SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME

    公开(公告)号:US20250015246A1

    公开(公告)日:2025-01-09

    申请号:US18893462

    申请日:2024-09-23

    Abstract: A semiconductor device is provided, which includes an active region, a first semiconductor layer, a first metal element-containing structure, a first p-type or n-type layer, a second semiconductor layer and an insulating layer. The active region has a first surface and a second surface. The first semiconductor layer is at the first surface. The first metal element-containing structure covers the first semiconductor layer and comprising a first metal element. The first p-type or n-type layer is between the first semiconductor layer and the first metal element-containing structure. The second semiconductor layer is between the first semiconductor layer and the first p-type or n-type layer. The insulating layer covers a portion of the first semiconductor layer and a portion of the second semiconductor. The first p-type or n-type layer includes an oxygen element (O) and a second metal element and has a thickness less than or equal to 20 nm.

    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME

    公开(公告)号:US20220302360A1

    公开(公告)日:2022-09-22

    申请号:US17203402

    申请日:2021-03-16

    Abstract: A semiconductor device is provided, which includes a semiconductor stack and a first contact structure. The semiconductor stack includes an active layer and has a first surface and a second surface. The first contact structure is located on the first surface and includes a first semiconductor layer, a first metal element-containing structure and a first p-type or n-type layer. The first metal element-containing structure includes a first metal element. The first p-type or n-type layer physically contacts the first semiconductor layer and the first metal element-containing structure. The first p-type or n-type layer includes an oxygen element (O) and a second metal element and has a thickness less than or equal to 20 nm, and the first semiconductor layer includes a phosphide compound or an arsenide compound.

    LIGHT-EMITTING ELEMENT HAVING A PLUARALITY OF LIGHT-EMITTING STRUCTURES

    公开(公告)号:US20190252459A1

    公开(公告)日:2019-08-15

    申请号:US16390899

    申请日:2019-04-22

    CPC classification number: H01L27/15 H01L33/08 H01L33/20 H01L33/38

    Abstract: A light-emitting device includes a first semiconductor layer having an uppermost surface and a bottommost surface; a first light-emitting structure and a second light-emitting structure formed on the same first semiconductor layer, wherein the first semiconductor layer is continuous; a first trench formed between the first and the second light-emitting structures; and a second electrode formed on the second semiconductor layer and including a second pad and a plurality of second extending parts extending from the second pad; wherein the second pad is between the first and the second light-emitting structures, and the plurality of second extending parts extends to the first and the second light-emitting structures, respectively; wherein the first trench passes through the uppermost surface but does not extend to the bottommost surface; wherein the first trench includes an equal width in a top view.

    LIGHT-EMITTING ELEMENT HAVING A PLURALITY OF LIGHT-EMITTING STRUCTURES

    公开(公告)号:US20170365637A1

    公开(公告)日:2017-12-21

    申请号:US15675351

    申请日:2017-08-11

    CPC classification number: H01L27/15 H01L33/08 H01L33/20 H01L33/38

    Abstract: A light-emitting device includes a first semiconductor layer; a first, a second and a third light-emitting structures formed on the same first semiconductor layer; a first trench between the first and the second light-emitting structures; a second trench between the second and the third light-emitting structures, wherein the first and the second trenches include bottom portions exposing a surface of the first semiconductor layer; a third trench in one of the light-emitting structures, exposing the first semiconductor layer and extending along a direction parallel with the first semiconductor layer; an insulating bridge part in the first and the second trenches, connecting the light-emitting structures; a first electrode in the third trench, electrically connecting to the first semiconductor layer; and a second electrode, including a pad on one of the light-emitting structures and an extending part; wherein the extending part is formed on the insulating bridge part and extends to the light-emitting structures.

    LIGHT-EMITTING ELEMENT HAVING A PLURALITY OF LIGHT-EMITTING STRUCTURES
    6.
    发明申请
    LIGHT-EMITTING ELEMENT HAVING A PLURALITY OF LIGHT-EMITTING STRUCTURES 有权
    具有多个发光结构的发光元件

    公开(公告)号:US20150076536A1

    公开(公告)日:2015-03-19

    申请号:US14470396

    申请日:2014-08-27

    CPC classification number: H01L27/15 H01L33/08 H01L33/20 H01L33/38

    Abstract: A light-emitting element comprises a first semiconductor layer, a first light-emitting structure and a second light-emitting structure on the first semiconductor layer, a first electrode on the first semiconductor layer, a second electrode on the first light-emitting structure, and a first trench between the first light-emitting structure and the second light-emitting structure, exposing the first semiconductor layer, wherein the first trench is devoid of the first electrode and the second electrode formed therein.

    Abstract translation: 发光元件包括在第一半导体层上的第一半导体层,第一发光结构和第二发光结构,第一半导体层上的第一电极,第一发光结构上的第二电极, 以及在所述第一发光结构和所述第二发光结构之间的第一沟槽,暴露所述第一半导体层,其中所述第一沟槽没有形成在所述第一电极和所述第二电极中。

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