Abstract:
PROBLEM TO BE SOLVED: To provide an efficient and effective cleaning method of an optical element used in a lithographic projection apparatus without employing any unstable material. SOLUTION: Purge gas containing a small amount of molecular oxygen is supplied from a gas supplying source 4 into a space 2 receiving the optical element 3 used in a lithographic projection apparatus. The optical element is irradiated with a UV radiation beam from a radiation source LA for mask pattern projection or a radiation source 7 exclusive for purge whereby the beam of radiation decomposes oxygen and produces an oxygen radical which cleans the optical element very effectively. When the partial pressure of the molecular oxygen contained in the purge gas is from 1×10 -4 Pa to 1 Pa, sufficient cleaning can be effected within a short time. According to this method, an unstable material such as ozone or the like is not used whereby an excessive work such as the preparation of the purge gas is not required and the optical element can be cleaned simultaneously with the exposure of the substrate, thereby not requesting the optical element removed from the lithographic apparatus. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus which reduces sputtering due to gas that has been introduced in an optical path of a projection beam, and to provide a device manufacturing method. SOLUTION: The lithographic apparatus is arranged to project a beam from a radiation source onto a substrate. The lithographic apparatus includes an optical element in an optical path of the beam, a gas inlet for introducing gas into the optical path of the beam so that the gas will be ionized by the beam to create an electric field toward the optical element, and a gas source coupled to the gas inlet for supplying the gas. The gas has a threshold value of kinetic energy for sputtering the optical element that is greater than a kinetic energy developed by ions of the gas in the electric field. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system and method for cleaning the surface of a component of a lithography projector, a lithography projector, and a method for manufacturing a device. SOLUTION: The cleaning system (100) for removing contaminant (105) at least from a part of the surface (104) of the component (101) in the lithography projector (1) comprises a cleaning particle supplier for supplying cleaning particles in the vicinity of the surface, and the cleaning particle supplier has an electric field generator (106, V) for generating an electric field (107). Moreover, by this method the contaminant (105) is removed at least from a part of the surface (104) of the component (101) of the lithography projector (1). The method comprises steps of: generating an electric field at least at a part of the lithography projector; supplying the cleaning particles in the vicinity of the contaminant by using the electric field (107); and removing the contaminant by the interaction between the cleaning particles and the contaminant. Thus, the contaminant (105) is removed from the surface (104). COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography apparatus that can be used in a vacuum or semi-vacuum environment. SOLUTION: A lithography projection apparatus has a radiation system for supplying projection beams of radiation, a mask table provided with a mask holder for holding a mask, a substrate table provided with a substrate holder for holding a substrate, and a projection system for imaging a mask's radiated part onto a target portion of the substrate, wherein at least one gas purge ceiling opening is provided that operates between different zones of the apparatus, and one or more gases are supplied from the opening, the gases out of groups composed of hydrogen, heavy hydrogen, and a mixture of argon and hydrogen. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for measuring the contamination on the surfaces of the constituent components of a lithographic projection apparatus. SOLUTION: The measuring apparatus includes a radiation transmitter for projecting radiation onto at least a part of the surface of each component of a lithographic projection apparatus and a radiation receiver which receives radiation from each constituent component. A processor, which is connected to the radiation receiver through communication, obtains the characteristics of the received radiation, and then determines the characteristics of the contamination on the basis of the radiation characteristics. The measuring apparatus comprises the steps of: projecting the radiation to the surface of each component, receiving the radiation from each component, and determining the characteristics of the contamination on the basis of the received radiation. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus in which it is unlikely that the lifetime of optical elements is reduced due to etching and sputtering caused by ionization of the background gas. SOLUTION: An optically activated device configured so as to guide radiation beam or patterned radiation beam M and a support structure 12, configured so as to support optically activated devices M1 to M6 are provided; and further, a gas supplier 14 for supplying a background gas 16 to a system is also provided. The radiation beam or the patterned radiation beam and the background gas react, and a plasma containing a plurality of ions is formed. The support structure comprises an element 20, provided with a material with a small sputter rate, a material with a large sputter threshold energy, or a material with a large ion implantation yield, in order to suppress the sputtering and the generation of sputtering product. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus for reducing sputtering caused by gas introduced to a projection beam optical path, and a method for manufacturing the apparatus. SOLUTION: The lithographic apparatus is arranged to project a beam from a radiation source to a substrate. The lithographic apparatus includes an optical element in an optical path of the beam, a gas inlet for introducing gas into the optical path of the beam so that the gas is ionized by the beam to a create electric field toward the optical element, and a gas source coupled to the gas inlet for supplying the gas. The gas has a threshold of kinetic energy that is greater than kinetic energy developed by ions of the gas in the electric fields for sputtering the optical element. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a cleaning system, a method, a lithographic projection device and a device manufacturing method excellent in controlling contamination removal from the front surface of an element in a lithographic projection device. SOLUTION: The cleaning system (100) that removes at least a part of the contamination (105) from the front surface (104) of the element (101) in the lithographic projection device, is provided with a cleaning particle feeder that feeds cleaning particles in the vicinity of the surface, the cleaning particle feeder is provided with an electric field generator (106, V) that generates an electric field (107). Further, the system includes a step that generates an electric field in at least a part of the lithographic projection device, a step that feeds the cleaning particles in the vicinity of the contamination by the electric field (107), and a step that removes the contamination by an interaction of the cleaning particles and contamination, thereby removing the contamination (105) from the surface (104). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a box which is capable of protecting a lithography patterning device against external contaminants and making its throughput optimal. SOLUTION: The transfer box 2 is equipped with an internal space 10 provided with a housing position at which the patterning device is housed and a container 8 provided with an opening used for transferring the patterning device. The internal space 10 is pressurized before the patterning device is transferred from the internal space 10 to a lithography apparatus. The box is equipped with a closure which closes the opening and/or a channel system 18 which discharges gas from the internal space 10 of the box to / and/or supplies the gas from / to the internal space of the box, and the lithography apparatus which is so constituted as to collaborate with the box device is included. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic projection apparatus in which optical components can be cleaned with stabilized detergent. SOLUTION: The cleaning of optical components for use in a lithographic projection apparatus can be carried out by irradiating a space within the apparatus containing the optical component with UV or EUV radiation having a wavelength of less then 250 nm, in the presence of an oxygen-containing species selected from water, nitrogen oxide and oxygen-containing hydrocarbons. Generally, the space is purged with purge gas which contains a small amount of the oxygen-containing species in addition to a usual purge gas composition. Technique can also be used in an evacuated space by introducing the low pressure of the oxygen-containing species into the space. This technique has an advantage that the use of unstable materials such as ozone is avoided. COPYRIGHT: (C)2003,JPO