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    Using MEMS fabrication incorporating into LED device mounting and assembly
    1.
    发明授权
    Using MEMS fabrication incorporating into LED device mounting and assembly 有权

    公开(公告)号：US10026882B2

    公开(公告)日：2018-07-17

    申请号：US14507862

    申请日：2014-10-07

    Applicant: Epistar Corporation ,  IMEC Taiwan Co.

    Inventor： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

    IPC: H01L33/62 ,  H01L25/075 ,  H01L21/683 ,  H01L33/48 ,  H01L33/36 ,  H01L27/15 ,  H01L23/00

    Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

    Using MEMS fabrication incorporating into LED device mounting and assembly
    3.
    发明授权
    Using MEMS fabrication incorporating into LED device mounting and assembly 有权

    公开(公告)号：US10403804B2

    公开(公告)日：2019-09-03

    申请号：US16006857

    申请日：2018-06-13

    Applicant: Epistar Corporation ,  IMEC Taiwan Co.

    Inventor： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

    IPC: H01L33/62 ,  H01L25/075 ,  H01L21/683 ,  H01L23/00 ,  H01L33/48 ,  H01L33/36 ,  H01L27/15

    Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

    Light-emitting structure
    5.
    发明授权
    Light-emitting structure 有权

    公开(公告)号：US10026778B2

    公开(公告)日：2018-07-17

    申请号：US15727276

    申请日：2017-10-06

    Applicant: EPISTAR CORPORATION

    Inventor： Li-Ping Jou ,  Yu-Chen Yang ,  Jui-Hung Yeh

    IPC: H01L27/15 ,  H01L33/38 ,  H01L33/62

    CPC classification number: H01L27/156 ,  H01L27/153 ,  H01L33/08 ,  H01L33/36 ,  H01L33/382 ,  H01L33/62 ,  H01L2933/0016

    Abstract: A light-emitting structure includes an epitaxial structure including a plurality of trenches; a conductive connecting layer, disposed under the epitaxial structure; a first isolation layer; a crossover metal layer, disposed under the first isolation layer and including a plurality of protruding portions protruding into the epitaxial structure through the plurality of trenches; a second isolation layer, disposed under the crossover metal layer; a bonding layer disposed under the second isolation layer; a substrate, disposed under the bonding layer; and an electrode, electrically connected to the conductive connecting layer and disposed adjacent to the epitaxial structure in a cross-sectional view.

    Light-emitting diode (LED) array
    9.
    发明授权
    Light-emitting diode (LED) array 有权
    发光二极管（LED）阵列

    公开(公告)号：US08779449B2

    公开(公告)日：2014-07-15

    申请号：US14065330

    申请日：2013-10-28

    Applicant: Epistar Corporation

    Inventor： Li-Ping Jou ,  Yu-Chen Yang ,  Jui-Hung Yeh

    IPC: H01L33/48

    CPC classification number: H01L27/156 ,  H01L27/153 ,  H01L33/08 ,  H01L33/36 ,  H01L33/382 ,  H01L33/62 ,  H01L2933/0016

    Abstract: An LED array having N light-emitting diode units (N≧3) comprises a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure. The light-emitting diode units are electrically connected with each other by the crossover metal layer.

    Abstract translation: 具有N个发光二极管单元（N≥3）的LED阵列包括永久基板，永久基板上的接合层，接合层上的第二导电层，第二导电层上的第二隔离层，交叉金属 所述第二隔离层上的第一隔离层，所述交叉金属层上的第一隔离层，所述第一隔离层上的导电连接层，所述导电连接层上的外延结构，以及所述外延结构上的第一电极层。 发光二极管单元通过交叉金属层彼此电连接。

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