公开(公告)号：KR20180016941A

公开(公告)日：2018-02-20

申请号：KR20170095112

申请日：2017-07-27

Applicant: EBARA CORP

Inventor： MITSUYA TAKASHI ,  KOIZUMI RYUYA ,  YOKOYAMA TOSHIO ,  SHIMOYAMA MASASHI ,  OISHI KUNIO

IPC: C25D17/00 ,  C25D17/06 ,  C25D21/12 ,  H01L21/288

CPC classification number: C25D17/001 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76879 ,  H01L24/11 ,  H01L2224/11462 ,  H01L2224/117

Abstract: 기판에도금처리를행하기위한도금조와, 상기기판의실제도금막두께를측정하는센서와, 상기도금조에공급하는도금전류및 상기도금조에있어서의상기기판의도금시간을제어하는제어장치를구비하고, 상기제어장치는, 도금처리의레시피로서, 목표도금막두께, 도금전류및 도금시간을설정가능하고, 상기실제도금막두께가상기목표도금막두께로되도록, 상기도금전류및 상기도금시간중 적어도하나를자동적으로보정하고, 후속의기판의도금처리에반영시키는도금장치.

Abstract translation: 1.一种电镀系统，其特征在于，具备：对基板实施板加工的电镀槽，测定该电路板的实际电镀膜厚度的传感器，以及控制向该电镀槽供给的电镀电流的控制部， 镀槽内的基材。 控制器能够设定目标电镀膜厚度，电镀电流和电镀时间作为印版处理配方。 自动校正电镀电流和电镀时间中的至少一个，使得实际电镀膜厚度和目标电镀膜厚度彼此相等，并且结果反映在用于后续基板的电镀处理中。

公开(公告)号：SG11201805417PA

公开(公告)日：2018-07-30

申请号：SG11201805417P

申请日：2017-01-13

Applicant: EBARA CORP

Inventor： OZAWA SUGURU ,  NAKAGAWA YOICHI ,  TAKAHASHI MUNETO ,  XU TAO ,  YOKOYAMA TOSHIO

IPC: B01F23/80

Abstract: SUPPLY-LIQUID PRODUCING APPARATUS AND SUPPLY-LIQUID PRODUCING METHOD Provided is a supply-liquid producing apparatus capable of producing a supply liquid by an amount needed at a use point. A supply-liquid producing apparatus includes a mixer 113 that mixes water and ozone gas to produce ozone water; a booster pump 112 that increases the pressure of the water to be supplied to the mixer 113; a gas-liquid separation tank 114 that separates the ozone water produced by the mixer 113 into ozone water to be supplied to a use point 119 and exhaust gas to be discharged from an exhaust port 125; a flowmeter 117 that measures the flow rate of the ozone water to be supplied from the gas- liquid separation tank 114 to the use point 119; a flow control unit 126 that adjusts the pressure (flow rate) of the water to be increased in pressure and supplied to the mixer 113 by controlling the booster pump 112 in response to the flow rate of the ozone water measured by the flowmeter 117; and an exhaust pressure control unit 127 that controls the exhaust pressure of the exhaust gas so as to keep the water level in the gas-liquid separation tank 114 constant. [FIG. 1]

公开(公告)号：SG11201807416YA

公开(公告)日：2018-10-30

申请号：SG11201807416Y

申请日：2017-03-07

Applicant: EBARA CORP

Inventor： MUKAIYAMA YOSHITAKA ,  YOKOYAMA TOSHIO ,  YAMAKAWA JUNITSU ,  TSUSHIMA TAKUYA ,  HIRAO TOMONORI ,  TAMURA SHO ,  OHASHI HIROTAKA

IPC: C25D17/08 ,  B65G49/02 ,  C25D17/06 ,  H01L21/683 ,  H05K3/18

Abstract: SUBSTRATE HOLDER AND PLATING APPARATUS To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate. Figure 1

公开(公告)号：EP1532668A4

公开(公告)日：2009-09-23

申请号：EP03730715

申请日：2003-05-30

Applicant: EBARA CORP

Inventor： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI ,  YOKOYAMA TOSHIO

IPC: C23C18/16 ,  C25D7/12 ,  C25D17/00 ,  C25D17/02 ,  H01L21/00 ,  H01L21/02 ,  C23C18/00 ,  C25C7/00 ,  C25D5/00 ,  H01L21/304

CPC classification number: H01L21/67051 ,  C23C18/1619 ,  C25D7/123 ,  C25D17/001 ,  C25D17/02

公开(公告)号：SG10201405978QA

公开(公告)日：2015-04-29

申请号：SG10201405978Q

申请日：2014-09-23

Applicant: EBARA CORP

Inventor： SHINOZAKI HIROYUKI ,  SHINKAI KENJI ,  SONE TADAKAZU ,  AIZAWA HIDEO ,  AONO HIROSHI ,  YOKOYAMA TOSHIO

公开(公告)号：JP2010064196A

公开(公告)日：2010-03-25

申请号：JP2008233466

申请日：2008-09-11

Applicant: Ebara Corp ,  株式会社荏原製作所

Inventor： KUMEGAWA MASAYUKI ,  YOKOYAMA TOSHIO

IPC: B24B37/00 ,  B24B37/005 ,  B24B37/10 ,  B24B53/017

Abstract: PROBLEM TO BE SOLVED: To provide a substrate polishing device which can uniformly polish a rectangular large-sized substrate such as a large-sized glass substrate at a high degree of flatness, can make the whole device compact (small size), and has favorable maintainability. SOLUTION: The substrate polishing device includes: a substrate holding mechanism 3 having a substrate rotating stage 31 rotated while holding the rectangular substrate G with its polishing surface in an upward direction; a polishing head mechanism 4 having a polishing head 41 rotating while holding a polishing tool 10 having a polishing surface smaller than a polishing object surface of the substrate G and pressing the polishing tool 10 to the polishing object surface of the substrate G; and a moving mechanism 5 for horizontally reciprocating the polishing head 41 while supporting the polishing head 41. The polishing tool 10 is rotated while rotating the substrate G, and the substrate G is polished by reciprocating the polishing tool 10 between the center section of the substrate G and an outer peripheral end of the substrate G while the polishing tool 10 is pressed to the substrate G. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题为了提供能够以高度的平坦度均匀地研磨诸如大尺寸玻璃基板的矩形大尺寸基板的基板研磨装置，能够使整个装置紧凑（小尺寸）， 并具有良好的可维护性。 基板研磨装置包括：基板保持机构3，其具有基板旋转台31旋转，同时将矩形基板G的抛光表面沿向上方向保持; 抛光头机构4，其具有在保持具有小于基板G的抛光对象表面的抛光表面的抛光工具10并且将抛光工具10按压到基板G的抛光对象表面的同时旋转的抛光头41; 以及用于在支撑抛光头41的同时使抛光头41水平往复运动的移动机构5.抛光工具10在旋转基板G的同时旋转，并且基板G通过使抛光工具10在基板的中心部分之间往复运动而被抛光 G和基板G的外周端，而抛光工具10被压到基板G上。（C）2010，JPO＆INPIT

公开(公告)号：JP2007262526A

公开(公告)日：2007-10-11

申请号：JP2006091237

申请日：2006-03-29

Applicant: Ebara Corp ,  株式会社荏原製作所

Inventor： YOKOYAMA TOSHIO ,  KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO

IPC: C23C18/31 ,  H01L21/304

Abstract: PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method which allows treating liquid such as plating liquid to reliably penetrate even the inner part of a recessed part for wiring of a micronized trench, etc. and can perform prescribed treatment such as plating.
SOLUTION: The substrate treatment apparatus comprises: a treatment chamber 32 which is opened to the upper side and is connected with a vacuum part; and a vertically freely-movable substrate holding head 10 which is arranged on the upper side of the treatment chamber 32 and holds a substrate W on the lower surface, wherein an opening part of the treatment chamber 32 is covered with the substrate holding head 10 which holds the substrate W, the treatment chamber 32 is tightly closed, the inside thereof is evacuated, thereafter, the substrate W is brought into contact with the treatment liquid Q introduced to the treatment chamber 32 and the substrate W is treated.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种基板处理装置和基板处理方法，其能够使诸如电镀液体的液体能够可靠地穿透甚至用于微细化沟槽等的布线的凹部的内部，并且可以执行 规定处理如电镀。 解决方案：基板处理装置包括：处理室32，其向上侧敞开并与真空部连接; 以及设置在处理室32的上侧并且在下表面上保持基板W的可垂直自由移动的基板保持头10，其中处理室32的开口部分被基板保持头10覆盖，基板保持头10 保持基板W，处理室32紧密地关闭，其内部被抽真空，然后使基板W与引入处理室32的处理液Q接触，并且处理基板W. 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2004169075A

公开(公告)日：2004-06-17

申请号：JP2002334277

申请日：2002-11-18

Applicant: Ebara Corp ,  株式会社荏原製作所

Inventor： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI

IPC: B08B1/04 ,  C23C18/18 ,  C23C18/31 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683

Abstract: PROBLEM TO BE SOLVED: To provide a substrate treatment system which delivers a substrate in a state where the substrate is quickly and securely held without causing the risk of falling to thereby exhibit improved throughput. SOLUTION: The substrate treatment system comprises a substrate receiving ring 90 fitted with a seal ring 92, a freely vertically movable substrate holder 60 having a substrate fixing ring 100 for holding the peripheral part of a substrate W between the ring 100 and the seal ring 92 to support the substrate W, and a temporary placement part 94 fitted to a position surrounding the seal ring 92 of the substrate receiving ring 90 and forming a space between the substrate W and the seal ring 92, and where the substrate W is temporarily placed. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2013038249A

公开(公告)日：2013-02-21

申请号：JP2011173704

申请日：2011-08-09

Applicant: Ebara Corp ,  株式会社荏原製作所

Inventor： YOKOYAMA TOSHIO ,  KUNISAWA JUNJI ,  MIYAZAKI MITSURU

IPC: H01L21/304

Abstract: PROBLEM TO BE SOLVED: To prevent photo-corrosion of copper wiring and the like caused by radiation of light on a process target surface of a substrate, and, although the processible number of substrates decreases, allow processing such as cleaning that prevents photo-corrosion of copper wiring and the like caused by radiation of light in maintenance of a part of processing units in a substrate processing apparatus to be performed.SOLUTION: A substrate processing apparatus comprises: a plurality of processing areas 30, 32, 34 in which a plurality of processing units 40a, 40b, 42a, 42b, 44a, 44b on which a light shielding treatment has been performed are arranged one above the other and housed inside; transfer areas 36, 38 housing carrier machines 46, 48 and provided between the processing areas; light shielding walls 50, 52 shielding light between the processing areas and the transfer areas; and maintenance doors 54b, 54d shielding front faces of the transfer areas from light. The processing units are linked to the light shielding walls in a light blocking state.

Abstract translation: 要解决的问题：为了防止由于在基板的工艺目标表面上的光辐射引起的铜布线的光腐蚀，并且尽管基板的可加工数量减少，但允许诸如清洁之类的处理 在要进行的基板处理装置中维护一部分处理单元的光线辐射引起的铜布线等的光腐蚀。 解决方案：一种基板处理设备包括：多个处理区域30,32,34，其中已经执行了遮光处理的多个处理单元40a，40b，42a，42b，44a，44b被布置 一个在另外一个，并在里面; 传送区域36,38壳体承载机46,48，并设置在处理区域之间; 遮光壁50,52屏蔽处理区域和转印区域之间的光; 维护门54b，54d遮挡传送区域的前表面。 处理单元以遮光状态连接到遮光壁。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2010118685A

公开(公告)日：2010-05-27

申请号：JP2010022270

申请日：2010-02-03

Applicant: Ebara Corp ,  株式会社荏原製作所

Inventor： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  WATANABE TERUYUKI ,  KATO AKIRA ,  YOKOYAMA TOSHIO ,  SUZUKI KENICHI ,  KOBAYASHI KENICHI

IPC: H01L21/683 ,  B05B15/12 ,  B05C3/09 ,  B05C9/06 ,  B05C11/10 ,  B05C13/00 ,  B05C15/00 ,  B05D3/12 ,  B65H1/00 ,  C23C2/00 ,  C23C18/16 ,  C23C18/31 ,  C25D17/06 ,  H01L21/00 ,  H01L21/288 ,  H01L21/68 ,  H01L21/768

CPC classification number: H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

Abstract: PROBLEM TO BE SOLVED: To perform processing by holding a substrate while preventing the separation and the fall of the substrate without need for increasing adsorption to the substrate or mechanical strength. SOLUTION: The substrate supporting apparatus incldues a rotatable supporting head 184 having a ring-like seal for supporting the substrate while sealing the rear side circumferential rim of the substrate. The supporting head 184 includes a restriction mechanism 260 for generating negative pressure to the rear side of the substrate sealed with the ring-like seal accompanied by the rotation of the supporting head 184 while supporting the substrate. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：通过保持基板同时防止基板的分离和下降而不需要增加对基板的吸附或机械强度来进行加工。 解决方案：基板支撑装置包括具有环状密封件的可旋转支撑头184，用于支撑基板，同时密封基板的后侧圆周边缘。 支撑头184包括限制机构260，用于在支撑基板的同时伴随着支撑头184的旋转而用密封的环状密封件向衬底的后侧产生负压。 版权所有（C）2010，JPO＆INPIT