Abstract:
A interferometer-based fouling detection system and method are described. The system may include a fiber optic cable, a light source in communication with the fiber optic cable, at least one photo detector in communication with the fiber optic cable, and at least one interferometric spectrometer. The fiber optic cable may include a long period grating and a fiber Bragg grating or it may include a facet edge. The system may instead include a fiber optic cable, a light source in communication with the fiber optic cable, at least one photo detector in communication with the fiber optic cable, a fiber coupler, a reference probe including a mirror, a sample probe, and an interferometer.
Abstract:
A micro electro-mechanical system switch having an electrical pathway is presented. The switch includes a first portion and a second portion. The second portion is offset to a zero overlap position with respect to the first portion when the switch is in open position (or in the closed position depending on the switch architecture). The switch further includes an actuator for moving the first portion and the second portion into contact.
Abstract:
MEMS-based switching module (e.g., 12, 100), as may be electrically connected to other such modules (14, 16) in a series circuit, to achieve a desired voltage rating is provided. A switching array (10) may be made up of a plurality of such switching modules (e.g., used as building blocks of the switching array) with circuitry (100, 106, 108, 110) configured so that any number of modules can be connected in series to achieve the desired voltage rating (e.g., voltage scalability).
Abstract:
An electronically controlled grade crossing gate system (20) and method. The system includes a gate arm (12), a gate arm moving assembly (62), a position sensor assembly (92) and a controller (122). The gate arm moving assembly is configured to move the gate arm and the position sensor assembly is configured to sense a position of the gate arm. The position sensor assembly is a non-contact position sens or assembly. The controller is coupled to the gate arm moving assembly and the position sensor assembly and it is configured to receive an incoming command related to the gate arm. The controller activates the gate arm moving assemb ly in response to the incoming command and communicates with the position sensor assembly to monitor the position of the gate arm.
Abstract:
A semiconductor device (200) is provided and includes a substrate (202) comprising silicon carbide; a drift layer (214) disposed over the substrate and comprising a drift region (214) doped with a first (n-type) dopant type, so as to have a first conductivity type; and a second region (216) adjacent to the drift region and proximal to a surface (204) of the drift layer. The second region is doped with a second (p-type) dopant type, so as to have a second conductivity type. The semiconductor device further includes a junction termination extension (JTE) (220) disposed adjacent to the second (well) region. The JTE has a width Wjte and comprises a number of discrete regions (221) separated in a first direction and in a second direction and doped with varying concentrations of the second (p-type) dopant type, so as to have an effective doping profile of the second conductivity type of a functional form that generally decreases along a direction away from the edge of the primary blocking junction (230). The width wjte is less than or equal to a multiple of five times the width of the one- dimensional depletion width (Wdepi ID), and the charge tolerance of the semiconductor device is greater than 1.0 xl013 per cm2.
Abstract:
A semiconductor device (200) is provided and includes a substrate (202) comprising silicon carbide; a drift layer (214) disposed over the substrate and comprising a drift region (214) doped with a first (n-type) dopant type, so as to have a first conductivity type; and a second region (216) adjacent to the drift region and proximal to a surface (204) of the drift layer. The second region is doped with a second (p-type) dopant type, so as to have a second conductivity type. The semiconductor device further includes a junction termination extension (JTE) (220) disposed adjacent to the second (well) region. The JTE has a width Wjte and comprises a number of discrete regions (221) separated in a first direction and in a second direction and doped with varying concentrations of the second (p-type) dopant type, so as to have an effective doping profile of the second conductivity type of a functional form that generally decreases along a direction away from the edge of the primary blocking junction (230). The width wjte is less than or equal to a multiple of five times the width of the one- dimensional depletion width (Wdepi ID), and the charge tolerance of the semiconductor device is greater than 1.0 xl013 per cm2.
Abstract:
Se describe un dispositivo (10) de control de corriente. El dispositivo (10) de control de corriente incluye circuitería (72) de corriente arreglado en forma integrada con una trayectoria de corriente y por lo menos un par (21) de interruptor del sistema micro-electromécanico (MEMS) dispuesto en la trayectoria de corriente. El dispositivo (10) de control de corriente también incluye un circuito (14) de tecnología limitante sin arco híbrido (HALT) conectado en paralelo con por lo menos un par (21) de interruptor MEMS que facilita la apertura del por lo menos un par (21) de interruptores MEMS.
Abstract:
A MEMS switch (30, 50, 60, 70, 80) includes a substrate (32), a movable actuator (53, 63, 83) coupled to the substrate (32), a substrate contact (35 , 85), a substrate electrode (36, 56, 86), and a conductive stopper (39, 59, 69, 79) electrically coupled to the movable actuator (33, 63, 83) and structured to prevent the movable actuator (33, 63, 83) from contacting the substrate electrode (36, 56, 86) while allowing the movable actuator (33, 63, 83) to make contact with the substrat e contact (35, 85).