公开(公告)号：NL2024627A

公开(公告)日：2020-01-31

申请号：NL2024627

申请日：2020-01-09

Applicant: ASML NETHERLANDS BV

Inventor： ARNAUD HUBAUX ,  JOHAN FRANCISCUS MARIA BECKERS ,  JOHAN GERTRUDIS CORNELIS KUNNEN ,  WILLEM RICHARD PONGERS ,  DYLAN JOHN DAVID DAVIES ,  AJINKYA RAVINDRA DAWARE ,  MAXIM PISARENCO ,  NICK KANT ,  FREDERIK EDUARD DE JONG ,  HENDRIK CORNELIS ANTON BORGER ,  CHUNG-HSUN LI ,  GEORGIOS TSIROGIANNIS ,  JUAN MANUEL GONZALEZ HUESCA ,  ANDRIY VASYLIOVICH HLOD

IPC: G03F7/20

Abstract: Described is a method and associated computer program and apparatuses for method for making a decision Within a manufacturing process. The method comprises obtaining scanner data relating to one or more parameters of a lithographic exposure step of the manufacturing process and applying a decision 5 model. The decision model outputs a value for each of one or more categorical indicators based on the scanner data, each categorical indicator being indicative of a quality of the manufacturing process. An action is decided upon (e. g., to inspect a substrate as a candidate for rework) based on a value of the categorical indicator. 10 Figure 4.

公开(公告)号：NL2024506A

公开(公告)日：2020-01-13

申请号：NL2024506

申请日：2019-12-19

Applicant: ASML NETHERLANDS BV

Inventor： JOHAN FRANCISCUS MARIA BECKERS ,  DYLAN JOHN DAVID DAVIES ,  SIEGFRIED ALEXANDER TROMP ,  LUCAS HENRICUS JOHANNES STEVENS ,  PAULUS ALBERTUS VAN HAL ,  BEATRIZ SEOANE DE LA CUESTA ,  SATISH ACHANTA ,  JULIEN VAN KUILENBURG

IPC: G03F7/20

Abstract: The present invention relates to methods for reducing wafer load grid and flatness degradation of a substrate holder, such as a wafertable, of a lithographic apparatus. The present invention also relates to systems comprising lithography substrate holders, such as wafertables, with improved resistance to wafer load grid and flatness degradation, and to methods of fabricating devices, e. g. integrated circuits, using such systems. The present invention also relates to substrates, such as wafers, with backsides configured to protect substrate holders, such as wafertables, from wafer load grid and flatness degradation when used in lithography, and to methods of removing hydrophobic coatings from such substrates, such as wafers. The present invention has particular use in connection with lithographic apparatus for fabricating devices, for example integrated circuits.