中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.021 seconds)

    2.
    发明专利
    未知

    公开(公告)号：DE19543161A1

    公开(公告)日：1997-05-22

    申请号：DE19543161

    申请日：1995-11-18

    Applicant: BASF AG

    Inventor： FISCH HERBERT DR ,  PIPPER GUNTER ,  RIEGER JENS DR ,  LAUN MARTIN DR ,  WARZELHAN VOLKER DR

    IPC: C08G69/48 ,  C08G69/04 ,  C08G69/28 ,  C08G69/46 ,  C08G69/06

    Abstract: The production of branched polyamides (I) comprises: (i) mixing (A) 10-99.7 wt% molten polyamide prepolymer with a viscosity number (VN) of 40-90 ml/g with (B) 0.3-6 wt% poly- carboxylic acid with 3-10 free COOH groups and (C) 0-80 wt% other additives and processing aids; followed by (ii) solid-phase post- condensation. Also claimed are thermoplastic moulding materials obtained by this process. Preferably after solid-phase post-condensation, the polyamide has a VN of at least 100 ml/g. Component (B) contains 3 or 4 free COOH groups; preferred (B) is benzene-1,3,5- tricarboxylic or -1,2,4,5-tetracarboxylic acid, biphenyl- -3,5,3',5'-tetracarboxylic acid and/or naphthalene-1,3,5,7- tetracarboxylic acid. The amount of (B) used is 0.4-5.8 wt%. Component (A) consists of polyamide (PA) 66, PA 6/6T and/or PA 66/6T.

    Miscible polyimide-polyarylene-ether-ketone blends for fibres
    7.
    发明专利
    Miscible polyimide-polyarylene-ether-ketone blends for fibres 未知

    公开(公告)号：DE4423920A1

    公开(公告)日：1996-01-11

    申请号：DE4423920

    申请日：1994-07-07

    Applicant: BASF AG

    Inventor： FISCHER CHRISTIAN DR ,  RIEGER JENS DR

    IPC: C08L65/00 ,  C08L71/00 ,  C08L79/08 ,  C08G73/10 ,  C08J5/18 ,  C08L29/12 ,  D01F6/44

    Abstract: Moulding materials are claimed, contg.: (A) 0.5-99.5 wt.% polyimides (PI) obtd. by reaction of: (a) a dianhydride component contg.: (a1) 50-100 mole.% dianhydride(s) of formula (I), and (a2) 0-50 mole.% pyromellitic dianhydride (PMDA), with (b) a diamine component contg.: (b1) 50-100 mole.% diamine(s) of formula (II), and (b2) 0-50 mole.% diamine(s) of formula (III); (B) 0.5-99.5 wt.% polyarylene-ether-ketones (PEK); and (C) 0-50 wt.% additives; R = tetravalent aromatic or heteroaromatic residue, except for benzene-tetra-yl; R -R = H, halo, 1-12C alkyl or alkoxy, 5-7C cycloalkyl, 6-18C aryl, 4-5C heteroaryl or (1-12C alkyl)-(6-18C aryl); R , R = as for R -R (same or different on each atom T as required); T = carbon; m = 4-7; X, Y, Z = direct bond, -O-, -CO-, -S-, -SO2- or -Si(CH3)2-; and r,s = 0 or 1. Also claimed are mouldings, films or fibres obtd. from these moulding materials.

Patent Agency Ranking