COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

    公开(公告)号:SG174264A1

    公开(公告)日:2011-10-28

    申请号:SG2011064086

    申请日:2010-03-25

    Applicant: BASF SE

    Abstract: A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein - the R1 radicals are each independently selected from a copolymer of ethylene oxide and at least one further C3 to C4 alkylene oxide, said copolymer being a random copolymer. - the R2 radicals are each independently selected from R1 or alkyl. - X and Y are spacer groups independently, and X for each repeating unit independently, selected from C1 to C6 alkylen and Z-(O-Z)m wherein the Z radicals are each independently selected from C2 to C6 alkylen, - n is an integer equal to or greater than 0. - m is an integer equal to or greater than 1.

    COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

    公开(公告)号:SG171904A1

    公开(公告)日:2011-07-28

    申请号:SG2011040011

    申请日:2009-12-08

    Applicant: BASF SE

    Abstract: A composition comprising a source of metal ions and at least one leveling agent obtainable by condensing at least one trialkanolamine of the general formula N(R1-OH)3 (Ia) and/or at least one dialkanolamine of the general formula R2-N(R1-OH)2 (Ib) to give a polyalkanolamine(ll), wherein the R1 radicals are each independently selected from a divalent, linear or branched aliphatic hydrocarbon radical having from 2 to 6 carbon atoms, and the R2 radicals are each selected from hydrogen and linear or branched aliphatic, cycloaliphatic and aromatic hydrocarbon radicals having from 1 to 30 carbon atoms, or derivatives obtainable by alkoxylation, substitution or alkoxylation and substitution of said polyalkanolamine(ll).

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