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    2.
    发明专利
    未知

    公开(公告)号：DE2844880A1

    公开(公告)日：1980-04-30

    申请号：DE2844880

    申请日：1978-10-14

    Applicant: BASF AG

    Inventor： FUCHS HUGO DIPL CHEM DR ,  BRAND UWE ING GRAD ,  HORN PETER DIPL CHEM DR

    IPC: B01J21/02 ,  B01J21/20 ,  C07D201/04

    Abstract: In a process for the preparation of epsilon -caprolactam by catalytic rearrangement of cyclohexanone-oxime in the gas phase at from 230 DEG to 450 DEG C. over a supported catalyst, containing boron trioxide, in a fluidized bed, wherein the catalyst is removed from the fluidized bed at the rate at which it becomes spent and is treated, in a fluidized state, with gases containing molecular oxygen at from 600 DEG to 900 DEG C., after which boron trioxide or boric acid is added to the fluidized catalyst, at from 300 DEG to 900 DEG C., before the catalyst is returned to the fluidized bed, the improvement that boron trioxide or boric acid of particle size from 0.05 to 1.5 mm is fed to the fluidized catalyst at one or more points.

    Copolyamide hot melt adhesive prepn - from caprolactam, aliphatic dicarboxylic acid and diamine salts
    3.
    发明专利
    Copolyamide hot melt adhesive prepn - from caprolactam, aliphatic dicarboxylic acid and diamine salts 未知

    公开(公告)号：DE2509736A1

    公开(公告)日：1976-09-23

    申请号：DE2509736

    申请日：1975-03-06

    Applicant: BASF AG

    Inventor： HORN PETER DIPL CHEM DR ,  HAERTL HANS-DIETMAR DIPL CHEM

    IPC: C08G69/36 ,  C09J3/16

    Abstract: A hot melt adhesive esp. for adhering textile comprise a copolyamide from 20-60 pts. wt. epsilon-caprolactam, 10-40 pts. wt. salt form adipic and/or sebacic and/or azelaic acid and a diamine H2N-(CHR)n-NH2 (where n is 2-20 and R is H and/or 1-3C alkyl) and 20-60 pts. wt. salt from a dicarboxylic acid HO2C-(CH2)34-CO2H and a diamine H2N-(CH2)m-NH2 (where m is 2-6) and/or 20-60 pts. wt. salt from a dicarboxylic acid HO2C-(CH2)p-CO2H (where p is 10-34) with piperazine and/or 1-(2-aminoethyl)-piperazine and/or a diamine of formula (I) (where q, r and s are independently 2-6, and R1, R2, R3 and R4 are H and/or 1-3C alkyl). The polyamide pref. has a K value (Fikentscher; 0.5% soln. in o-cresol). 45-80. The adhesive is esp. useful for textiles having good strength.

    6.
    发明专利
    未知

    公开(公告)号：DE2624285A1

    公开(公告)日：1977-12-22

    申请号：DE2624285

    申请日：1976-05-31

    Applicant: BASF AG

    Inventor： HORN PETER DIPL CHEM DR ,  KOEHLER WALDEMAR DIPL CHEM DR ,  BITTLER ROLF DIPL CHEM DR

    IPC: C07C20060101 ,  C07C263/10 ,  C07C265/12 ,  C07C119/048 ,  C07C118/02

    Abstract: A process for the continuous manufacture of organic monoisocyanates, diisocyanates and/or polyisocyanates from the corresponding organic amines and phosgene in the presence of inert organic solvents, with recycling of the reaction mixture, wherein the streams of liquid, consisting of the recycle stream and the amine feed solution, are fed to the reaction mixture at a rate such that an energy dissipation density of from 5 to 1,000 kJoule per m3 of recycled reaction mixture plus amine feed solution is generated in the mixing and reaction zone.

    Heat-stabilising opt. reinforced polyamides - with solid solns. of cuprous iodide and alkali halide mixt. in polyamides
    7.
    发明专利
    Heat-stabilising opt. reinforced polyamides - with solid solns. of cuprous iodide and alkali halide mixt. in polyamides 未知

    公开(公告)号：DE2516565A1

    公开(公告)日：1976-10-28

    申请号：DE2516565

    申请日：1975-04-16

    Applicant: BASF AG

    Inventor： HORN PETER DIPL CHEM DR ,  DOERFEL HELMUT DIPL CHEM DR ,  ILLERS KARL HEINZ DIPL PHYS DR ,  CORDES CLAUS DIPL CHEM DR ,  WEISS HANS-PETER DIPL CHEM DR

    IPC: C08K3/16 ,  C08L77/00

    Abstract: Thermoplastic polyamides (I) having Fikentscher K-value 67-95 (measured 1% in 96% H2SO4), opt. contg. 80 pts. wt. reinforcing fillrs and opt. modified with 15 pts. wt. copolymers of ethylene/acrylic acid or ethylene/ME acrylate or PTFE, are stabilised by adding CuI and alkali halide as a solid, homogeneous soln. in a polyamide (II) having Fikentscher K-value 68-85 (1% in 96% H2SO4). Soln. is prepd. from 79-95 wt. % (II) and a mixt. of CuI and alkali iodide by melting (II) and mixing at 200-300 degrees C. Cu concn. of the solid, homogeneous soln. is 0.3-1.2 (0.5-0.9) wt. % w.r.t. total wt. of soln. Molar ratio CuI: alkali iodide is 1-11.5 (1-4.2) esp. 1-2.6. Pref. quantity of solid homogeneous soln. added to (I) is 0.3-7.1 (1.1-1.7) wt. %. Used esp. for Stabilising polyamide 6 and -6.6. mixt. yields stable polyamide mouldings and speck-free films stable to discolouration and heat. System resists storage and transport and can be added to polyamide (I) direction before injection moulding or foil-prodn.

    8.
    发明专利
    未知

    公开(公告)号：DE2509791A1

    公开(公告)日：1976-09-16

    申请号：DE2509791

    申请日：1975-03-06

    Applicant: BASF AG

    Inventor： HORN PETER DIPL CHEM DR ,  HAERTL HANS-DIETMAR DIPL CHEM ,  ILLERS KARL HEINZ DIPL PHYS DR

    IPC: C08G69/00 ,  C08G69/36

    Abstract: Copolyamides which are manufactured using (A) from 1 to 60 parts by weight of a cyclic lactam of 6 to 12 carbon atoms and/or an omega -aminocarboxylic acid of 6 to 20 carbon atoms and (B) from 40 to 99 parts by weight of the salt of at least two different dicarboxylic acids of the general formula HOOC-R-COOH where R is an aliphatic or cycloaliphatic radical of 4 to 46 carbon atoms with (a) cycloaliphatic and/or aliphatic diamines of 4 to 20 carbon atoms, which possess at least one secondary amino group and (b) optionally, up to 0.3 equivalent of primary alpha , omega -diamines of 2 to 20 carbon atoms, are excellent hot-melt adhesives.

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