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1.发明公开Method of and system for forming a microscopic structure on a substrate using a mask formed on this substrate 有权一种用于在使用形成在该工件上的掩模的工件制造微观结构的方法和系统
公开(公告)号：EP2191927A1
公开(公告)日：2010-06-02
申请号：EP09176974.5
申请日：2009-11-25
Applicant: FEI COMPANY
Inventor： Straw, Marcus , Toth, Milos , Utlaut, Mark , Randolph, Steven , Lysaght, Michael
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2201/40 , B23K2201/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
Abstract: Improved method of and system for substrate micromachining is described. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Abstract translation: 描述了一种用于微机械加工的基材的改进的方法和系统。 本发明的消融的优选实施例提供了带电粒子束掩模和激光的利用的改进方法。 的带电粒子束掩模制造和超短脉冲激光烧蚀的优点的组合使用显着地降低基片的处理时间，提高横向分辨率和通过激光烧蚀到优选比加工激光的衍射极限更小的加工特征的纵横比。
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2.发明授权Method of and system for forming a microscopic structure on a substrate using a mask formed on this substrate 有权一种用于在使用形成在该工件上的掩模的工件制造微观结构的方法和系统
公开(公告)号：EP2191927B1
公开(公告)日：2014-01-08
申请号：EP09176974.5
申请日：2009-11-25
Applicant: FEI COMPANY
Inventor： Straw, Marcus , Toth, Milos , Utlaut, Mark , Randolph, Steven , Lysaght, Michael
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2201/40 , B23K2201/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
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