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1.发明公开PRINTED WIRING BOARD WITH CONDUCTIVE CONSTRAINING CORE INCLUDING RESIN FILLED CHANNELS 审中-公开用树脂填充的通道导电性支撑芯电路板
公开(公告)号：EP1754398A2
公开(公告)日：2007-02-21
申请号：EP05763696.1
申请日：2005-05-16
Applicant: C-Core Technologies Inc.
Inventor： Vasoya, Kalu K.
CPC classification number: H05K3/4641 , H05K1/115 , H05K3/0005 , H05K3/0047 , H05K3/429 , H05K3/445 , H05K3/4638 , H05K2201/0281 , H05K2201/0323 , H05K2201/068 , H05K2201/09236 , H05K2201/09636 , H05K2201/09663 , H05K2201/0969 , H05K2201/09718 , Y10T29/49156 , Y10T29/49165
Abstract: Printed wiring boards (100) and methods of manufacturing printed wiring boards are disclosed. In one aspect of the invention, the printed wiring boards include electrically conductive constraining cores (106) having at least one resin filled channel (116, 118). The resin filled channels perform a variety of functions that can be associated with electrical isolation and increased manufacturing yields.
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