Abstract:
To provide an electron tube having good airtightness and being appropriate for mass production, indium (23) affixed to the inner surface of a sealing metal support member (24) is provided between a side tube (10) and input faceplate (21). The input faceplate (21) is pushed against the side tube (10). As a result, the indium (23) is squeezed by a pressure receiving surface (70) provided on the end face of the side tube. Since the pressure receiving surface (70) is in a generally declining shape from the inside out, the force of the pressing surface (70) causes the indium (23) to flow outward toward the sealing metal support member (24). Therefore, the indium (23) is firmly affixed to the pressure receiving surface (70), and the side tube (10) and input faceplate (21) can be reliably sealed by the indium (23).
Abstract:
To provide an electron tube having good airtightness and being appropriate for mass production, indium (23) affixed to the inner surface of a sealing metal support member (24) is provided between a side tube (10) and input faceplate (21). The input faceplate (21) is pushed against the side tube (10). As a result, the indium (23) is squeezed by a pressure receiving surface (70) provided on the end face of the side tube. Since the pressure receiving surface (70) is in a generally declining shape from the inside out, the force of the pressing surface (70) causes the indium (23) to flow outward toward the sealing metal support member (24). Therefore, the indium (23) is firmly affixed to the pressure receiving surface (70), and the side tube (10) and input faceplate (21) can be reliably sealed by the indium (23).
Abstract:
PURPOSE:To improve a transmission type photoelectric surface used in an image tube. CONSTITUTION:The interface between a window layer and a reflection preventive film has a very good optical characteristic, because very thin layers 8 and 41 are interposed between the window layer 4 of a group III-V compound semiconductor including Al and the reflection perventive film 5, and the layers 8 and 41 are made a group III-V compond semiconductor excluding Al or an Al oxide film in which oxygen is firmly bonded to Al. Moreover a wavelike pattern inherent in a liquid phase growth method can be eliminated by using a gaseous phase growth method in the manufacturing process of a transmission type photoelectric surface.
Abstract:
PROBLEM TO BE SOLVED: To prevent an active layer from being removed during a manufacturing process by covering the side face of a stratified crystal with a protective material in advance before it is processed with a mixed enchant. SOLUTION: This semiconductor photoelectric surface is manufactured in processes (a)-(f). (a) An etching stop layer 4, an active layer 3 made of an Al- unincluded III-V group compound semiconductor, a window layer 2 made of an Al-included III-V group compound semiconductor, and the surface protective layer 1 of the window layer 2 are formed in sequence on an Al-unincluded III-V group compound semiconductor substrate 6 to form a stratified crystal. (b) The surface protective layer 1 is selectively removed from the stratified crystal, then a reflection preventing layer 8 and a glass layer 7 are formed in sequence on the exposed window layer 2. (c) A glass faceplate 9 is thermally fused to the glass layer 7, then the side end face of the stratified crystal is covered with a protective material 10a resistant to a mixed enchant of ammonia- hydrogenper oxide. (d) The substrate 6 is selectively removed by the mixture etchant to expose the stop layer 4. (e) The stop layer 4 is selectively removed. (f) The protective material 10a is removed.
Abstract:
PURPOSE:To effectively detect an invisible light image with high resolution by forming an invisible light to visible conversion structure on one end surface of a fiber plate, and disposing a visible photoelectric conversion imaging device on the opposite side surface of said fiber plate such that the input side of the imaging device makes close contact with said opposite side surface of said fiber plate. CONSTITUTION:Invisible light is converted to visible light by an infrared to visible conversion phosphor 24 formed on the end surface of a fiber plate 26, the visible light is converted to photoelectrons by a visible photoelectric conversion part 28 after passing through the plate 26, and the photoelectrons are in turn incident on a vacuum part 30. The photoelectrons are accelerated by high voltage applied between the conversion part 28 and an input surface of the microchannel plate 32 and are incident on a channel of the plate 32 located correspondingly. Secondary electrons are produced there, multiplied, and are incident on the vacuum part 3, and further accelerated and allowed to enter a visible phosphor 36 where they are converted to visible light and detected as an image. Hereby, an invisible light image can effectively be detected with high resolution.
Abstract:
PROBLEM TO BE SOLVED: To provide a photo-electric cathode in which a plurality kinds of photo-electric surfaces are arranged without a gap, to provide a manufacturing method thereof, and to provide a photomultiplier having the photo-electric cathode. SOLUTION: The photo-electric cathode 20 has a glass piece 4 in which the photo-electric surface 3 is formed in the entire one face, the glass piece 7 in which the photoelectron surface 6 is formed in the entire one face and of which the thickness is equal to that of the glass piece 4, and a glass substrate 1 of which the size is larger than the added value of the size of the first glass piece 4 and the second glass piece 7. Moreover, the glass piece 4 and the glass piece 7 are mutually heat-sealed on respective side faces, and the photo-electric surface 3 and the photo-electric surface 6 are heat-sealed on the surface of the glass substrate 1 so as to face the surface side. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic tube which has good airtightness and is suitable for mass production. SOLUTION: In this electronic tube, indium 23 is arranged sticked to an inner circumferential surface of a metallic support body 24 for sealing, disposed between a side tube 10 and a input surface plate 21. When the input surface plate 21 is pressed against the side tube 10, the indium 23 is crushed by a metallic sealing crushing surface 70 provided on an end face of the side tube 10. At this time, because this metallic sealing crushing surface 70 has a shape which is cut down from inside to outside, the indium 23 is deformed, while escaping outside towards the metallic support body 24 for sealing. Accordingly, the indium 23 is steadily attached under pressure to the metallic sealing crushing surface 70, whereby sealing between the input surface plate 21, and the side tube 10 can be steadily conducted by the indium 23.
Abstract:
PROBLEM TO BE SOLVED: To provide a phosphor which emits fluorescence corresponding to incident electrons. SOLUTION: An electron beam detector is integrated with a compound semiconductor substrate and an optical detector by optically connecting the fluorescence emitting surface of the compound semiconductor with a light incident surface of the optical detector using a light guide, and physically connecting the compound semiconductor substrate and the optical detector. The incident electron ray is detected such that the compound semiconductor substrate converts the incident electrons to the fluorescence, the light guide transmits the fluorescence to the optical detector, and the optical detector detects the fluorescence. Therefore, the incident electron rays are detected. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electron tube having good airtightness and suitable for mass production. SOLUTION: In this electron tube 1, indium 23 stuck to the peripheral wall of the inner wall of a metal support 24 for sealing is interposed between a container 10 and an input face plate 21. The input face plate 21 is pressed against a container 21. Where, a first and a second protrusion parts 71, 72 formed at the end of the container 10 deform the indium 23. Indium 23 pushed out by deformation is pushed into a metal-housing recessed part 73 for sealing provided between the first protrusion part 71 and the second protrusion part 72. Therefore, deformation afforded to the indium 23 surely press-fits indium 23 to the wall faces of the first and the second protrusion part 71, 72 and simultaneously, securely press-fits indium 23 to the wall face of the metal-housing recessed part 73 for sealing as well. The indium 23 positively assures sealing between the input face plate 21 and the container 10.