENE ,  BEX JAN ,  SIJBEN ANKO ,  DAMEN JOHANNES

IPC: G03F7/20 ,  H01L21/683

公开(公告)号：NL2008630A

公开(公告)日：2012-10-30

申请号：NL2008630

申请日：2012-04-12

Applicant: ASML NETHERLANDS BV

Inventor： BEX JAN ,  KATE NICOLAAS ,  LAFARRE RAYMOND ,  BRINKHOF EUGENE ,  DAMEN JOHANNES ,  KARADE YOGESH

IPC: G03F7/20 ,  H01L21/68