公开(公告)号：KR20180072768A

公开(公告)日：2018-06-29

申请号：KR20187014221

申请日：2016-09-27

Applicant: ASML NETHERLANDS BV

Inventor： TEN BERGE PETER ,  MULKENS JOHANNES CATHARINUS HUBERTUS ,  KASTRUP BERNARDO ,  VAN HAREN RICHARD JOHANNES FRANCISCUS

IPC: G03F1/72 ,  G03F7/20

CPC classification number: G03F1/72

Abstract: 패터닝시스템에서의패터닝디바이스에관한측정및/또는시뮬레이션결과에기초하여제 1 기판의영역이핫 스폿(710)을포함함을식별하는단계, 핫스폿에서의제 1 오차정보(720)를결정하는단계, 및컴퓨터시스템에의하여, 수정된패터닝디바이스를얻기위해제 1 오차정보에기초하여패터닝디바이스를수정하는제 1 수정정보(상기정보는 740에서패터닝디바이스와함께패터닝수정툴로전달됨)를생성하는단계(730)를포함하는방법이개시된다.

公开(公告)号：KR20180070658A

公开(公告)日：2018-06-26

申请号：KR20187013952

申请日：2016-09-26

Applicant: ASML NETHERLANDS BV

Inventor： VAN HAREN RICHARD JOHANNES FRANCISCUS ,  MOS EVERHARDUS CORNELIS ,  TEN BERGE PETER ,  WARDENIER PETER HANZEN ,  JENSEN ERIK ,  CEKLI HAKKI ERGUN

IPC: G03F7/20

CPC classification number: G03F7/70625 ,  G03F7/705

Abstract: 본발명은, 패터닝디바이스를포함하는패터닝프로세스에서패터닝에러에관한정보를획득하는단계; 상기패터닝에러정보에따라수정장치에의해상기패터닝에러를수정하여도입된시간주기에걸친비선형성을결정하는단계; 및상기결정된비선형성에기초하여수정장치와함께사용하기위한패터닝에러오프셋을컴퓨터시스템에의해결정하는단계를포함하는방법을제공한다

公开(公告)号：KR20180069053A

公开(公告)日：2018-06-22

申请号：KR20187014222

申请日：2016-09-27

Applicant: ASML NETHERLANDS BV

Inventor： TEN BERGE PETER ,  SLOTBOOM DAAN MAURITS ,  VAN HAREN RICHARD JOHANNES FRANCISCUS ,  WARDENIER PETER HANZEN

IPC: G03F1/72 ,  G03F1/70 ,  G03F7/20

CPC classification number: G03F1/72

Abstract: 패터닝시스템에서의제 1 패터닝디바이스에관한제 1 측정및/또는시뮬레이션결과(1300)에기초하여제 1 오차정보(1310)를결정하는단계; 패터닝시스템에서의제 2 패터닝디바이스에관한제 2 측정및/또는시뮬레이션결과(1320)에기초하여제 2 오차정보(1330)를결정하는단계; 제 1 오차정보와제 2 오차정보간의차이(1340)를결정하는단계; 및컴퓨터에의해, 제 1 오차정보와제 2 오차정보간의차이에기초하여제 1 패터닝디바이스및/또는제 2 패터닝디바이스에대한수정정보(1360)를생성하는단계를포함한방법이개시되고, 제 1 오차정보와제 2 오차정보간의차이는제 1 패터닝디바이스및/또는제 2 패터닝디바이스가수정정보에따라수정된후, 소정범위내로감소된다.

公开(公告)号：KR20180072760A

公开(公告)日：2018-06-29

申请号：KR20187014163

申请日：2016-09-28

Applicant: ASML NETHERLANDS BV

Inventor： TEN BERGE PETER ,  MOS EVERHARDUS CORNELIS ,  VAN HAREN RICHARD JOHANNES FRANCISCUS ,  WARDENIER PETER HANZEN ,  JENSEN ERIK ,  KASTRUP BERNARDO ,  KUBIS MICHAEL ,  MULKENS JOHANNES CATHARINUS HUBERTUS ,  DECKERS DAVID FRANS SIMON ,  HENKE WOLFGANG HELMUT ,  LEE JOUNGCHEL

IPC: G03F1/72 ,  G03F7/20

CPC classification number: G03F1/72 ,  G03F7/70425 ,  G03F7/70625

Abstract: 패터닝시스템의에칭툴에의해처리된이후에패턴의측정및/또는시뮬레이션결과를획득하는단계, 에칭로딩(etch loading) 효과에기인한패터닝오차를상기측정및/또는시뮬레이션결과에기초하여결정하는단계, 및컴퓨터시스템에의하여, 상기패터닝오차에기초하여, 상기패터닝시스템내에서상기에칭툴로부터업스트림에있는패터닝디바이스를수정하기위한및/또는수정장치를조절하기위한수정정보를생성하는단계를포함하고, 상기패터닝디바이스가상기수정정보에따라수정되고및/또는상기수정장치가상기수정정보에따라조절되는경우, 상기패터닝오차는정정가능오차로변환되고및/또는특정범위로감소되는, 방법.

公开(公告)号：KR20180069044A

公开(公告)日：2018-06-22

申请号：KR20187013904

申请日：2016-09-26

Applicant: ASML NETHERLANDS BV

Inventor： TEN BERGE PETER ,  MOS EVERHARDUS CORNELIS ,  VAN HAREN RICHARD JOHANNES FRANCISCUS ,  WARDENIER PETER HANZEN ,  JENSEN ERIK

IPC: G03F1/70 ,  G03F1/72 ,  G03F7/20

CPC classification number: G03F1/70 ,  G03F1/72

Abstract: 방법은, 컴퓨터시스템에의하여, 패터닝시스템내의패터닝디바이스를수반하는패터닝프로세스의고분해능패터닝오차정보를오차수학모델을사용하여모델링하는단계, 상기컴퓨터시스템에의하여, 패터닝디바이스수정툴에의하여이루어질수 있는패터닝오차의정정을정정수학모델을사용하여모델링하는단계 - 상기정정수학모델은상기오차수학모델과실질적으로동일한분해능을가짐 -, 및상기컴퓨터시스템에의하여, 상기오차수학모델에의하여모델링된패터닝오차정보에상기정정수학모델을적용함으로써, 상기패터닝디바이스수정툴을사용하여상기패터닝디바이스를수정하기위한수정정보를결정하는단계를포함한다.

公开(公告)号：JP2008160083A

公开(公告)日：2008-07-10

申请号：JP2007300100

申请日：2007-11-20

Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

Inventor： BEST KEITH FRANK ,  GUI CHENG-QUN ,  DAVID CHRISTOPHER OCKWELL ,  TEN BERGE PETER

IPC: H01L21/60

CPC classification number: H01L21/6835 ,  H01L21/67115 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a device which forms a ring-shaped resist pattern for forming bumps in a substrate by electrodepositing.
SOLUTION: The apparatus includes a substrate holder arranged to hold a substrate W coated at least in part with resist R, and a heating device configured to heat an area of the resist. The relative movement between the substrate holder and the heating device HD is possible. The movement is arranged such that, in use of the ring seal forming apparatus, the area of resist heated by the heating device HD is ring-shaped, so that the ring-shaped resist pattern can be formed.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种通过电沉积形成用于在基板中形成凸块的环形抗蚀剂图案的装置。 解决方案：该装置包括衬底保持器，其被布置成保持至少部分地涂覆有抗蚀剂R的衬底W;以及加热装置，其构造成加热抗蚀剂的区域。 衬底保持器和加热装置HD之间的相对运动是可能的。 该移动被配置为使用环形密封形成装置，由加热装置HD加热的抗蚀剂的面积是环状的，从而可以形成环状的抗蚀剂图案。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006186377A

公开(公告)日：2006-07-13

申请号：JP2005375546

申请日：2005-12-27

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  PHILLIPPS GEOFFREY NORMAN ,  BIJNEN FRANCISCUS GODEFRIDUS C ,  VAN DEN BRINK ENNO ,  VAN BUEL HENRICUS WILHELMUS MA ,  CONSOLINI JOSEPH J ,  TEN BERGE PETER

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To provide a method and a system for three-dimensional alignment for wafer scale integration. SOLUTION: A board bonding system is provided with first and second board tables to hold first and second boards, and a controller. The first board is equipped with a first device having a first contact pad, and the second board is equipped with a second device having a second contact pad. The wafer bonding system is designed to conduct bonding of the first and second devices so that a circuit can be formed by the first and second devices. First and second board tables ST and STb are respectively provided with a position sensor to measure optical signals generating on alignment markers WM1, WM1', WM2, and WM2', and WM1b, WM1b', WM2b and WM2b' of the first and second boards. Furthermore, they are provided with first and second actuators ACT and ACTb to change the position and the orientation of the respective board tables. COPYRIGHT: (C)2006,JPO&NCIPI

公开(公告)号：WO2006024908A2

公开(公告)日：2006-03-09

申请号：PCT/IB2005002359

申请日：2005-06-30

Applicant: ASML NETHERLANDS BV ,  TEN BERGE PETER

Inventor： TEN BERGE PETER

IPC: G03F7/00

CPC classification number: B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/70216 ,  G03F9/00 ,  G03F9/7042 ,  G03F9/7084

Abstract: An imprint lithography apparatus comprising a template (34), a substrate table (31) and an alignment system. (35, 36, 37) arranged to align. the template (34) to a substrate alignment t mark (39; 39`) provided on a substrate (30). The substrate table (31) is arranged to support the substrate (30) having a first surface (32) to be imprinted andd a second surface (50) facing the substrate table (31). The apparatus is characterised in that the substrate alignment mark (39; 39') is provided on the second surface (50) of the substrate (30), and that the substrate table (31) further comprises a substrate table optical. system for allowing the substrate alignment mark (39; 39') to be viewed by the alignment system. (35. 36, 37). The invention further extends to a device manufacturing method and a device manufactured thereby.

Abstract translation: 一种压印光刻设备，包括模板（34），衬底台（31）和对准系统。 （35,36,37）被布置成对齐。 将模板（34）固定到设置在衬底（30）上的衬底对准标记（39; 39'）。 衬底台（31）被布置成支撑具有待压印的第一表面（32）的衬底（30），并且支撑面对衬底台（31）的第二表面（50）。 该设备的特征在于，衬底对准标记（39; 39'）设置在衬底（30）的第二表面（50）上，并且衬底台（31）还包括衬底台光学器件。 系统，用于允许基板对准标记（39; 39'）被对准系统看到。 （35. 36,37）。 本发明还涉及一种器件制造方法和由此制造的器件。

公开(公告)号：DE602004015397D1

公开(公告)日：2008-09-11

申请号：DE602004015397

申请日：2004-11-26

Applicant: ASML NETHERLANDS BV

Inventor： TEN BERGE PETER ,  KEIJSERS GERARDUS JOHANNES JOS

IPC: G03F9/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/68

Abstract: A plurality of markers are printed in resist on a substrate at a range of angles relative to a crystal axis of the substrate. The markers are etched in to the substrate using an anisotropic etch process, the markers being such that after the etch their apparent positions are dependent on their orientation relative to the crystal axis. The apparent positions of the markers are measured and from this the orientation of the crystal axis is derived.

公开(公告)号：SG112071A1

公开(公告)日：2005-06-29

申请号：SG200406966

申请日：2004-11-30

Applicant: ASML NETHERLANDS BV

Inventor： TEN BERGE PETER ,  KEIJSERS GERARDUS JOHANNES JOS

IPC: G03F9/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/68

Abstract: A plurality of markers are printed in resist on a substrate at a range of angles relative to a crystal axis of the substrate. The markers are etched in to the substrate using an anisotropic etch process, the markers being such that after the etch their apparent positions are dependent on their orientation relative to the crystal axis. The apparent positions of the markers are measured and from this the orientation of the crystal axis is derived.