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公开(公告)号：WO2004038468A3
公开(公告)日：2004-06-17
申请号：PCT/US0333279
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , GORCZYCA THOMAS BERT , KAPUSTA CHRISTOPHER JAMES , BALCH ERNEST WAYNE , CLAYDON GLENN SCOTT , DASGUPTA SAHMITA , DELGADO ELADIO CLEMENTE
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/12004 , G02B6/1221 , G02B6/138 , G02B6/42 , H01L2224/04105 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2924/15153 , H01L2924/15192
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate activeside up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
Abstract translation: 一种光电子封装通过包括以下步骤的方法制造：将光学器件定位在衬底有源面的窗口内上和下顶部衬底表面; 用光学聚合物材料填充窗口; 平坦化光学聚合物材料和基底的表面; 在所述光学聚合物材料和所述衬底上形成波导材料以形成光学互连路径并且形成反射镜以将来自所述光学器件的光反射到所述互连路径; 以及形成通孔以暴露光学器件的接合焊盘。
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公开(公告)号：AU2003284300A8
公开(公告)日：2004-05-13
申请号：AU2003284300
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , BALCH ERNEST WAYNE , DASGUPTA SAHMITA , GORCZYCA THOMAS BERT , DELGADO ELADIO CLEMENTE , KAPUSTA CHRISTOPHER JAMES , CLAYDON GLENN SCOTT
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
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公开(公告)号：DE60321702D1
公开(公告)日：2008-07-31
申请号：DE60321702
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , GORCZYCA THOMAS BERT , KAPUSTA CHRISTOPHER JAMES , BALCH ERNEST WAYNE , CLAYDON GLENN SCOTT , DASGUPTA SAHMITA , DELGADO ELADIO CLEMENTE
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
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公开(公告)号：AU2003284300A1
公开(公告)日：2004-05-13
申请号：AU2003284300
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , GORCZYCA THOMAS BERT , KAPUSTA CHRISTOPHER JAMES , BALCH ERNEST WAYNE , CLAYDON GLENN SCOTT , DASGUPTA SAHMITA , DELGADO ELADIO CLEMENTE
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
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