Abstract:
PROBLEM TO BE SOLVED: To provide an inspection apparatus, a lithographic apparatus, and the like each of which, when measuring the profile of an object that is printed on top of a stack of product layers, can minimize or eliminate the number of degrees of freedom brought into the reconstruction equation by any product layers. SOLUTION: To prevent an unknown parameters of one or more product layers having an effect on the measurement of the object profile, the thickness of the one or more product layers is measured prior to measuring the profile of the scatterometry object on the layer(s). In an embodiment, each of a plurality of product layers is measured as it is exposed so that only the degree of freedom of the most recently exposed product layer is unknown at each measurement step. After each of a plurality of product layers has been measured with a scatterometry object placed at the top of the layers, only the degrees of freedom of that scatterometry object should be unknown and only the profile of the object should need to be measured. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that widths of a characteristic form printed at two exposure steps differ in double exposure. SOLUTION: This method of manufacturing a device includes a step of printing the characteristic form of a primary set on the target portion of a substrate, a step of measuring the minimum dimension of the characteristic form of the primary set, a step of calculating setting to the print process for the second printing characteristic form set on the target portion in the minimum dimension coincident at a minimum dimension by which the characteristic form of the primary set has been measured, and a step of printing the characteristic form of the second set which is interleaved with the characteristic form of the primary set by using the calculated setting. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
The invention relates to a method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus. First a set of grid models is provided. Subsequently, alignment data are obtained by performing an alignment measurement on a plurality of alignment marks on a number of substrates. For each grid model it is checked whether the alignment data is suitable to solve the grid model. If so, the grid model is added to a subset of grid models. The grid model with lowest residuals is selected. In addition to alignment data, metrology data may be obtained by performing an overlay measurement on a plurality of overlay marks on the number of substrates. For each grid model of the subset simulated metrology data may then be determined that is used to determine overlay performance indicators. The grid model is then selected using the overlay performance indicators.