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公开(公告)号:WO2008111999A3
公开(公告)日:2009-02-12
申请号:PCT/US2007074786
申请日:2007-07-31
Applicant: GEN ELECTRIC , FOUST DONALD FRANKLIN , TURNER LARRY GENE , BALCH ERNEST WAYNE , POON HAK FEI , NEALON WILLIAM FRANCIS , LIU JIE , FAIRCLOTH TAMI JANENE
Inventor: FOUST DONALD FRANKLIN , TURNER LARRY GENE , BALCH ERNEST WAYNE , POON HAK FEI , NEALON WILLIAM FRANCIS , LIU JIE , FAIRCLOTH TAMI JANENE
IPC: H01L51/52
CPC classification number: H01L51/5203 , H01L27/3204 , H01L51/56 , H01L2251/5361
Abstract: Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.
Abstract translation: 大面积照明系统及其制作方法。 更具体地,提供了相对于另一个串联耦合的有机发光模块(例如有机发光二极管模块)的组。 每个有机发光模块的模块阴极电耦合到互连区域中的相邻发光模块的阳极。 每个模块的阴极的一部分在互连区域附近邻近相邻模块的有源区域延伸。 还提供了使用连续材料层制造串联组的有机发光模块的方法。
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公开(公告)号:WO2004038468A3
公开(公告)日:2004-06-17
申请号:PCT/US0333279
申请日:2003-10-20
Applicant: GEN ELECTRIC
Inventor: SAIA RICHARD JOSEPH , GORCZYCA THOMAS BERT , KAPUSTA CHRISTOPHER JAMES , BALCH ERNEST WAYNE , CLAYDON GLENN SCOTT , DASGUPTA SAHMITA , DELGADO ELADIO CLEMENTE
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/12004 , G02B6/1221 , G02B6/138 , G02B6/42 , H01L2224/04105 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2924/15153 , H01L2924/15192
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate activeside up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
Abstract translation: 一种光电子封装通过包括以下步骤的方法制造:将光学器件定位在衬底有源面的窗口内上和下顶部衬底表面; 用光学聚合物材料填充窗口; 平坦化光学聚合物材料和基底的表面; 在所述光学聚合物材料和所述衬底上形成波导材料以形成光学互连路径并且形成反射镜以将来自所述光学器件的光反射到所述互连路径; 以及形成通孔以暴露光学器件的接合焊盘。
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公开(公告)号:CA2494307C
公开(公告)日:2012-02-07
申请号:CA2494307
申请日:2003-07-24
Applicant: GEN ELECTRIC
Inventor: BALCH ERNEST WAYNE , DOUGLAS LEONARD RICHARD , SHIH MIN-YI
Abstract: A method for adaptively fabricating a waveguide (30) comprises: measuring misplacement of a photonic device (31, 32, 34) relative to a substrate (20); generating computer readable instructions for using a plurality of graphics primitives (16) to form the waveguide; and photocomposing the waveguide on the substrate in accordance with the computer readable instructions. A reticle (14) comprises a plurality of graphics primitives with at least one of the plurality of graphics primitives comprising a tapered end. A waveguide (30) comprises a plurality of waveguide segments (22) with each of the plurality of waveguide segments comprising a tapered end and being adjacent to at least one other of the plurality of waveguide segments.
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公开(公告)号:CA2570880A1
公开(公告)日:2007-06-09
申请号:CA2570880
申请日:2006-12-08
Applicant: GEN ELECTRIC
Inventor: DUROCHER KEVIN MATTHEW , KAPUSTA CHRISTOPHER JAMES , GOODWIN STACEY JOY , BALCH ERNEST WAYNE
Abstract: METHOD OF MAKING AN ELECTRONIC DEVICE COOLING SYSTEM A method of making an electronic device cooling system includes forming a thermally conductive layer (88) on an inner surface of the substrate (12) an d laser ablating the thermally conductive layer (88) to form microchannels.
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公开(公告)号:AU2003284300A8
公开(公告)日:2004-05-13
申请号:AU2003284300
申请日:2003-10-20
Applicant: GEN ELECTRIC
Inventor: SAIA RICHARD JOSEPH , BALCH ERNEST WAYNE , DASGUPTA SAHMITA , GORCZYCA THOMAS BERT , DELGADO ELADIO CLEMENTE , KAPUSTA CHRISTOPHER JAMES , CLAYDON GLENN SCOTT
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
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公开(公告)号:GB2392023A
公开(公告)日:2004-02-18
申请号:GB0312855
申请日:2003-06-04
Applicant: GEN ELECTRIC
Inventor: FOUST DONALD FRANKLIN , BALCH ERNEST WAYNE , DUGGAL ANIL RAJ , HELLER CHRISTIAN MARIA ANTON , GUIDA RENATO , NEALON WILLIAM FRANCIS , FAIRCLOTH TAMI JANENE
Abstract: A light emitting device comprises a plurality of organic light emitting diode (OLED) modules (38). The OLED modules (38) are arranged into a series group (36) where the individual OLED modules (38) are electrically connected in series. The device (10) is configured to be coupled to a power supply (32). A display (60) is also provided. The display (60) includes a plurality of OLED modules (38) arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.
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公开(公告)号:CA2570847A1
公开(公告)日:2007-06-09
申请号:CA2570847
申请日:2006-12-08
Applicant: GEN ELECTRIC
Inventor: BALCH ERNEST WAYNE , DUROCHER KEVIN MATTHEW , GOODWIN STACEY JOY , KAPUSTA CHRISTOPHER JAMES
IPC: C25D5/00 , C23C14/34 , H01L23/473 , H05K7/20
Abstract: METHOD OF MAKING AN ELECTRONIC DEVICE COOLING SYSTEM A method is provided. The method includes forming a conductive layer on an inner surface of a substrate (12) and providing a sacrificial layer (36) over the conductive layer. The method includes forming a plurality of channels in the sacrificia l layer (36) and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer (36) to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer (36) is etched.
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公开(公告)号:CA2713699A1
公开(公告)日:2009-08-20
申请号:CA2713699
申请日:2009-01-23
Applicant: GEN ELECTRIC
Inventor: SINGH PRABHJOT , LEE MARTIN KIN-FEI , BREWER JAMES ANTHONY , MEYER PAUL ALOYSIUS , BATZINGER THOMAS JAMES , VENKATARAMANI VENKAT SUBRAMANIAM , BARSHINGER JAMES NORMAN , BALCH ERNEST WAYNE
Abstract: A method for fabricating an ultrasound transducer structure is disclosed. The method includes performing the steps of forming a functional layer, including an ultrasound transducer material and a photopolymer, and exposing a plurality of selected regions of the functional layer to a programmable light pattern to cure the selected regions of the functional layer to form polymerized ultrasound transducer material regions, repeatedly. The method further includes selectively removing unexposed regions of the functional layer to obtain a green component, and sintering the green component to obtain the sensing structure. A system for making at least one piezoelectric element is also disclosed.
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公开(公告)号:AU2003259224A1
公开(公告)日:2004-02-16
申请号:AU2003259224
申请日:2003-07-24
Applicant: GEN ELECTRIC
Inventor: BALCH ERNEST WAYNE , DOUGLAS LEONARD RICHARD , SHIH MIN-YI
Abstract: A method for adaptively fabricating a waveguide comprises: measuring misplacement of a photonic device relative to a substrate; generating computer readable instructions for using a plurality of graphics primitives to form the waveguide; and photocomposing the waveguide on the substrate in accordance with the computer readable instructions. A reticle comprises a plurality of graphics primitives with at least one of the plurality of graphics primitives comprising a tapered end. A waveguide comprises a plurality of waveguide segments with each of the plurality of waveguide segments comprising a tapered end and being adjacent to at least one other of the plurality of waveguide segments.
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公开(公告)号:DE69320908D1
公开(公告)日:1998-10-15
申请号:DE69320908
申请日:1993-10-06
Applicant: GEN ELECTRIC
Inventor: BALCH ERNEST WAYNE , WEAVER JR , KING WILLIAM HAROLD , GOROWITZ BERNARD
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