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1.发明公开
公开(公告)号：EP2869328A1
公开(公告)日：2015-05-06
申请号：EP14190567.9
申请日：2014-10-28
Applicant: FEI COMPANY
Inventor： Buxbaum, Alexander
IPC: H01J37/304 , H01J37/305
CPC classification number: H01J37/222 , G01N1/286 , G01N1/32 , G01N1/44 , H01J37/261 , H01J37/304 , H01J37/3056 , H01J2237/08 , H01J2237/20 , H01J2237/221 , H01J2237/226 , H01J2237/262 , H01J2237/30466 , H01J2237/31745
Abstract: A method for using differential imaging for applications involving TEM samples by allowing operators to take multiple images during a procedure involving a focused ion beam procedure and overlaying the multiple images to create a differential image that clearly shows the differences between milling steps. The methods also involve generating real-time images of the area being milled and using the overlays of the differential images to show small changes in each image, and thus highlight the ion beam milling location. The methods also involve automating the process of creating differential images and using them to automatically mill subsequent slices.
Abstract translation: 一种用于使用用于应用涉及TEM样品差动成像通过允许运营商涉及的聚焦离子束过程的过程期间采取的多个图像和覆盖在多个图像来创建差分图像显然没有方法示出了研磨步骤之间的差异。 因此，该方法包括产生被研磨的区域的实时图像和使用该差分图像的重叠来显示每个图像中的微小变化，从而突出显示离子束研磨位置。 因此，该方法涉及自动创建差分图像，并使用它们来自动磨随后切片的过程。
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公开(公告)号：EP2902845B1
公开(公告)日：2020-04-15
申请号：EP15152977.3
申请日：2015-01-29
Applicant: FEI COMPANY
Inventor： Buxbaum, Alexander , Schmidt, Michael
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公开(公告)号：EP2902845A1
公开(公告)日：2015-08-05
申请号：EP15152977.3
申请日：2015-01-29
Applicant: FEI COMPANY
Inventor： Buxbaum, Alexander , Schmidt, Michael
Abstract: A method and apparatus for use in surface delayering for fault isolation and defect localization of a sample work piece is provided. More particularly, a method and apparatus for mechanically peeling of one or more layers from the sample in a rapid, controlled, and accurate manner is provided. A programmable actuator includes a delayering probe tip with a cutting edge that is shaped to quickly and accurately peel away a layer of material from a sample. The cutting face of the delayering probe tip is configured so that each peeling step peels away an area of material having a linear dimension substantially equal to the linear dimension of the delayering probe tip cutting face. The surface delayering may take place inside a vacuum chamber so that the target area of the sample can be observed in-situ with FIB/SEM imaging.
Abstract translation: 提供了用于表面去层的方法和设备，用于样品工件的故障隔离和缺陷定位。 更具体地说，提供了用于以快速，受控和准确的方式从样品机械地剥离一层或多层的方法和设备。 一个可编程的执行器包括一个具有切割边缘的去层探针尖端，该切割边缘被成形为快速并准确地从样品上剥离一层材料。 去层探针尖端的切割面被构造成使得每个剥离步骤剥离具有基本上等于去层探针尖端切割面的线性尺寸的线性尺寸的材料区域。 表面去层可以发生在真空室内，以便可以用FIB / SEM成像就地观察样品的目标区域。
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公开(公告)号：EP2952872A1
公开(公告)日：2015-12-09
申请号：EP14170775.2
申请日：2014-06-02
Applicant: FEI COMPANY
Inventor： Buxbaum, Alexander , Schmidt, Michael
IPC: G01N1/06 , H01L21/304 , B28D5/04 , B26D3/28
CPC classification number: G01N1/286 , B26D3/28 , B28D5/04 , G01N2001/2873
Abstract: A method and apparatus for use in surface delayering for fault isolation and defect localization of a sample work piece is provided. More particularly, a method and apparatus for mechanically peeling of one or more layers from the sample in a rapid, controlled, and accurate manner is provided. A programmable actuator includes a delayering probe tip with a cutting edge that is shaped to quickly and accurately peel away a layer of material from a sample. The cutting face of the delayering probe tip is configured so that each peeling step peels away an area of material having a linear dimension substantially equal to the linear dimension of the delayering probe tip cutting face. The surface delayering may take place inside a vacuum chamber so that the target area of the sample can be observed in-situ with FIB/SEM imaging.
Abstract translation: 提供了用于表面延迟的用于样品工件的故障隔离和缺陷定位的方法和装置。 更具体地，提供了一种用于以快速，受控和准确的方式从样品机械剥离一层或多层的方法和装置。 可编程致动器包括具有切割边缘的延迟探针尖端，其被成形为快速且准确地从样品上剥离一层材料。 延迟探针尖端的切割面被构造成使得每个剥离步骤剥离具有基本上等于延迟探针尖端切割面的线性尺寸的线性尺寸的材料的区域。 表面延迟可能发生在真空室内，从而可以用FIB / SEM成像原位观察样品的目标区域。
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