Abstract:
PROBLEM TO BE SOLVED: To improve a calculating method for an alignment beam angle of an alignment system, and a verification method for front surface-rear surface alignment (FTBA) error. SOLUTION: To calculate the alignment beam angle of the alignment system of a lithography apparatus, two alignment mark positions are measured, and the two alignment marks are formed on a measuring substrate, or arranged on a substrate table of the lithography apparatus. A second mark is covered with a transparent plate, and the two mark positions are measured with the alignment system. By refraction of the alignment beam by the transparent plate, the alignment beam returning to the alignment system shifts. The second mark is measured while being out of alignment due to shift of the alignment beam. Since the distance between two marks has been known, the shift can be calculated. The shift is used for calculation for the alignment beam angle, and the verification method for the FTBA error is improved by the angle. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To perform alignment with high accuracy. SOLUTION: A lithography method includes patterning a radiation beam by a pattering device. The patterning device includes at least two image patterning portions and at least two methodology mark patterning portions. The method includes successively projecting at least two image portions of a patterned radiation beam on the target potion of a substrate so that projected image portions are mutually adjoining on the substrate to form a combined image collectively on the substrate. The method includes projecting at least two images respectively, and projecting the methodology mark on the substrate at the same time in the region outside of the combined image to measure the alignment of the methodology mark to define the relative position of at least two figure portions. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a system for three-dimensional alignment for wafer scale integration. SOLUTION: A board bonding system is provided with first and second board tables to hold first and second boards, and a controller. The first board is equipped with a first device having a first contact pad, and the second board is equipped with a second device having a second contact pad. The wafer bonding system is designed to conduct bonding of the first and second devices so that a circuit can be formed by the first and second devices. First and second board tables ST and STb are respectively provided with a position sensor to measure optical signals generating on alignment markers WM1, WM1', WM2, and WM2', and WM1b, WM1b', WM2b and WM2b' of the first and second boards. Furthermore, they are provided with first and second actuators ACT and ACTb to change the position and the orientation of the respective board tables. COPYRIGHT: (C)2006,JPO&NCIPI