1.
    发明专利
    未知

    公开(公告)号:DE69819376T2

    公开(公告)日:2004-09-16

    申请号:DE69819376

    申请日:1998-01-27

    Abstract: To provide an electron tube having good airtightness and being appropriate for mass production, indium (23) affixed to the inner surface of a sealing metal support member (24) is provided between a side tube (10) and input faceplate (21). The input faceplate (21) is pushed against the side tube (10). As a result, the indium (23) is squeezed by a pressure receiving surface (70) provided on the end face of the side tube. Since the pressure receiving surface (70) is in a generally declining shape from the inside out, the force of the pressing surface (70) causes the indium (23) to flow outward toward the sealing metal support member (24). Therefore, the indium (23) is firmly affixed to the pressure receiving surface (70), and the side tube (10) and input faceplate (21) can be reliably sealed by the indium (23).

    2.
    发明专利
    未知

    公开(公告)号:DE69819376D1

    公开(公告)日:2003-12-11

    申请号:DE69819376

    申请日:1998-01-27

    Abstract: To provide an electron tube having good airtightness and being appropriate for mass production, indium (23) affixed to the inner surface of a sealing metal support member (24) is provided between a side tube (10) and input faceplate (21). The input faceplate (21) is pushed against the side tube (10). As a result, the indium (23) is squeezed by a pressure receiving surface (70) provided on the end face of the side tube. Since the pressure receiving surface (70) is in a generally declining shape from the inside out, the force of the pressing surface (70) causes the indium (23) to flow outward toward the sealing metal support member (24). Therefore, the indium (23) is firmly affixed to the pressure receiving surface (70), and the side tube (10) and input faceplate (21) can be reliably sealed by the indium (23).

    TRANSMISSION TYPE PHOTOELECTRIC SURFACE AND ITS MANUFACTURE

    公开(公告)号:JPH04324227A

    公开(公告)日:1992-11-13

    申请号:JP9222991

    申请日:1991-04-23

    Abstract: PURPOSE:To improve a transmission type photoelectric surface used in an image tube. CONSTITUTION:The interface between a window layer and a reflection preventive film has a very good optical characteristic, because very thin layers 8 and 41 are interposed between the window layer 4 of a group III-V compound semiconductor including Al and the reflection perventive film 5, and the layers 8 and 41 are made a group III-V compond semiconductor excluding Al or an Al oxide film in which oxygen is firmly bonded to Al. Moreover a wavelike pattern inherent in a liquid phase growth method can be eliminated by using a gaseous phase growth method in the manufacturing process of a transmission type photoelectric surface.

    MANUFACTURE OF SEMICONDUCTOR PHOTOELECTRIC SURFACE

    公开(公告)号:JPH09180633A

    公开(公告)日:1997-07-11

    申请号:JP33540895

    申请日:1995-12-22

    Abstract: PROBLEM TO BE SOLVED: To prevent an active layer from being removed during a manufacturing process by covering the side face of a stratified crystal with a protective material in advance before it is processed with a mixed enchant. SOLUTION: This semiconductor photoelectric surface is manufactured in processes (a)-(f). (a) An etching stop layer 4, an active layer 3 made of an Al- unincluded III-V group compound semiconductor, a window layer 2 made of an Al-included III-V group compound semiconductor, and the surface protective layer 1 of the window layer 2 are formed in sequence on an Al-unincluded III-V group compound semiconductor substrate 6 to form a stratified crystal. (b) The surface protective layer 1 is selectively removed from the stratified crystal, then a reflection preventing layer 8 and a glass layer 7 are formed in sequence on the exposed window layer 2. (c) A glass faceplate 9 is thermally fused to the glass layer 7, then the side end face of the stratified crystal is covered with a protective material 10a resistant to a mixed enchant of ammonia- hydrogenper oxide. (d) The substrate 6 is selectively removed by the mixture etchant to expose the stop layer 4. (e) The stop layer 4 is selectively removed. (f) The protective material 10a is removed.

    INVISIBLE LIGHT IMAGE DETECTOR DEVICE

    公开(公告)号:JPH0354870A

    公开(公告)日:1991-03-08

    申请号:JP19083489

    申请日:1989-07-24

    Abstract: PURPOSE:To effectively detect an invisible light image with high resolution by forming an invisible light to visible conversion structure on one end surface of a fiber plate, and disposing a visible photoelectric conversion imaging device on the opposite side surface of said fiber plate such that the input side of the imaging device makes close contact with said opposite side surface of said fiber plate. CONSTITUTION:Invisible light is converted to visible light by an infrared to visible conversion phosphor 24 formed on the end surface of a fiber plate 26, the visible light is converted to photoelectrons by a visible photoelectric conversion part 28 after passing through the plate 26, and the photoelectrons are in turn incident on a vacuum part 30. The photoelectrons are accelerated by high voltage applied between the conversion part 28 and an input surface of the microchannel plate 32 and are incident on a channel of the plate 32 located correspondingly. Secondary electrons are produced there, multiplied, and are incident on the vacuum part 3, and further accelerated and allowed to enter a visible phosphor 36 where they are converted to visible light and detected as an image. Hereby, an invisible light image can effectively be detected with high resolution.

    Photo cathode, manufacturing method thereof, and photomultiplier tube
    7.
    发明专利
    Photo cathode, manufacturing method thereof, and photomultiplier tube 有权
    照片阴影,其制造方法和光电管

    公开(公告)号:JP2010040384A

    公开(公告)日:2010-02-18

    申请号:JP2008203231

    申请日:2008-08-06

    Inventor: KIBUNE ATSUSHI

    Abstract: PROBLEM TO BE SOLVED: To provide a photo-electric cathode in which a plurality kinds of photo-electric surfaces are arranged without a gap, to provide a manufacturing method thereof, and to provide a photomultiplier having the photo-electric cathode. SOLUTION: The photo-electric cathode 20 has a glass piece 4 in which the photo-electric surface 3 is formed in the entire one face, the glass piece 7 in which the photoelectron surface 6 is formed in the entire one face and of which the thickness is equal to that of the glass piece 4, and a glass substrate 1 of which the size is larger than the added value of the size of the first glass piece 4 and the second glass piece 7. Moreover, the glass piece 4 and the glass piece 7 are mutually heat-sealed on respective side faces, and the photo-electric surface 3 and the photo-electric surface 6 are heat-sealed on the surface of the glass substrate 1 so as to face the surface side. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供其中多个光电表面没有间隙地布置的光电阴极,以提供其制造方法,并提供具有光电阴极的光电倍增管。 解决方案:光电阴极20具有玻璃片4,其中光电表面3形成在整个一面中,玻璃片7的光电子表面6形成在整个一个面中, 其厚度与玻璃片4的厚度相等,玻璃基板1的尺寸大于第一玻璃片4和第二玻璃片7的尺寸的附加值。此外,玻璃片 4和玻璃片7在相应的侧面上相互热密封,并且光电表面3和光电表面6被热密封在玻璃基板1的表面上以面对表面侧。 版权所有(C)2010,JPO&INPIT

    ELECTRONIC TUBE
    8.
    发明专利

    公开(公告)号:JPH10241623A

    公开(公告)日:1998-09-11

    申请号:JP3811397

    申请日:1997-02-21

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic tube which has good airtightness and is suitable for mass production. SOLUTION: In this electronic tube, indium 23 is arranged sticked to an inner circumferential surface of a metallic support body 24 for sealing, disposed between a side tube 10 and a input surface plate 21. When the input surface plate 21 is pressed against the side tube 10, the indium 23 is crushed by a metallic sealing crushing surface 70 provided on an end face of the side tube 10. At this time, because this metallic sealing crushing surface 70 has a shape which is cut down from inside to outside, the indium 23 is deformed, while escaping outside towards the metallic support body 24 for sealing. Accordingly, the indium 23 is steadily attached under pressure to the metallic sealing crushing surface 70, whereby sealing between the input surface plate 21, and the side tube 10 can be steadily conducted by the indium 23.

    Phosphor
    9.
    发明专利
    Phosphor 有权

    公开(公告)号:JP2009080124A

    公开(公告)日:2009-04-16

    申请号:JP2008283431

    申请日:2008-11-04

    Abstract: PROBLEM TO BE SOLVED: To provide a phosphor which emits fluorescence corresponding to incident electrons.
    SOLUTION: An electron beam detector is integrated with a compound semiconductor substrate and an optical detector by optically connecting the fluorescence emitting surface of the compound semiconductor with a light incident surface of the optical detector using a light guide, and physically connecting the compound semiconductor substrate and the optical detector. The incident electron ray is detected such that the compound semiconductor substrate converts the incident electrons to the fluorescence, the light guide transmits the fluorescence to the optical detector, and the optical detector detects the fluorescence. Therefore, the incident electron rays are detected.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供发射对应于入射电子的荧光体的荧光体。 解决方案:使用光导将电子束检测器与化合物半导体衬底和光学检测器集成在一起,通过光学连接化合物半导体的荧光发射表面与光学检测器的光入射表面,并将化合物 半导体衬底和光学检测器。 检测入射电子束,使得化合物半导体衬底将入射电子转换为荧光,光导将荧光传输到光学检测器,并且光学检测器检测荧光。 因此,检测入射的电子射线。 版权所有(C)2009,JPO&INPIT

    ELECTRON TUBE
    10.
    发明专利

    公开(公告)号:JPH10208689A

    公开(公告)日:1998-08-07

    申请号:JP1277197

    申请日:1997-01-27

    Abstract: PROBLEM TO BE SOLVED: To provide an electron tube having good airtightness and suitable for mass production. SOLUTION: In this electron tube 1, indium 23 stuck to the peripheral wall of the inner wall of a metal support 24 for sealing is interposed between a container 10 and an input face plate 21. The input face plate 21 is pressed against a container 21. Where, a first and a second protrusion parts 71, 72 formed at the end of the container 10 deform the indium 23. Indium 23 pushed out by deformation is pushed into a metal-housing recessed part 73 for sealing provided between the first protrusion part 71 and the second protrusion part 72. Therefore, deformation afforded to the indium 23 surely press-fits indium 23 to the wall faces of the first and the second protrusion part 71, 72 and simultaneously, securely press-fits indium 23 to the wall face of the metal-housing recessed part 73 for sealing as well. The indium 23 positively assures sealing between the input face plate 21 and the container 10.

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