公开(公告)号：EP1545175A3

公开(公告)日：2007-05-30

申请号：EP04257610.8

申请日：2004-12-08

Applicant: Endicott Interconnect Technologies, Inc.

Inventor： Larnerd, James M. ,  Lauffer, John M. ,  Markovich, Voya R. ,  Papathomas, Kostas I.

IPC: H05K3/42 ,  H05K1/11 ,  H01L23/498

CPC classification number: H05K3/429 ,  H01L2224/13 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/0347 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09845

Abstract: A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste (61). In the case of the latter, it is also possible to provide a top covering conductive layer (63) over the paste, e.g., to serve as a pad or the like on the board's external surface.

公开(公告)号：EP1545175A2

公开(公告)日：2005-06-22

申请号：EP04257610.8

申请日：2004-12-08

Applicant: Endicott Interconnect Technologies, Inc.

Inventor： Larnerd, James M. ,  Lauffer, John M. ,  Markovich, Voya R. ,  Papathomas, Kostas I.

IPC: H05K3/42 ,  H05K1/11 ,  H01L23/498

CPC classification number: H05K3/429 ,  H01L2224/13 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/0347 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09845

Abstract: A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste (61). In the case of the latter, it is also possible to provide a top covering conductive layer (63) over the paste, e.g., to serve as a pad or the like on the board's external surface.

Abstract translation: 在哪一种制造印刷电路板的方法，导电通孔被板的结构的两个介电层内形成，以连接指定导电层。 一个孔连接两个相邻的层和其他连接两个相邻层，包括通过另一个孔连接在所述导电层中的一个。 因此，它可以连接使用一个或多个孔全部三个导电层。 将所得的孔可填充，E. G.，用金属镀敷，或导电或其他非导电性糊剂（61）。 在后者的情况下，因此有可能以提供对膏的顶部覆盖导电层（63），E. G.，以用作垫或在板的外表面等。