Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus which reduces sputtering due to gas that has been introduced in an optical path of a projection beam, and to provide a device manufacturing method. SOLUTION: The lithographic apparatus is arranged to project a beam from a radiation source onto a substrate. The lithographic apparatus includes an optical element in an optical path of the beam, a gas inlet for introducing gas into the optical path of the beam so that the gas will be ionized by the beam to create an electric field toward the optical element, and a gas source coupled to the gas inlet for supplying the gas. The gas has a threshold value of kinetic energy for sputtering the optical element that is greater than a kinetic energy developed by ions of the gas in the electric field. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for cleaning elements of a lithographic device, for example, optical elements such as a collector mirror. SOLUTION: The method for cleaning the elements includes the steps of: providing a gas 155 containing nitrogen; generating nitrogen radicals from at least a part of the gas, thereby forming a radical containing gas 165; and providing at least a part of the radical containing gas to the one or more elements 100 of the apparatus. The lithographic apparatus includes a source and an optical element 100, and an electrical discharge generator 200 arranged so as to generate a radio frequency discharge. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for cleaning elements of a lithographic device, especially a method for cleaning one or more optical elements of the lithographic device. SOLUTION: This method for cleaning elements of the lithographic device, for example, optical elements such as a collector mirror, includes a step for supplying gas containing nitrogen, a step for forming a radical-containing gas by generating nitrogen radicals from at least a part of the gas containing nitrogen, and a step for supplying at least a part of the radical-containing gas to one or more elements of the lithographic device. The lithographic device comprises a source, an optical element and an electrical discharge generator arranged to generate a radio frequency discharge. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography apparatus that can be used in a vacuum or semi-vacuum environment. SOLUTION: A lithography projection apparatus has a radiation system for supplying projection beams of radiation, a mask table provided with a mask holder for holding a mask, a substrate table provided with a substrate holder for holding a substrate, and a projection system for imaging a mask's radiated part onto a target portion of the substrate, wherein at least one gas purge ceiling opening is provided that operates between different zones of the apparatus, and one or more gases are supplied from the opening, the gases out of groups composed of hydrogen, heavy hydrogen, and a mixture of argon and hydrogen. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an EUV lithography apparatus, a cleaning configuration for efficiently removing contaminant for the apparatus, and a cleaning configuration for recovering reflectivity of an EUV optical component. SOLUTION: A collector CO is disposed, for example, in a cleaning cocoon so as for the collector CO to be disposed between two particular volumes or enclosures 12 and 14. Radicals such as H radicals are generated in one or both of the volumes 12 and 14, and a pressure region in a range of 1 to 10 Pa is used to produce a flux such that the radicals are moved in the collector CO. The H radicals are moved from the volume 12 to the volume 14, thereby they collide with a wall of the collector CO, so that they can clean a Sn contaminant or the like on the wall of the collector CO. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus for reducing sputtering caused by gas introduced to a projection beam optical path, and a method for manufacturing the apparatus. SOLUTION: The lithographic apparatus is arranged to project a beam from a radiation source to a substrate. The lithographic apparatus includes an optical element in an optical path of the beam, a gas inlet for introducing gas into the optical path of the beam so that the gas is ionized by the beam to a create electric field toward the optical element, and a gas source coupled to the gas inlet for supplying the gas. The gas has a threshold of kinetic energy that is greater than kinetic energy developed by ions of the gas in the electric fields for sputtering the optical element. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide new dose control methods in order to optimize the number of dies that can be exposed per unit of time.SOLUTION: The EUV exposure dose in a lithographic apparatus is controlled pulse by pulse by varying the conversion efficiency with which a pulse of EUV radiation is generated from excitation of a fuel material by a corresponding pulse of excitation laser radiation. The conversion efficiency can be varied in several different ways, by varying the proportion of a fuel material that interacts with a laser beam, and/or by varying quality of the interaction. Mechanisms of varying the conversion efficiency can be based on variation of laser pulse timing, variation of pre-pulse energy, and/or variable displacement of a main laser beam in one or more directions. Steps of maintaining symmetry of the generated EUV radiation can be included.
Abstract:
PROBLEM TO BE SOLVED: To provide a high-speed method of detecting a particle on an arbitrary pattern. SOLUTION: A thermal radiation from a mask MA is detected using a system and a method. A debris particle D on the mask MA is heated, but not cooled rapidly like a peripheral mask. Radiations emitted from the particle D and mask MA are different in wavelength because of the resulting temperature difference. Therefore, the thermal radiation is detected to detect presence of the particle D deposited on the mask. When the particle D is detected, the mask MA can be cleaned. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation source capable of short wavelength emission like extreme ultraviolet emission for use by lithography. SOLUTION: This radiation source has rotating electrodes 14, 16 to be immersed in respective tanks 18, 20 for liquid metal like tin. Discharge is caused between the electrodes 14 and 16, resulting in emission. To ensure that pumping is improved to result in low voltage generation in the proximity of discharge for source conversion efficiency improvement, holes are created on a shielding metal plate on the electrodes 14, 16 and/or on the periphery of the electrodes 14, 16. These holes for the electrodes 14, 16 effectively cool the electrodes 14, 16 through liquid metal agitation and electric contact improvement between the electrodes 14, 16 and the liquid metal. This electric contact improvement also lowers the time constant of a discharge circuit, so that the source conversion efficiency is further improved. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
A radiation system for generating a beam of radiation that defines an optical axis is provided. The radiation system includes a plasma produced discharge source for generating EUV radiation. The discharge source includes a pair of electrodes constructed and arranged to be provided with a voltage difference, and a system for producing a plasma between the pair of electrodes so as to provide a discharge in the plasma between the electrodes. The radiation system also includes a debris catching shield for catching debris from the electrodes. The debris catching shield is constructed and arranged to shield the electrodes from a line of sight provided in a predetermined spherical angle relative the optical axis, and to provide an aperture to a central area between the electrodes in the line of sight.