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1.发明申请
公开(公告)号：WO2008045609A2
公开(公告)日：2008-04-17
申请号：PCT/US2007073644
申请日：2007-07-17
Applicant: GEN ELECTRIC , ZRIBI ANIS , SHIH MIN-YI , SONG GUIJU , ACHUTAN AJIT , CLAYDON GLENN SCOTT , KENNERLY STACEY JOY , KISHORE KUNA VENKAT SATYA RAMA , ZHENG JIANMING , HARDING KEVIN GEORGE , XIA HUA
Inventor： ZRIBI ANIS , SHIH MIN-YI , SONG GUIJU , ACHUTAN AJIT , CLAYDON GLENN SCOTT , KENNERLY STACEY JOY , KISHORE KUNA VENKAT SATYA RAMA , ZHENG JIANMING , HARDING KEVIN GEORGE , XIA HUA
CPC classification number: G01D5/35303 , G01D5/268 , G01N17/008 , G01N21/45 , G01N21/8422 , G01N2021/458 , G01N2021/9546
Abstract: A interferometer-based fouling detection system and method are described. The system may include a fiber optic cable, a light source in communication with the fiber optic cable, at least one photo detector in communication with the fiber optic cable, and at least one interferometric spectrometer. The fiber optic cable may include a long period grating and a fiber Bragg grating or it may include a facet edge. The system may instead include a fiber optic cable, a light source in communication with the fiber optic cable, at least one photo detector in communication with the fiber optic cable, a fiber coupler, a reference probe including a mirror, a sample probe, and an interferometer.
Abstract translation: 描述了基于干涉仪的结垢检测系统和方法。 该系统可以包括光纤电缆，与光纤电缆通信的光源，与光纤电缆通信的至少一个光电检测器，以及至少一个干涉光谱仪。 光纤电缆可以包括长周期光栅和光纤布拉格光栅，或者它可以包括小面边缘。 该系统可以替代地包括光纤电缆，与光纤电缆通信的光源，与光纤电缆通信的至少一个光电检测器，光纤耦合器，包括镜子的参考探针，样本探针和 干涉仪。
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公开(公告)号：WO2004038468A3
公开(公告)日：2004-06-17
申请号：PCT/US0333279
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , GORCZYCA THOMAS BERT , KAPUSTA CHRISTOPHER JAMES , BALCH ERNEST WAYNE , CLAYDON GLENN SCOTT , DASGUPTA SAHMITA , DELGADO ELADIO CLEMENTE
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/12004 , G02B6/1221 , G02B6/138 , G02B6/42 , H01L2224/04105 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2924/15153 , H01L2924/15192
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate activeside up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
Abstract translation: 一种光电子封装通过包括以下步骤的方法制造：将光学器件定位在衬底有源面的窗口内上和下顶部衬底表面; 用光学聚合物材料填充窗口; 平坦化光学聚合物材料和基底的表面; 在所述光学聚合物材料和所述衬底上形成波导材料以形成光学互连路径并且形成反射镜以将来自所述光学器件的光反射到所述互连路径; 以及形成通孔以暴露光学器件的接合焊盘。
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公开(公告)号：SG11201704153RA
公开(公告)日：2017-06-29
申请号：SG11201704153R
申请日：2015-10-26
Applicant: GEN ELECTRIC
Inventor： LEE YONGJAE , AIMI MARCO FRANCESCO , CLAYDON GLENN SCOTT , KEIMEL CHRISTOPHER FRED
Abstract: An ohmic RF MEMS relay includes a substrate with a capacitive coupling, Csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, Cgap; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements. Also, an ohmic RF MEMS relay that includes an input port; a plurality of first MEMS switches that make up a first switching group in electrical communication with the input port, thereby defining a plurality of channels each leading from each of the MEMS switches; and at least one outlet port along each of the channels distal from the first switching group and in electrical communication with the input port.
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公开(公告)号：AT374952T
公开(公告)日：2007-10-15
申请号：AT05253492
申请日：2005-06-07
Applicant: GEN ELECTRIC
Inventor： BERKCAN ERTUGRUL , KAPUSTA CHRISTOPHER JAMES , CLAYDON GLENN SCOTT , ZRIBI ANIS , MEYER LAURA JEAN , TIAN WEI-CHENG
IPC: G01R33/028 , G01R15/20
Abstract: A micro-electromechanical system, MEMS, current sensor is described as including a first conductor, a magnetic field shaping component (5) for shaping a magnetic field (20) produced by a current (I) in the first conductor, and a MEMS-based magnetic field sensing component (25) including a magneto-MEMS component (30) for sensing the shaped magnetic field and, in response thereto, providing an indication (80) of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.
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公开(公告)号：CA2968353A1
公开(公告)日：2016-06-09
申请号：CA2968353
申请日：2015-10-26
Applicant: GEN ELECTRIC
Inventor： LEE YONGJAE , AIMI MARCO FRANCESCO , CLAYDON GLENN SCOTT , KEIMEL CHRISTOPHER FRED
Abstract: An ohmic RF MEMS relay includes a substrate with a capacitive coupling, Csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, Cgap; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements. Also, an ohmic RF MEMS relay that includes an input port; a plurality of first MEMS switches that make up a first switching group in electrical communication with the input port, thereby defining a plurality of channels each leading from each of the MEMS switches; and at least one outlet port along each of the channels distal from the first switching group and in electrical communication with the input port.
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Patent Agency Ranking
公开(公告)号：AU2003284300A8
公开(公告)日：2004-05-13
申请号：AU2003284300
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , BALCH ERNEST WAYNE , DASGUPTA SAHMITA , GORCZYCA THOMAS BERT , DELGADO ELADIO CLEMENTE , KAPUSTA CHRISTOPHER JAMES , CLAYDON GLENN SCOTT
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
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公开(公告)号：CA2511674C
公开(公告)日：2013-01-22
申请号：CA2511674
申请日：2003-12-05
Applicant: GEN ELECTRIC
Inventor： CLAYDON GLENN SCOTT , NIELSEN MATTHEW CHRISTIAN , DASGUPTA SAMHITA , FILKINS ROBERT JOHN , FORMAN GLENN ALAN
Abstract: A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip interconnection by microwave electrical, optical guided and unguided waves, and power or bias electrical contacts or interfaces by a novel chip in flexible circuit, rigid or inflexible embodiments.
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公开(公告)号：DE60321702D1
公开(公告)日：2008-07-31
申请号：DE60321702
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , GORCZYCA THOMAS BERT , KAPUSTA CHRISTOPHER JAMES , BALCH ERNEST WAYNE , CLAYDON GLENN SCOTT , DASGUPTA SAHMITA , DELGADO ELADIO CLEMENTE
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
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公开(公告)号：DE602005002683D1
公开(公告)日：2007-11-15
申请号：DE602005002683
申请日：2005-06-07
Applicant: GEN ELECTRIC
Inventor： BERKCAN ERTUGRUL , KAPUSTA CHRISTOPHER JAMES , CLAYDON GLENN SCOTT , ZRIBI ANIS , MEYER LAURA JEAN , TIAN WEI-CHENG
IPC: G01R33/028 , G01R15/20
Abstract: A micro-electromechanical system, MEMS, current sensor is described as including a first conductor, a magnetic field shaping component (5) for shaping a magnetic field (20) produced by a current (I) in the first conductor, and a MEMS-based magnetic field sensing component (25) including a magneto-MEMS component (30) for sensing the shaped magnetic field and, in response thereto, providing an indication (80) of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.
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公开(公告)号：AU2003284300A1
公开(公告)日：2004-05-13
申请号：AU2003284300
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , GORCZYCA THOMAS BERT , KAPUSTA CHRISTOPHER JAMES , BALCH ERNEST WAYNE , CLAYDON GLENN SCOTT , DASGUPTA SAHMITA , DELGADO ELADIO CLEMENTE
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
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