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公开(公告)号：US20240405169A1
公开(公告)日：2024-12-05
申请号：US18675532
申请日：2024-05-28
Applicant: EPISTAR CORPORATION
Inventor： Chong-Yu WANG , Wei-Shan HU , Ching-Tai CHENG , Chien-Chih CHEN , Min-Hsun HSIEH
Abstract: A wavelength conversion unit arrangement includes a carrier and a wavelength conversion unit. The wavelength conversion unit includes a wavelength conversion layer and a filter layer, and the filter layer attaches the wavelength conversion unit to the carrier. The filter layer has a first surface facing the carrier and a second surface opposite the first surface, and the first surface and the second surface have different textures.
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公开(公告)号：US20180053882A1
公开(公告)日：2018-02-22
申请号：US15679966
申请日：2017-08-17
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Lung-Kuan LAI , Ju-Lien KUO , Chun-Hua SHIH , Hsuan-Tzu PENG , Yih-Hua RENN
CPC classification number: H01L33/58 , H01L33/502 , H01L33/60 , H01L33/62 , H01L2224/18 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2933/0091
Abstract: A light-emitting device includes a light-emitting element, a wavelength converting layer and a light-adjusting layer. The light-emitting element has a first upper surface, a bottom surface, and a lateral surface between the first upper surface and the bottom surface. The wavelength converting layer includes a plurality of wavelength converting particles, and has a second upper surface on the first upper surface. The light-adjusting layer surrounds the lateral surface and has a first composition or a second composition. The first composition includes a first binder and a plurality of first light-diffusing particles. The second composition includes a second binder, a plurality of second light-diffusing particles, and a plurality of light-scattering particles.
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公开(公告)号：US20170288095A1
公开(公告)日：2017-10-05
申请号：US15088858
申请日：2016-04-01
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Yih-Hua RENN , Guan-Wu CHEN , Chun-Hua SHIH
CPC classification number: H01L33/46 , H01L33/44 , H01L33/502 , H01L33/507 , H01L33/54
Abstract: A light-emitting device includes a light-emitting element, and a covering layer. The light-emitting element includes a top surface, a bottom surface, a light-emitting stack between the top surface and the bottom surface, and an adhesion enhancing layer surrounding the light-emitting stack. The covering layer covers the light-emitting element and contacts the adhesion enhancing layer. Moreover, the adhesion enhancing layer includes an oxide and a thickness greater than 5 nm and less than 1000 nm.
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公开(公告)号：US20250112195A1
公开(公告)日：2025-04-03
申请号：US18903920
申请日：2024-10-01
Applicant: EPISTAR CORPORATION
Inventor： Wen-Chien WU , Wei-Shan HU , Ching-Tai CHENG
IPC: H01L23/00 , H01L23/12 , H01L25/075
Abstract: A semiconductor device arrangement structure includes a carrier, semiconductor devices, and an adhesive layer. The semiconductor devices are separately disposed on the carrier, and each of the semiconductor devices includes an electrode. The adhesive layer is disposed between the carrier and the semiconductor devices, and the semiconductor devices are attached to the adhesive layer which is a continuous distributed single-layered structure. The adhesive layer includes unselected regions and a selected region, wherein the unselected regions are covered by the semiconductor devices respectively, and the selected region is not covered by the semiconductor devices. The adhesive layer further includes an indentation disposed on a surface of the selected region, and in a cross-sectional view or a top view, the contour of the indentation is a scaled copy of a contour of and the electrode, and the indentation has a depth less than that of the electrode.
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公开(公告)号：US20240363817A1
公开(公告)日：2024-10-31
申请号：US18208353
申请日：2023-06-12
Applicant: EPISTAR CORPORATION
Inventor： Jia-Xing CHUNG , Wei-Shan HU , Ching-Tai CHENG , Shih-An LIAO
CPC classification number: H01L33/62 , H01L33/38 , H01L33/40 , H01S5/04252 , H01S5/04254 , H01L33/20
Abstract: A semiconductor device includes a semiconductor stack, a protective layer on the semiconductor stack, an electrode on the semiconductor stack and electrically connected to the semiconductor stack, and a conductive bump on the electrode. The thickness of the conductive bump is measured from the topmost point of the conductive bump to the uppermost surface of the protective layer. The ratio of the thickness of the conductive bump to the maximum width of the conductive bump is between 0.1 and 0.4, and the electrode is devoid of gold.
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Patent Agency Ranking
公开(公告)号：US20230161196A1
公开(公告)日：2023-05-25
申请号：US17989578
申请日：2022-11-17
Applicant: EPISTAR CORPORATION , Yenrich Technology Corporation
Inventor： Chong-Yu WANG , Ching-Tai CHENG , Wei-Shan HU
IPC: G02F1/13357 , H01L25/13 , H01L25/075 , H01L33/60
CPC classification number: G02F1/133605 , H01L25/13 , H01L25/0753 , H01L33/60 , G02F1/133603 , H01L2933/0091
Abstract: A display device includes a first light-emitting module and a second light-emitting module. Each light-emitting module has a substrate, a plurality of LED dies arranged on the substrate, a reflective layer on the substrate, and a light-transmissive layer. The light-transmissive layer covers the substrate, the plurality of LED dies, and the reflective layer. Both the light-transmissive layer of the first module and the light-transmissive layer of the second module have rough uppermost surfaces. The first light-emitting module has a first reflectivity, the second light-emitting module has a second reflectivity, and a standard deviation between the first reflectivity and the second reflectivity is not greater than 0.5.
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公开(公告)号：US20210083159A1
公开(公告)日：2021-03-18
申请号：US17104330
申请日：2020-11-25
Applicant: EPISTAR CORPORATION
Inventor： Pei-Hsuan LAN , Ching-Tai CHENG
Abstract: A light-emitting device includes a light-emitting element, an electrode, a reflective layer and a transparent layer. The reflective layer surrounds the light-emitting element and has an inner surface including a first portion and a second portion. There is a first angle included between the first portion and the first lateral surface, there is a second angle included between the second portion and the first lateral surface, and the first angle is larger than the second angle. The transparent layer includes an outer portion and an inner portion. The outer portion is formed above the upper surface and the inner portion is formed between the reflective layer and the first lateral surface. The outer portion includes wavelength conversion material and the inner portion does not comprise the wavelength conversion material.
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公开(公告)号：US20190237637A1
公开(公告)日：2019-08-01
申请号：US16262116
申请日：2019-01-30
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Shau-Yi CHEN , Yih-Hua RENN , Wei-Shan HU , Pei-Hsuan LAN
IPC: H01L33/50 , H01L25/075 , H01L33/60 , H01L33/44
Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode. The first connecting portion substantially is located within a range surrounded by the protecting portion.
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公开(公告)号：US20250040312A1
公开(公告)日：2025-01-30
申请号：US18785083
申请日：2024-07-26
Applicant: EPISTAR CORPORATION
Inventor： Tai-Ni CHU , Wei-Shan HU , Ching-Tai CHENG
IPC: H01L33/48 , H01L25/075
Abstract: A semiconductor device arrangement structure includes a carrier, a first semiconductor device, a second semiconductor device, a first adhesive part, and a second adhesive part. The first semiconductor device and the second semiconductor device are located on the carrier and separated from each other. The first adhesive part and the second adhesive part are separated from each other. The first adhesive part is located between the first semiconductor device and the carrier, and the second adhesive part is located between the second semiconductor device and the carrier. In a top view, the first adhesive part has a first outer contour surrounding the first semiconductor device. The first outer contour has at least one round corner.
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公开(公告)号：US20200373468A1
公开(公告)日：2020-11-26
申请号：US16990121
申请日：2020-08-11
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Shau-Yi CHEN , Yih-Hua RENN , Wei-Shan HU , Pei-Hsuan LAN
IPC: H01L33/50 , H01L25/075 , H01L33/44 , H01L33/60
Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode. The first connecting portion substantially is located within a range surrounded by the protecting portion.
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