Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus which reduces sputtering due to gas that has been introduced in an optical path of a projection beam, and to provide a device manufacturing method. SOLUTION: The lithographic apparatus is arranged to project a beam from a radiation source onto a substrate. The lithographic apparatus includes an optical element in an optical path of the beam, a gas inlet for introducing gas into the optical path of the beam so that the gas will be ionized by the beam to create an electric field toward the optical element, and a gas source coupled to the gas inlet for supplying the gas. The gas has a threshold value of kinetic energy for sputtering the optical element that is greater than a kinetic energy developed by ions of the gas in the electric field. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography apparatus that can be used in a vacuum or semi-vacuum environment. SOLUTION: A lithography projection apparatus has a radiation system for supplying projection beams of radiation, a mask table provided with a mask holder for holding a mask, a substrate table provided with a substrate holder for holding a substrate, and a projection system for imaging a mask's radiated part onto a target portion of the substrate, wherein at least one gas purge ceiling opening is provided that operates between different zones of the apparatus, and one or more gases are supplied from the opening, the gases out of groups composed of hydrogen, heavy hydrogen, and a mixture of argon and hydrogen. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for measuring the contamination on the surfaces of the constituent components of a lithographic projection apparatus. SOLUTION: The measuring apparatus includes a radiation transmitter for projecting radiation onto at least a part of the surface of each component of a lithographic projection apparatus and a radiation receiver which receives radiation from each constituent component. A processor, which is connected to the radiation receiver through communication, obtains the characteristics of the received radiation, and then determines the characteristics of the contamination on the basis of the radiation characteristics. The measuring apparatus comprises the steps of: projecting the radiation to the surface of each component, receiving the radiation from each component, and determining the characteristics of the contamination on the basis of the received radiation. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an EUV lithography apparatus, a cleaning configuration for efficiently removing contaminant for the apparatus, and a cleaning configuration for recovering reflectivity of an EUV optical component. SOLUTION: A collector CO is disposed, for example, in a cleaning cocoon so as for the collector CO to be disposed between two particular volumes or enclosures 12 and 14. Radicals such as H radicals are generated in one or both of the volumes 12 and 14, and a pressure region in a range of 1 to 10 Pa is used to produce a flux such that the radicals are moved in the collector CO. The H radicals are moved from the volume 12 to the volume 14, thereby they collide with a wall of the collector CO, so that they can clean a Sn contaminant or the like on the wall of the collector CO. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus for reducing sputtering caused by gas introduced to a projection beam optical path, and a method for manufacturing the apparatus. SOLUTION: The lithographic apparatus is arranged to project a beam from a radiation source to a substrate. The lithographic apparatus includes an optical element in an optical path of the beam, a gas inlet for introducing gas into the optical path of the beam so that the gas is ionized by the beam to a create electric field toward the optical element, and a gas source coupled to the gas inlet for supplying the gas. The gas has a threshold of kinetic energy that is greater than kinetic energy developed by ions of the gas in the electric fields for sputtering the optical element. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
A lithographic apparatus configured to project a patterned beam of radiation onto a target portion of a substrate is disclosed. The apparatus includes a first radiation dose detector (10A) and a second radiation dose detector (10B), each detector comprising a secondary electron emission surface (11) configured to receive a radiation flux and to emit secondary electrons due to the receipt of the radiation flux, the first radiation dose detector located upstream with respect to the second radiation dose detector viewed with respect to a direction of radiation transmission, and a meter (13), connected to each detector, to detect a current or voltage resulting from the secondary electron emission from the respective electron emission surface.
Abstract:
A method to clean optical elements of an apparatus, the apparatus being configured to project a beam of radiation onto a target portion of a substrate, the apparatus comprising a plurality of optical elements arranged in sequence in the path of the radiation beam, wherein the cleaning method comprises: cleaning one or more second optical elements of the sequence, which receive one or more relatively low second radiation doses during operation of the apparatus, utilizing cumulatively shorter cleaning periods than one or more first optical elements of the sequence that receive one or more first radiation doses during operation of the apparatus, a second radiation dose being lower than each relatively high first radiation dose.
Abstract:
To reduce the negative influence of metallic contamination within an EUV lithography device on the reflectivity, a reflective optical element (50) for the extreme ultraviolet and soft x-ray wavelength ranges having a reflective surface is suggested, in which the reflective surface (59) has an uppermost layer (56) made of a material of the group consisting of zinc, manganese, silver, lead, tin, and their alloys. Further material from the group consisting of zinc, manganese, silver, lead, tin, and their alloys, which would accumulate during operation of the EUV lithography device on the reflective optical element (50) is converted into volatile compounds by adding atomic hydrogen.
Abstract:
A lithographic apparatus that includes an illumination system configured to condition a radiation beam. The illumination system includes a plurality of optical components. The apparatus also includes a support constructed to support a patterning device. The patterning device is capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. The apparatus further includes a substrate table constructed to hold a substrate, and a projection system configured to project the patterned radiation beam onto a target portion of the substrate. The projection system includes a plurality of optical components. The apparatus also includes a contamination measurement unit for measuring contamination of a surface of at least one of the optical components. The contamination measurement unit is provided with a radiation sensor constructed and arranged to measure an optical characteristic of radiation received from the surface.
Abstract:
The invention relates to an optical arrangement, in particular a projection exposure apparatus (1) for EUV lithography, comprising: a housing (2) that encloses an interior space (15); at least one, in particular reflective, optical element (4 to 10, 12, 14.1 to 14.6) that is arranged in the housing (2); at least one vacuum generating unit (3) for generating a vacuum in the interior space (15) of the housing (2); and at least one vacuum housing (18, 18.1 to 18.10) that is arranged in the interior space (15) of the housing (2) and that encloses at least the optical surface (17, 17.1, 17.2) of the optical element (4 to 10, 12, 14.1 to 14.5), wherein a contamination reduction unit is associated with the vacuum housing (18.1 to 18.10), which contamination reduction unit reduces the partial pressure of contaminating substances, in particular of water and/or hydrocarbons, at least in close proximity to the optical surface (17, 17.1, 17.2) in relation to the partial pressure of the contaminating substances in the interior space (15).