公开(公告)号：JP2006186352A

公开(公告)日：2006-07-13

申请号：JP2005350407

申请日：2005-12-05

Applicant: ASML NETHERLANDS BV

Inventor： SIMON KLAUS ,  VAN DEN BRINK ENNO ,  KEIJSERS GERARDUS JOHANNES JOS ,  VAN DIJK ADRIANUS HUBERTUS HEN ,  BAIJENS HUBERTUS ANTONIUS MARI

IPC: H01L21/027 ,  G03F7/20

Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for facilitating measures for any problem that contamination or damage is generated in a projection lens or its peripheral region due to gas emission of volatile components in resist during radiation exposure. SOLUTION: This lithography system projects a patterned radiation beam on the target of a substrate containing a radiation photosensitive layer by a radiation source, a patterning structure and a projection system is provided with a gas flashing system for supplying air from a region between the projection system and the substrate in order to remove gas spread from the target section while the target section is exposed by the patterned radiation beam. COPYRIGHT: (C)2006,JPO&NCIPI

公开(公告)号：JP2006186377A

公开(公告)日：2006-07-13

申请号：JP2005375546

申请日：2005-12-27

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  PHILLIPPS GEOFFREY NORMAN ,  BIJNEN FRANCISCUS GODEFRIDUS C ,  VAN DEN BRINK ENNO ,  VAN BUEL HENRICUS WILHELMUS MA ,  CONSOLINI JOSEPH J ,  TEN BERGE PETER

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To provide a method and a system for three-dimensional alignment for wafer scale integration. SOLUTION: A board bonding system is provided with first and second board tables to hold first and second boards, and a controller. The first board is equipped with a first device having a first contact pad, and the second board is equipped with a second device having a second contact pad. The wafer bonding system is designed to conduct bonding of the first and second devices so that a circuit can be formed by the first and second devices. First and second board tables ST and STb are respectively provided with a position sensor to measure optical signals generating on alignment markers WM1, WM1', WM2, and WM2', and WM1b, WM1b', WM2b and WM2b' of the first and second boards. Furthermore, they are provided with first and second actuators ACT and ACTb to change the position and the orientation of the respective board tables. COPYRIGHT: (C)2006,JPO&NCIPI

公开(公告)号：JP2003318105A

公开(公告)日：2003-11-07

申请号：JP2003106573

申请日：2003-04-10

Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

Inventor： VAN DE MOOSDIJK MICHAEL JOSEPH ,  SIMON KLAUS ,  VAN DEN BRINK ENNO

IPC: G03F7/20 ,  H01L21/027

CPC classification number: G03F7/70475 ,  G03F7/70466

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a device, which minimizes or eliminates at least a portion of error sources in positional adjustment of adjacent exposure portions.
SOLUTION: A projection field is selected so as to minimize a stitching error, in order to print a layer of an extended device, i.e., a device extending into a plurality of target portions or dies. It is desirable that the projection field is selected based on the data characterizing a used projection lens, and in such a way that the difference between positional errors of a projected image at the side opposite to the field is minimized.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种使相邻曝光部分的位置调整中的误差源的至少一部分最小化或消除的装置的制造方法。

解决方案：选择投影场以便最小化缝合误差，以便打印延伸装置的层，即延伸到多个目标部分或管芯中的装置。 期望基于表征所使用的投影透镜的数据来选择投影场，并且使得与场的相反侧的投影图像的位置误差之间的差最小化。 版权所有（C）2004，JPO