WAFER HANDLING SYSTEM AND WAFER CARRYING METHOD FOR IT

    公开(公告)号:JP2001250855A

    公开(公告)日:2001-09-14

    申请号:JP2000380352

    申请日:2000-12-14

    Abstract: PROBLEM TO BE SOLVED: To provide a wafer handling system for increasing wafer treatment capacity by decreasing contamination in a treatment chamber, and a wafer carrying method for it. SOLUTION: A wafer handling system 200 is provided with a load lock chamber 206 for wafers, a treatment chamber 202 for wafers, and a carrying chamber 204 that connects the load lock chamber to the treatment chamber and includes a wafer carrying mechanism. A wafer mechanism is provided with a carrying arm that is connected to one portion of the carrying chamber 204 forming one axis rotatably, and the carrying arm can be rotated around a single axis for carrying the wafers between the load lock chamber 206 and the treatment chamber by single axis operation. The method for carrying wafers includes steps for placing the wafers in the load lock chamber 206, rotating the carrying arm into the load lock chamber to take out the wafers, rotating the carrying arm out of the load lock chamber 206 into the treatment chamber, and placing the wafers in the treatment chamber 202.

    MASS SPECTROMETER, ION IMPLANTATION APPARATUS, AND ION BEAM SEALING METHOD

    公开(公告)号:JP2002134049A

    公开(公告)日:2002-05-10

    申请号:JP2001223303

    申请日:2001-07-24

    Abstract: PROBLEM TO BE SOLVED: To provide a mass spectrometer, an ion implantation apparatus, and an ion beam sealing method. SOLUTION: The ion implantation apparatus includes a mass spectrometry magnet 114, a power source 174 applying an electric field to a passage 139, and a magnetic apparatus 170 applying a multi-cusp magnetic field to the passage 139. The power source 174 and the magnetic apparatus 170 collaborate each other in giving an electron cyclotron resonance(ECR) condition at lease along a part of the passage 139. The mult-cusp magnetic field is polymerized with a dipole magnetic field and interacts with an electric field of RF or a microwave. A waveguide to improve ECR condition is also included. A beam plasma is enhanced in the dipole magnetic field of the mass spectrometer without a plasma generated outside. Moreover, the ion beam is sealed in the low- energy ion implantation apparatus.

    WAFER TREATING DEVICE AND METHOD FOR ACCESSING IT

    公开(公告)号:JP2001250856A

    公开(公告)日:2001-09-14

    申请号:JP2000380353

    申请日:2000-12-14

    Abstract: PROBLEM TO BE SOLVED: To provide a wafer treating device for increasing wafer treatment capacity by decreasing contamination in a treatment chamber, and a method for accessing the wafer treating device. SOLUTION: A wafer treating device 200 is provided with a treatment chamber 202 having upper and lower parts, and an annular ring valve 210 that is engaged to one of both the parts. The ring valve 210 can be operated to perform treatment by closing the treatment chamber 202 at a first position, and to perform access by releasing the treatment chamber 202 at a second position. The ring valve at the first position forms a uniform surface at the inner periphery part of the closed treatment chamber, thus making uniform the treatment state in the treatment chamber. The access method for that purpose includes a step for closing an access port in the treatment chamber for moving the ring valve 202 in the treatment chamber from the first position that cannot be accessed to the second position for opening the access port.

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